Load lock fast pump vent
A semiconductor processing tool is disclosed, the tool having a frame forming at least one chamber with an opening and having a sealing surface around a periphery of the opening, a door configured to interact with the sealing surface for sealing the opening, the door having sides perpendicular to the door sealing surface and perpendicular to a transfer plane of a substrate, and at least one drive located on the frame to a side of at least one of the sides that are substantially perpendicular to the door sealing surface and substantially perpendicular to the transfer plane of the substrate, the drive having actuators located at least partially in front of the sealing surface and the actuators being coupled to one of the sides of the door for moving the door from a sealed position. The at least one drive is located outside of a substrate transfer zone.
1. An apparatus comprising:
a frame forming an isolatable chamber configured to hold at least one substrate, the isolatable chamber including chamber walls having inner and outer wall surfaces; and
at least one heating element integrally embedded within the chamber walls between the inner and outer wall surfaces and configured to heat the chamber walls;
wherein the chamber walls are configured such that a chamber wall surface area to isolatable chamber volume ratio is maximized effecting maximized heat transfer between the at least one heating element, via the chamber walls, and a gas within the isolatable chamber.
2. The apparatus of claim 1 , wherein the walls of the isolatable chamber are contoured to follow a path of a substrate through the isolatable chamber with minimized clearance between the substrate and the walls.
3. The apparatus of claim 1 , wherein the walls are further configured to maintain an initial gas temperature of a gas within the isolatable chamber during a pump down cycle such that a gas temperature decrease from adiabatic expansion during pump down remains above a predetermined point to minimize particle formation within the isolatable chamber.
4. The apparatus of claim 1 , further comprising a vacuum system configured to pump down the isolatable chamber.
5. The apparatus of claim 1 , further comprising at least one vent valve configured to maximize a volumetric flow of gas into the isolatable chamber where the volumetric flow of gas has a low uniform gas velocity to minimize particle formation during a venting cycle of the isolatable chamber.
6. The apparatus of claim 5 , wherein the isolatable chamber is configured such that a pump down cycle and the venting cycle occurs within a time for processing a substrate in a processing module connected to the isolatable chamber.
7. The apparatus of claim 1 , wherein an internal volume of the isolatable chamber is configured to minimize venting cycle times of the isolatable chamber.
8. The apparatus of claim 1 , further comprising a substrate processing apparatus located within the isolatable chamber.
9. The apparatus of claim 1 , further comprising a vent gas source configured to heat the gas to a predetermined temperature before introducing the gas into the isolatable chamber.
10. A method comprising:
providing a frame forming an isolatable chamber for holding at least one substrate, the isolatable chamber including chamber walls having inner and outer wall surfaces; and
effecting heating of the chamber walls with at least one heating element integrally embedded within the chamber walls between the inner and outer wall surfaces;
wherein the chamber walls are configured such that a chamber wall surface area to isolatable chamber volume ratio is maximized effecting maximized heat transfer between the at least one heating element, via the chamber walls, and a gas within the isolatable chamber.
11. The method of claim 10 , wherein the walls of the isolatable chamber are contoured to follow a path of a substrate through the isolatable chamber with minimized clearance between the substrate and the walls.
12. The method of claim 10 , further comprising maintaining an initial gas temperature of a gas within the isolatable chamber during a pump down cycle such that a gas temperature decrease from adiabatic expansion during pump down remains above a predetermined point to minimize particle formation within the isolatable chamber.
13. The method of claim 10 , further comprising pumping down, with a vacuum system, the isolatable chamber.
14. The method of claim 13 , further comprising venting, with at least one vent valve configured to maximize a volumetric flow of gas, the isolatable chamber, where the volumetric flow of gas has a low uniform gas velocity to minimize particle formation during a venting cycle of the isolatable chamber.
15. The method of claim 14 , wherein the isolatable chamber is configured such that the pump down cycle and venting cycle occurs within a time for processing a substrate in a processing module connected to the isolatable chamber.
16. The method of claim 14 , wherein an internal volume of the isolatable chamber is configured to minimize venting cycle times of the isolatable chamber.
17. The method of claim 10 , further comprising providing a substrate processing apparatus located within the isolatable chamber.
18. The method of claim 10 , further comprising providing a vent gas source configured to heat the gas to a predetermined temperature before introducing the gas into the isolatable chamber.