Microstructure enhanced absorption photosensitive devices
Lateral and vertical microstructure enhanced photodetectors and avalanche photodetectors are monolithically integrated with CMOS/BiCMOS ASICs and can also be integrated with laser devices using fluidic assembly techniques. Photodetectors can be configured in a vertical PIN arrangement or lateral metal-semiconductor-metal arrangement where electrodes are in an inter-digitated pattern. Microstructures, such as holes and protrusions, can improve quantum efficiency in silicon, germanium and III-V materials and can also reduce avalanche voltages for avalanche photodiodes. Applications include optical communications within and between datacenters, telecommunications, LIDAR, and free space data communication.
1. An integrated, single-chip structure of plural pixels, comprising:
plural photodetector pixels arranged in a matrix in said chip, where each of said pixels comprises;
an I-region of semiconductor material;
a single hole only, extending into said I-region from a surface thereof, wherein said surface hole is spaced along said surface from an outline surrounding said surface by at least 200 nm and the hole has a dimension no greater than 1,000 nm along said surface;
a first doped region of semiconductor material doped to a first polarity of doping and a second doped region of semiconductor material doped to a second polarity of doping;
wherein said I-region is undoped or doped less than said first and second regions and is between said first and second regions and in an operative relationship and electronically interacting therewith;
each of said pixels being configured to respond to light free of interaction with fixed charge material impinging on the pixel, including on said single hole thereof, to generate an electrical signal related to the impinging light; and
electrical conduits coupled with respective ones of said pixels to receive electrical signals generated by said pixels;
wherein the presence of said hole increases effective quantum efficiency (EQE) of the pixels relative to comparable structure without a hole.
2. The structure of claim 1 , in which said hole has a side wall and one of said first and second doped regions conformally lines said side wall.
3. The structure of claim 1 , in which said single hole for each of said pixels is shaped as an inverted pyramid that tapers as it extends onto said I-region.
4. The structure of claim 3 , in which the holes for different ones of said pixels differ in size.
5. The structure of claim 1 , in which said single hole for each of said pixels has an irregular shape.
6. An integrated structure of plural pixels arranged in a matrix, comprising:
an I-region of low-doped or undoped semiconductor material;
a first dope region of semiconductor material doped to a first polarity and a second doped region of semiconductor material doped to a second polarity;
wherein said I-region is between said first and second doped regions and in an operative relationship and interacting electrically therewith;
isolation trenches that extend at least partially into said semiconductor material to define said plural pixels arranged in a matrix;
wherein each of said pixels has a single hole that extends into the pixel from a surface thereof;
wherein said single hole has a closed contour along said surface and is spaced from an outline surrounding said surface by at least 200 nm and the hole has a dimension no greater than 1,000 nm along said surface;
each of said pixels is configured to respond to light impinging on the pixel, including on said single hole thereof, that has not passed through fixed charge material, to generate an electrical signal related to the impinging light; and
electrical conduits coupled with said pixels to receive electrical signals generated by respective ones of said pixels.
7. The integrated structure of claim 6 , in which said isolation trenches extend only partway into said semiconductor material.
8. The integrated structure of claim 6 , in which at least a portion of one of the first and second doped regions of semiconductor material extends over said hole.
9. The integrated structure of claim 6 , in which said hole is an inverted pyramid.
10. The integrated structure of claim 6 , in which one of the electrical conduits is coupled to one of the first and second doped regions of all the pixels in the matrix.
11. The integrated structure of claim 6 , in which said insulating trenches and at least a portion of said hole are mostly or completely filled with a solid dielectric.