Cured product and production method of same, and resin sheet and resin composition
Cured products that are formed of a cured material obtained by curing a resin composition including (A) at least one epoxy resin, (B) at least one curing agent, and (C) at least one inorganic filler, and have a ground surface, in which the maximum depth of a depressed portion present on the ground surface is less than 10 μm are useful for making printed wiring boards.
1. A cured product formed of a cured material obtained by curing a resin composition, comprising:
(A) at least one epoxy resin;
(B) at least one curing agent; and
(C) at least one inorganic filler,
wherein the cured product has a ground surface,
a maximum depth of a depressed portion present on the ground surface is less than 10 μm,
the cured material has a dielectric loss tangent of 0.008 or less measured at 60 GHZ,
the cured material has a tensile modulus of elasticity of 5 Gpa or more and 20 Gpa or less at 25° C.
the (C) inorganic filler has been subjected to a surface treatment with an amino silane compound,
the (C) inorganic filler includes a hollow filler particle having a hollow portion formed inside thereof, and
the hollow portion of the hollow filler particle included in said component (C) has a maximum long diameter of less than 5 μm.
2. The cured product according to claim 1 , wherein said component (B) comprises a phenol-based curing agent or an acid anhydride-based curing agent.
3. The cured product according to claim 1 , wherein said component (C) has an average particle diameter of 0.5 μm to 20 μm.
4. The cured product according to claim 1 , wherein
the ground surface includes a filler surface part formed by grinding of said component (C), and
a depressed portion having a depth of less than 10 μm is formed on the filler surface part.
5. The cured product according to claim 1 , wherein the cured product is for formation of a rewiring layer on the ground surface.
6. The cured product according to claim 1 , wherein the cured product is included in a structural body in combination with a connection terminal portion having a surface portion that is flush with the ground surface, and the cured product is for formation of a rewiring layer on the ground surface.
7. The cured product according to claim 1 , wherein the cured product is for formation of a rewiring layer after a thin film layer is formed on the ground surface.
8. A method for producing the cured product according to claim 1 , said method comprising:
(a) forming a resin composition layer of the resin composition;
(b) curing the resin composition to obtain a cured product; and
(c) grinding the cured product.
9. The cured product according to claim 1 , wherein the resin composition further comprises an (E) organic filler.
10. The cured product according to claim 1 , wherein the (C) inorganic filler further comprises alumina.
11. The cured product according to claim 1 , wherein the (A) epoxy resin comprises a combination of a liquid epoxy resin and a solid epoxy resin.
12. A resin sheet, comprising a support and a resin composition layer comprising a resin composition, said resin composition layer being provided on the support, wherein
said resin composition comprises:
(A) at least one epoxy resin;
(B) at least one curing agent; and
(C) at least one inorganic filler,
wherein
when said resin composition is cured at 180° C. for 1 hour, and then ground to form a ground surface having an arithmetic average roughness of 500 nm or less, a maximum depth of a depressed portion present on the ground surface is less than 10 μm,
when said resin composition is cured at 180° C. for 90 minutes to obtain a cured material, the cured material has a dielectric loss tangent of 0.008 or less measured at 60 GHZ,
the cured material has a tensile modulus of elasticity of 5 Gpa or more and 20 Gpa or less at 25° C., and
the (C) inorganic filler has been subjected to a surface treatment with an amino silane compound.
13. A resin composition, comprising:
(A) at least one epoxy resin;
(B) at least one curing agent; and
(C) at least one inorganic filler,
wherein said resin composition is a liquid resin composition,
wherein
when the resin composition is cured at 180° C. for 1 hour, and then ground to form a ground surface having an arithmetic average roughness of 500 nm or less, a maximum depth of a depressed portion present on the ground surface is less than 10 μm,
when said resin composition is cured at 180° C. for 90 minutes to obtain a cured material, the cured material has a dielectric loss tangent of 0.008 or less measured at 60 GHz,
the cured material has a tensile modulus of elasticity of 5 Gpa or more and 20 Gpa or less at 25° C., and
the (C) inorganic filler has been subjected to a surface treatment with an amino silane compound.
14. A resin composition for obtaining a cured product having a ground surface to form a rewiring layer thereon, wherein
the resin composition comprises:
(A) at least one epoxy resin;
(B) at least one curing agent; and
(C) at least one inorganic filler,
wherein
an average particle diameter of said component (C) is 0.5 μm to 20 μm,
said component (C) is treated with an amino silane compound,
said component (C) includes a hollow filler particle having a hollow portion formed inside thereof,
the hollow portion of the hollow filler particle included in said component (C) has a maximum long diameter of less than 5 μm,
when said resin composition is cured at 180° C. for 90 minutes to obtain a cured material, the cured material has a dielectric loss tangent of 0.008 or less measured at 60 GHZ, and
the cured material has a tensile modulus of elasticity of 5 Gpa or more and 20 Gpa or less at 25° C.
15. A cured product formed of a cured material obtained by curing a resin composition, comprising:
(A) at least one epoxy resin;
(B) at least one curing agent; and
(C) at least one inorganic filler,
wherein the cured product has a ground surface,
a maximum depth of a depressed portion present on the ground surface is less than 10 μm,
the cured material has a dielectric loss tangent of 0.008 or less measured at 60 GHZ,
the cured material has a tensile modulus of elasticity of 5 Gpa or more and 20 Gpa or less at 25° C.
the (C) inorganic filler has been subjected to a surface treatment with an amino silane compound, and
the cured product is included in a structural body in combination with a connection terminal portion having a surface portion that is flush with the ground surface, and the cured product is for formation of a rewiring layer on the ground surface.