Granted Patent B2

US 12,552,661 · App. 17/057,994 · Granted Feb 17, 2026

Inventor: David Waterman (Oxford, GB)

Assignee: Oxford Nanopore Technologies PLC

B81B7/0022B01L3/5085C12Q1/6869G01N33/48721B01L2300/161B81B2201/05B81B2203/033B81B2203/04B81B2207/07

Abstract

Claims (21)

1 . A component configured to removably engage with a receiver, the component having:

a substrate comprising a plurality of wells;

a plurality of well electrodes, each one in a respective well of the plurality of wells;

a common electrode outside of the wells and common to each well of the plurality of wells,

wherein each well is configured to support a sensor including a membrane, wherein a membrane is formable across each well to separate fluid in the wells from a fluid outside of the wells, wherein the common electrode is configured to make electrical contact with a polar medium provided in each well of the plurality of wells; and

an array of pads comprising an electrically conductive material and configured to removably connect with a corresponding array of connectors on the receiver;

wherein each of the electrically conductive pads of the array is electrically connected via a respective via that passes through the substrate to a respective well electrode,

wherein the component further comprises a conductive structure configured across the array of electrically conductive pads, wherein the conductive structure is configured as a grid and extends in a planar direction, defined by the substrate, between the electrically conductive pads of the array, such that an electrical connection can be made between the array of electrically conductive pads and the array of connectors on the receiver, and to inhibit an electrostatic discharge conducting across the wells and/or direct an electrostatic discharge away from the wells through the conductive structure, wherein the conductive structure includes a common pad that is connected to the common electrode.

2 . The component according to claim 1 , wherein the conductive structure includes a common pad that is electrically connected to the common electrode.

3 . The component according to claim 1 , wherein the array of electrically conductive pads is arranged on the substrate and the conductive structure is mounted on the substrate.

4 . The component according to claim 3 , wherein the conductive structure extends from a plane defined by the array of electrically conductive pads.

5 . The component according to claim 3 , wherein at least part of the substrate extends from a region between the electrically conductive pads to form a wall and the conductive structure is configured on top of the wall.

6 . The component according to claim 3 , wherein the conductive structure is formed from the deposition of a conductive material in a region between the electrically conductive pads of the array.

7 . The component according to claim 1 , wherein the plurality of well electrodes is arranged in an array having a rectilinear pattern.

8 . The component according to claim 1 , wherein the footprint of each electrode is quadrilateral.

9 . The component according to claim 1 , wherein a pitch of the electrically conductive pads of the array is between 100 microns and 1500 microns.

10 . The component according to claim 1 , wherein the thickness of the walls of the conductive structure, in cross-section, is between 20 microns and 200 microns.

11 . The component according to claim 1 , wherein apertures of the conductive structure through which the connectors extend have rounded corners.

12 . The component according to claim 1 , wherein the electrically conductive pad array and the conductive structure are covered, at least in part, with a removable protective film or protective layer.

13 . A kit having the component according to claim 3 and the receiver, wherein each connector of the array of connectors on the receiver is configured to extend through the conductive structure without contacting the conductive structure to form an electrical connection with the corresponding electrically conductive pad of the array on the component.

14 . The kit according to claim 13 , wherein the conductive structure is connected to a conductive fluid above the wells to inhibit a potential difference occurring across the wells or membrane formed between the conductive fluid above the wells and the first fluid in the wells, such that when the conductive fluid is above the wells an electrostatic discharge is inhibited from conducting through the wells by the conductive structure.

Assignments (2)

Priority Claims (1)

Continuity (1)

References Cited (374)