IP Library › Granted Patent US 12,535,839
Granted Patent B2
US 12,535,839 · App. 17/819,902 · Granted Jan 27, 2026

Component communications in system-in-package systems

Inventors: Kevin Michael Troy (College Station, TX); Peter Robert Linder (Sugar Land, TX)
Assignee: Octavo Systems LLC
G05F1/46G01F1/28G01R31/2896G06F1/26G06F1/263G06F15/7807G01N2201/12
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Quick Facts
Patent No.
US 12,535,839
App. No.
17/819,902
Granted
Jan 27, 2026
Kind
B2
Abstract

A power management device and microprocessor within a System-in-Package (SiP) are provided with communication signals externally available as outputs from the SiP so that they can be reconfigured by an external device. Methods for the configuration of SiPs and Power Management Integrated Circuits (PMICs) packaged within a SiP are also provided.

Claims (20)

1 . A system, comprising:

a System-in-Package (SiP) device having an internal power management device, one or more internal components, and a plurality of external connectors; and

at least one external power supply for powering the system,

wherein the internal power management device of the SiP is configurable using a first set of the external connectors,

wherein the at least one external power supply provides power to the internal power management device of the SiP using a second set of the external connectors,

wherein the at least one external power supply provides power to one or more of the internal components of the SiP using a third set of external connectors, and

wherein the system is configured such that:

the at least external power supply does not provide power to internal components of the SiP using the third set of external connectors during a low power mode of operation of the system, and

the at least external power supply provides power to the internal components of the SiP using the third set of external connectors during a high performance mode of operation of the system.

2 . The system of claim 1 , wherein a single external power supply is configured to provide power to at least one internal component of the SiP and to the power management device of the SiP.

3 . The system of claim 1 , wherein the power management device is a power management integrated circuit (PMIC).

4 . The system of claim 1 , further comprising:

a substrate on which the SiP is operatively mounted,

wherein the second and third sets of external connectors provide power to the SiP through the substrate.

5 . The system of claim 1 , further comprising:

a controller,

wherein the controller is a standalone controller, part of one or more of the external power supplies, internal to the SiP, or a part of the power management device.

6 . The system of claim 5 ,

wherein SiP comprises one or more sense lines connected to the controller to provide information regarding one or more power needs of the SiP or components thereof, and

wherein the controller is configured to control power delivery to the internal components based on the sensed power needs.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 18, 2025
From: TROY, KEVIN MICHAEL; LINDER, PETER ROBERT
To: OCTAVO SYSTEMS LLC
Reel/Frame 073256/0420 →
Continuity (2)
Continuation In Part 15589823 · May 8, 2017
Related Publication 20220390970A1 · Dec 8, 2022
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