IP Library Granted Patent US 11,830,573
Granted Patent B2
US 11,830,573 · App. 17/705,039 · Granted Nov 28, 2023

Memory controller with staggered request signal output

Inventors: Ian P. Shaeffer (Los Gatos, CA); Bret Stott (Menlo Park, CA); Benedict C. Lau (San Jose, CA)
Assignee: Rambus Inc.
G11C7/1063G06F12/00G06F13/1689G11C7/1072
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Quick Facts
Patent No.
US 11,830,573
App. No.
17/705,039
Granted
Nov 28, 2023
Kind
B2
Abstract

A memory device includes a first receive circuit to receive a control signal of a memory access request from a memory controller. A second receive circuit receives a timing signal from the memory controller. The memory device includes circuitry to transmit, during a calibration mode of operation, feedback to the memory controller along a data path, the feedback indicative of a phase relationship been the control signal and the timing signal.

Claims (57)

1. An integrated circuit (IC) memory chip, comprising:

a clock receiver circuit to receive a clock signal;

a request signal interface to receive a memory access request using the clock signal, the memory access request including a chip select signal; and

circuitry to transmit, during a calibration mode, feedback to determine a phase offset between the chip select signal and the clock signal.

2. The IC memory chip according to claim 1 , wherein:

the circuitry to transmit includes a data driver to transmit the feedback along a data path from the IC memory chip to a logic IC chip during the calibration mode.

3. The IC memory chip according to claim 2 , wherein:

the request signal interface is to receive, during the calibration mode, a first calibration memory access request including a first calibration phase offset between calibration signals of the calibration memory access request; and

the feedback includes calibration read data associated with the calibration phase offset between the signals of the calibration memory access request.

4. The IC memory chip according to claim 3 , wherein:

the determined phase offset is based on a comparison of the calibration read data to known data.

5. The IC memory chip according to claim 1 , wherein the request signal interface includes:

a command receiver circuit to receive a command signal component of the memory access request from a command signal path;

an address receiver circuit to receive an address signal component of the memory access request from an address signal path; and

a control receiver circuit to receive the chip select signal as a control signal component of the memory access request from a control signal path that is separate from the command signal path and the address signal path.

6. The IC memory chip according to claim 1 , wherein the request signal interface includes:

a command/address receiver circuit to receive command and address signal components of the memory access request from a command/address signal path; and

a control receiver circuit to receive the chip select signal as a control signal component of the memory access request from a control signal path that is separate from the command/address signal path.

7. The IC memory chip according to claim 1 , wherein:

the determined phase offset is between the chip select signal and a command component signal of the memory access request as-launched from a logic IC chip.

8. An IC memory device, comprising:

receiver circuitry to receive a clock signal and a memory access request using the clock signal, the memory access request including a chip select signal; and

transmit circuitry to transmit, during a calibration mode, data used to determine a phase offset between component signals of the memory access request.

9. The IC memory device according to claim 8 , wherein:

the transmit circuitry includes a data driver to transmit the data along a data path from the memory device to a logic IC chip during the calibration mode.

10. The IC memory device according to claim 9 , wherein:

the receiver circuitry is to receive, during the calibration mode, a first calibration memory access request including a first calibration phase offset between calibration signals of the calibration memory access request; and

the data includes calibration read data associated with the calibration phase offset between the signals of the calibration memory access request.

11. The IC memory device according to claim 10 , wherein:

the determined phase offset is based on a comparison of the calibration read data to known data.

12. The IC memory device according to claim 8 , wherein the receiver circuitry further includes:

a command receiver circuit to receive a command signal component of the memory access request from a command signal path;

an address receiver circuit to receive an address signal component of the memory access request from an address signal path; and

a control receiver circuit to receive the chip select signal as a control signal component of the memory access request from a control signal path.

13. The IC memory device according to claim 8 , wherein the receiver circuitry further includes:

a command/address receiver circuit to receive command and address signal components of the memory access request from a command/address signal path; and

a control receiver circuit to receive the chip select signal as a control signal component of the memory access request from a control signal path that is separate from the command/address signal path.

14. The IC memory device according to claim 8 , wherein:

the determined phase offset is between the chip select signal and a command component signal of the memory access request as-launched from a logic IC chip.

15. A method of operation in an integrated circuit (IC) memory device, comprising:

receiving a clock signal;

receiving a memory access request using the clock signal, the memory access request including a chip select signal; and

transmitting, during a calibration mode, data to determine a phase offset between the chip select signal and the clock signal.

16. The method according to claim 15 , wherein:

the transmitting includes transmitting the data along a data path from the memory device to a logic IC chip during the calibration mode.

17. The method according to claim 16 , further comprising:

receiving, during the calibration mode, a first calibration memory access request including a first calibration phase offset between calibration signals of the calibration memory access request; and

wherein the data includes calibration read data associated with the calibration phase offset between the signals of the calibration memory access request.

18. The method according to claim 17 , wherein:

the determined phase offset is based on a comparison of the calibration read data to known data.

19. The method according to claim 15 , wherein the receiving of the memory access request includes:

receiving a command signal component of the memory access request from a command signal path;

receiving an address signal component of the memory access request from an address signal path; and

receiving the chip select signal as a control signal component of the memory access request from a control signal path.

20. The method according to claim 15 , wherein the receiving of the memory access request includes:

receiving command and address signal components of the memory access request from a command/address signal path; and

receiving the chip select signal as a control signal component of the memory access request from a control signal path that is separate from the command/address signal path.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 15, 2025
From: RAMBUS INC.
To: SIGNAL LLP
Reel/Frame 073085/0650 →
Continuity (12)
Continuation 16953207 · Nov 19, 2020
Continuation 16805529 · Feb 28, 2020
Continuation 16109607 · Aug 22, 2018
Continuation 15626097 · Jun 17, 2017
Continuation 14863366 · Sep 23, 2015
Continuation 14153822 · Jan 13, 2014
Continuation 13720720 · Dec 19, 2012
Continuation 13336851 · Dec 23, 2011
Continuation 12477703 · Jun 3, 2009
Continuation 11768107 · Jun 25, 2007
Division 11252957 · Oct 17, 2005
Related Publication 20220343956A1 · Oct 27, 2022
Cited By (1)
US 12,249,392