High throughput polishing modules and modular polishing systems
Embodiments herein include high throughput density chemical mechanical polishing (CMP) modules and customizable modular CMP systems formed thereof. In one embodiment, a polishing module features a carrier support module, a carrier loading station, and a polishing station. The carrier support module features a carrier platform and one or more carrier assemblies. The one or more carrier assemblies each comprise a corresponding carrier head suspended from the carrier platform. The carrier loading station is used to transfer substrates to and from the carrier heads. The polishing station comprises a polishing platen. The carrier support module, the substrate loading station, and the polishing station comprise a one-to-one-to-one relationship within each of the polishing modules. The carrier support module is positioned to move the one or more carrier assemblies between a substrate polishing position disposed above the polishing platen and a substrate transfer position disposed above the substrate loading station.
1. A polishing module, comprising:
a first modular frame defining a first polishing processing region;
a second modular frame defining a second polishing processing region, the second modular frame directly adjacent the first modular frame positioned in a side-by-side arrangement;
a third modular frame defining a third polishing processing region;
a fourth modular frame defining a fourth polishing processing region, the third modular frame directly adjacent the fourth modular frame and positioned together in a side-by-side arrangement, and the third module frame and the fourth modular frame are positioned end-to-end with the first modular frame and the second modular frame;
a polishing station disposed in each of the first polishing processing region, the second polishing processing region, the third polishing processing region and the fourth polishing processing region, the polishing station comprising a polishing platen, wherein the polishing platen is rotatable about a platen axis;
a carrier loading station disposed in each of the first polishing processing region, the second polishing processing region, the third polishing processing region and the fourth polishing processing region;
a substrate handler disposed between each polishing processing region and adjacent each carrier loading station;
a substrate transfer station disposed between the polishing stations of the first and the second polishing processing regions, wherein the substrate handler is configured to transfer substrates between each carrier loading station and the substrate transfer station; and
a carrier support module disposed in each of the first polishing processing region, the second polishing processing region, the third polishing processing region and the fourth polishing processing region, each carrier support module suspended from the first modular frame, the second modular frame, the third modular frame and the fourth modular frame, and each carrier support module comprising a carrier platform comprising a first substrate carrier assembly and a second substrate carrier assembly, wherein:
the carrier platform is rotatable or pivotable about a platform axis by a platform actuator configured to rotate the first and second substrate carrier assemblies between either a first processing mode position or a second processing mode position,
the platform actuator is configured to rotate the carrier platform, the first carrier assembly and the second carrier assembly together, and
each of the first carrier assembly and the second carrier assembly comprise:
a carrier head coupled to a carrier shaft, wherein the carrier head comprises a chamber,
a rotation actuator coupled to the carrier shaft, and configured to rotate the carrier shaft and the carrier head,
a translation actuator, and
a pneumatic assembly that is in fluid communication with the chamber disposed within the carrier head,
wherein
the translation actuator is configured to cause the carrier head, the carrier shaft and the rotational actuator to translate in a first direction that extends perpendicular from the platform axis, and
the pneumatic assembly is fluidly coupled to the carrier head, and
in the first processing mode position the first substrate carrier assembly is positioned over the carrier loading station to allow for substrate loading and unloading thereinto and therefrom, and the second substrate carrier assembly is concurrently positioned over the polishing platen to allow for substrate polishing thereon, and
in the second processing mode position the second substrate carrier assembly is positioned over the carrier loading station to allow for substrate loading and unloading thereinto, and the first substrate carrier assembly is concurrently positioned over the polishing platen to allow for substrate polishing thereon.
2. The polishing module of claim 1 , further comprising a plurality of panels vertically disposed between adjacent corners of the modular frame to enclose and isolate the first polishing processing region and to enclose and isolate the second polishing processing region, and wherein the one or more of the panels have a slit shaped opening formed therethrough to allow for substrate transfer into and out of the first or second polishing processing region.
3. The polishing module of claim 1 , wherein the platform axis and the platen axis are spaced apart by a first distance, and wherein the first distance between the platform axis and the platen axis is not more than 1.25 times a swing radius of the carrier head.
4. The polishing module of claim 3 , wherein the first and second substrate carriers are suspended from the carrier platform using corresponding carrier shafts of the first and second carrier assemblies, and wherein the respective first and second translation actuators of the of the first and second carrier assemblies are coupled to the corresponding carrier shafts and are configured to oscillate the corresponding carrier shafts between first positions with respect to the platform axis and second positions disposed radially outward from the first positions.
5. The polishing module of claim 4 , wherein the swing radius of the first and second substrate carriers is determined when each of the carrier shafts of the first and second carrier assemblies are disposed in the first positions.
6. The polishing module of claim 1 , wherein the carrier loading station comprises a metrology station, a substrate edge correction station, or a combination thereof.
7. The polishing module of claim 1 , wherein at least one of the first or second modular frames comprises an overhead support, and wherein the the substrate handler is suspended from the overhead support.
8. The polishing module of claim 1 , further comprising a polishing pad disposed on the polishing platen within at least the first polishing processing region or the second polishing processing region, and further comprising a controller configured to perform a method comprising:
retracting the first substrate carrier assembly towards the platform axis before the carrier platform is rotated to the second processing mode position;
urging a first substrate against the polishing pad disposed on the polishing platen, wherein the first substrate is disposed in a carrier head of the first substrate carrier assembly; and
concurrently with urging the first substrate against the polishing pad:
unloading, using the carrier loading station, an at-least-partially-polished substrate from the second substrate carrier assembly; and
loading, using the carrier loading station, a to-be-polished second substrate into a carrier head of the second substrate carrier assembly.
9. The polishing module of claim 8 , wherein the controller is configured to cause the polishing module to perform a method comprising:
rotating or pivoting the carrier platform about the platform axis to position the second substrate carrier assembly above the polishing platen, wherein rotating or pivoting the carrier platform comprises retracting the second substrate carrier assembly towards the platform axis;
urging the second substrate against the polishing pad; and
concurrently with urging the second substrate against the polishing pad:
unloading, using the carrier loading station, the first substrate from the first substrate carrier; and
loading, using the carrier loading station, a to-be-polished third substrate into the first substrate carrier.
10. The polishing module of claim 1 , wherein the pneumatic assembly is stationary relative to the carrier platform.
11. The polishing module of claim 1 , wherein
the carrier loading station comprises a loading station central axis, and
the loading station central axis, the platform axis, the platen axis and the first direction are positioned within a first vertical plane formed within the first modular frame when the first substrate carrier assembly and the second substrate carrier assembly within the first modular frame are positioned in the first processing mode position or the second processing mode position.
12. The polishing module of claim 11 , wherein
the first vertical plane is parallel to a second vertical plane, wherein the loading station central axis, the platform axis, the platen axis and first direction within the second modular frame are positioned within the second vertical plane formed within the second modular frame when the first substrate carrier assembly and the second substrate carrier assembly within the second modular frame are positioned in the first processing mode position or the second processing mode position.
13. The polishing module of claim 11 , wherein the carrier loading station further comprises a buffing station.
14. The polishing module of claim 1 , wherein the translation actuator, and the pneumatic assembly are each coupled to the carrier platform.
15. The polishing module of claim 1 , wherein the translation actuator, rotation actuator and the pneumatic assembly are enclosed within a region defined by the carrier platform and a housing.
16. The polishing module of claim 1 , wherein the pneumatic assembly in the first carrier assembly and the second carrier assembly is in fluid communication with the carrier head, in their respective carrier assembly, through one or more conduits disposed through the carrier shaft.
17. The polishing module of claim 16 , wherein the pneumatic assembly in each of the carrier assemblies is fluidly coupled to their respective carrier head using a rotary union.
18. The polishing module of claim 1 , further comprising a computer readable medium having instructions stored therein, which when executed by a processor causes:
the carrier heads to retract towards the platform axis before the carrier platform is rotated to the first processing mode position or the second processing mode position.
19. The polishing module of claim 1 , wherein the substrate handler is suspended from a shared overhead support comprising a portion of the first modular frame and the second modular frame or the third modular frame and the fourth modular frame.
20. The polishing module of claim 1 , wherein the carrier loading station further comprises a buffing station.