IP Library Granted Patent US 12,394,483
Granted Patent B2
US 12,394,483 · App. 17/746,068 · Granted Aug 19, 2025

Memory die management

Inventors: Abhijith Prakash (Milpitas, CA); Xiang Yang (Santa Clara, CA)
Assignee: Sandisk Technologies, Inc.
G11C16/0483G06F3/0604G06F3/0679
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Quick Facts
Patent No.
US 12,394,483
App. No.
17/746,068
Granted
Aug 19, 2025
Kind
B2
Abstract

Memory die management based on biasing voltages. Some memory dies are formed of memory holes having a semi-circular shape. This semi-circular shape results in a decrease in biasing voltage compared to memory holes having a circular shape. Systems and methods described herein organize memory dies into memory die groups according to their biasing voltages. During operation, data is relocated between the memory die groups based on how often the data is read. Data may be scrambled within their respective memory die groups to maintain appropriate storage space.

Claims (19)

1. A data storage device, comprising:

a memory interface configured to interface with a non-volatile memory, the non-volatile memory including a plurality of memory dies, each of the memory dies including a bias voltage value; and

an electronic processor configured to:

compare the bias voltage value of each of the memory dies to a voltage threshold,

assign memory dies having a bias voltage value greater than the voltage threshold to a first group of memory dies,

assign memory dies having a bias voltage value less than or equal to the voltage threshold to a second group of memory dies,

store data within a memory die of the plurality of memory dies,

determine a cumulative read occurrence of the data,

compare the cumulative read occurrence of the data to a read threshold,

classify, when the cumulative read occurrence is greater than or equal to the read threshold, the data as hot data, and

classify, when the cumulative read occurrence is less than the read threshold, the data as cold data.

2. The data storage device of claim 1 , wherein the plurality of memory dies form a multi-die package including a first set of memory dies from the first group of memory dies, and a second set of memory dies from the second group of memory dies.

3. The data storage device of claim 2 , wherein the multi-die package is formed by alternating stacking memory dies from the first set of memory dies and memory dies from the second set of memory dies.

4. The data storage device of claim 1 , wherein the electronic processor is further configured to:

relocate the hot data to the second group of memory dies, and

relocate the cold data to the first group of memory dies.

5. The data storage device of claim 1 , wherein the electronic processor is further configured to:

scramble the hot data within the second group of memory dies, and

scramble the cold data within the first group of memory dies.

Assignments (8)
PARTIAL RELEASE OF SECURITY INTERESTS Recorded Apr 25, 2025
From: JPMORGAN CHASE BANK, N.A., AS AGENT
To: SANDISK TECHNOLOGIES, INC.
Reel/Frame 071382/0001 →
SECURITY AGREEMENT Recorded Apr 25, 2025
From: SANDISK TECHNOLOGIES, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 071050/0001 →
PATENT COLLATERAL AGREEMENT Recorded Aug 23, 2024
From: SANDISK TECHNOLOGIES, INC.
To: JPMORGAN CHASE BANK, N.A., AS THE AGENT
Reel/Frame 068762/0494 →
CHANGE OF NAME Recorded Jun 27, 2024
From: SANDISK TECHNOLOGIES, INC.
To: SANDISK TECHNOLOGIES, INC.
Reel/Frame 067982/0032 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 29, 2024
From: WESTERN DIGITAL TECHNOLOGIES, INC.
To: SANDISK TECHNOLOGIES, INC.
Reel/Frame 067567/0682 →
PATENT COLLATERAL AGREEMENT - DDTL LOAN AGREEMENT Recorded Aug 21, 2023
From: WESTERN DIGITAL TECHNOLOGIES, INC.
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 067045/0156 →
PATENT COLLATERAL AGREEMENT - A&R LOAN AGREEMENT Recorded Aug 21, 2023
From: WESTERN DIGITAL TECHNOLOGIES, INC.
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 064715/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 17, 2022
From: PRAKASH, ABHIJITH; YANG, XIANG
To: WESTERN DIGITAL TECHNOLOGIES, INC.
Reel/Frame 059929/0995 →
Continuity (1)
Related Publication 20230409230A1 · Dec 21, 2023
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