Granted Patent B2

US 12,424,528 · App. 17/654,829 · Granted Sep 23, 2025

Inventors: Yoshihito Otsubo (Nagaokakyo, JP); Takahiro Kitazume (Nagaokakyo, JP)

Assignee: MURATA MANUFACTURING CO., LTD.

H01L23/49811H01L23/49838H01L23/552H01L25/16

Abstract

Claims (14)

1. A module comprising:

a substrate having a first surface;

a first component mounted on the first surface;

a first sealing resin covering the first surface and the first component;

a first conductor pattern disposed on a surface of the first sealing resin farther from the first surface; and

a plurality of connecting conductors each electrically interconnecting the first surface and the first conductor pattern,

wherein when viewed in a direction perpendicular to the first surface, the plurality of connecting conductors are disposed to surround the first component, and the first conductor pattern includes a plurality of tile-shaped portions disposed to cover a region overlapping the first component, and the plurality of connecting conductors,

wherein the first component is a single component, and

wherein each of the plurality of the tile shaped portions overlap the first component.

2. The module according to claim 1 , the substrate having a second surface opposite to the first surface, the module further comprising:

a second component mounted on the second surface; and

a second sealing resin covering the second surface and the second component.

3. The module according to claim 1 , wherein at least some of the plurality of tile-shaped portions are interconnected.

4. The module according to claim 1 , wherein the connecting conductor is any one of a wire, a pin, a metal block, and a plating film.

Assignments (1)

Priority Claims (1)

Continuity (2)

References Cited (48)