IP Library Granted Patent US 11,158,374
Granted Patent B2
US 11,158,374 · App. 16/930,777 · Granted Oct 26, 2021

Temperature compensation for memory cells in an analog neural memory system used in a deep learning neural network

Inventors: Hieu Van Tran (San Jose, CA); Steven Lemke (Boulder Creek, CA); Nhan Do (Saratoga, CA); Vipin Tiwari (Dublin, CA); Mark Reiten (Alamo, CA)
Assignee: SILICON STORAGE TECHNOLOGY, INC.
G11C16/0425G06F17/16G06N3/0635G06N3/04G06N3/08
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Quick Facts
Patent No.
US 11,158,374
App. No.
16/930,777
Granted
Oct 26, 2021
Kind
B2
Abstract

Numerous embodiments are disclosed for providing temperature compensation in a an analog memory array. The analog memory array optionally is a vector-by-matrix multiplier in an analog neuromorphic memory system used in a deep learning neural network. One embodiment comprises measuring an operating temperature within a memory array and applying, by a temperature compensation block, a bias voltage to a terminal of a memory cell in the array, wherein the bias voltage is a function of the operating temperature.

Claims (28)

1. A method of compensating for temperature changes in an analog memory system comprising an array of memory cells, the method comprising:

measuring an operating temperature within the array of memory cells;

generating control bits, by a controller, in response to the operating temperature;

adjusting one or more of an adjustable current source and an adjustable resistor using the control bits; and

applying, by a temperature compensation block, a bias voltage to a terminal of a memory cell in the array of memory cells, wherein the bias voltage is generated by the one or more of the adjustable current source and the adjustable resistor.

2. The method of claim 1 , wherein the terminal is a word line terminal.

3. The method of claim 1 , wherein the terminal is a bit line terminal.

4. The method of claim 1 , wherein the terminal is a source line terminal.

5. The method of claim 1 , wherein the terminal is a control gate terminal.

6. The method of claim 1 , wherein the terminal is an erase gate terminal.

7. The method of claim 1 , wherein the memory cells in the array of memory cells are non-volatile memory cells.

8. The method of claim 7 , wherein the non-volatile memory cells are split-gate flash memory cells.

9. The method of claim 7 , wherein the non-volatile memory cells are stacked-gate flash memory cells.

10. The method of claim 1 , wherein the measuring step is performed by a temperature sensor.

11. A method of compensating for temperature changes in a vector-by-matrix multiplier system comprising an array of memory cells, the method comprising:

measuring an operating temperature within the vector-by-matrix multiplier system;

generating control bits, by a controller, in response to the operating temperature;

adjusting one or more of an adjustable current source and an adjustable resistor using the control bits; and

applying, by a temperature compensation block, a bias voltage to a terminal of a memory cell in the array of memory cells, wherein the bias voltage is generated by the one or more of the adjustable current source and the adjustable resistor.

12. The method of claim 11 , wherein the terminal is a word line terminal.

13. The method of claim 11 , wherein the terminal is a bit line terminal.

14. The method of claim 11 , wherein the terminal is a source line terminal.

15. The method of claim 11 , wherein the terminal is a control gate terminal.

16. The method of claim 11 , wherein the terminal is an erase gate terminal.

17. The method of claim 11 , wherein the memory cells in the array of memory cells are non-volatile memory cells.

18. The method of claim 17 , wherein the non-volatile memory cells are split-gate flash memory cells.

19. The method of claim 17 , wherein the non-volatile memory cells are stacked-gate flash memory cells.

20. The method of claim 11 , wherein the measuring step is performed by a temperature sensor.

Assignments (10)
RELEASE OF SECURITY INTEREST Recorded Mar 11, 2022
From: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 059363/0001 →
RELEASE OF SECURITY INTEREST Recorded Mar 10, 2022
From: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 059863/0400 →
RELEASE OF SECURITY INTEREST Recorded Mar 9, 2022
From: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 059357/0823 →
RELEASE OF SECURITY INTEREST Recorded Mar 9, 2022
From: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 059358/0335 →
RELEASE OF SECURITY INTEREST Recorded Feb 28, 2022
From: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 059264/0384 →
GRANT OF SECURITY INTEREST IN PATENT RIGHTS Recorded Nov 19, 2021
From: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
Reel/Frame 058214/0625 →
GRANT OF SECURITY INTEREST IN PATENT RIGHTS Recorded Nov 19, 2021
From: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 058214/0380 →
GRANT OF SECURITY INTEREST IN PATENT RIGHTS Recorded Nov 19, 2021
From: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
Reel/Frame 058214/0238 →
SECURITY INTEREST Recorded Jun 4, 2021
From: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
Reel/Frame 057935/0474 →
SECURITY INTEREST Recorded Dec 24, 2020
From: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS COLLATERAL AGENT
Reel/Frame 055671/0612 →
Continuity (3)
Continuation 16183250 · Nov 7, 2018
Provisional Application 62723398 · Aug 27, 2018
Related Publication 20200350015A1 · Nov 5, 2020