Resistive memory cell having a low forming voltage
Various embodiments of the present disclosure are directed towards a method for forming a memory device. The method includes forming a bottom electrode over a substrate. A data storage structure is formed on the bottom electrode. The data storage structure comprises a first atomic percentage of a first dopant and a second atomic percentage of a second dopant. The first atomic percentage is different from the second atomic percentage. A top electrode is formed on the data storage structure.
1. A method for forming a memory device, comprising:
forming a bottom electrode over a substrate;
forming a data storage structure on the bottom electrode, wherein the data storage structure is co-doped with a first dopant and a second dopant, wherein a first atomic percentage of the first dopant in the data storage structure is different from a second atomic percentage of the second dopant in the data storage structure, wherein the data storage structure is co-doped with the first and second dopants by a single deposition process; and
forming a top electrode on the data storage structure.
2. The method of claim 1 , wherein the first atomic percentage is within a range of about 1 to 15 percent and the second atomic percentage is within a range of about 2 to 20 percent.
3. The method of claim 1 , wherein the first dopant comprises nitrogen, carbon, or fluorine, wherein the second dopant comprises tantalum, cerium, hafnium, or zirconium.
4. The method of claim 1 , wherein a thickness of the data storage structure is within a range of about 20 to 80 angstroms.
5. The method of claim 1 , further comprising performing an annealing process on the data storage structure.
6. The method of claim 1 , wherein forming the data storage structure comprises:
performing a first patterning process on the data storage structure, wherein the first patterning process defines upper opposing sidewalls of the data storage structure;
forming a passivation layer over the data storage structure and along the upper opposing sidewalls; and
performing a second patterning process on the data storage structure, wherein the second patterning process defines lower opposing sidewalls of the data storage structure, wherein the upper opposing sidewalls are spaced between the lower opposing sidewalls.
7. The method of claim 6 , wherein the second patterning process is performed while the passivation layer is disposed on the data storage structure.
8. A method for forming a memory device, comprising:
forming a bottom electrode via over a substrate;
forming a bottom electrode on the bottom electrode via;
forming a data storage structure on the bottom electrode, wherein the data storage structure comprises a co-doped dielectric material;
forming a top electrode on the data storage structure;
forming a capping layer on the top electrode;
performing a first etch process on the capping layer, the top electrode, and the data storage structure, wherein first opposing sidewalls of the data storage structure, sidewalls of the top electrode, and sidewalls of the capping layer are aligned; and
forming a sidewall spacer structure over the data storage structure, wherein the sidewall spacer structure extends from a top surface of the capping layer to the first opposing sidewalls of the data storage structure.
9. The method of claim 8 , wherein a width of the data storage structure discretely increases from a top surface of the data storage structure in a direction towards the bottom electrode via.
10. The method of claim 8 , wherein the data storage structure is deposited by chemical vapor deposition, physical vapor deposition, sputtering, or co-sputtering.
11. The method of claim 8 , further comprising:
performing a second etch process on the data storage structure and the bottom electrode, wherein second opposing sidewalls of the data storage structure and sidewalls of the bottom electrode are aligned, wherein a width of the bottom electrode is greater than a width of the top electrode.
12. The method of claim 11 , wherein the sidewall spacer structure is formed before performing the second etch process.
13. The method of claim 8 , wherein a thickness of the data storage structure increases from an outer sidewall of the data storage structure in a direction towards a center of the data storage structure.
14. A method for forming a memory device, the method comprising:
forming a lower conductive wire over a substrate;
depositing a bottom electrode layer over the lower conductive wire;
forming a data storage structure over the bottom electrode layer such that the data storage structure comprises a dielectric material co-doped with a first dopant and a second dopant with different atomic percentages, wherein forming the data storage structure comprises depositing a compound of the dielectric material and the second dopant while concurrently exposing the compound to a first gas that comprises the first dopant;
forming a top electrode over the data storage structure; and
patterning the bottom electrode layer, the data storage structure, and the top electrode, thereby defining a resistive random access memory (RRAM) cell.
15. The method of claim 14 , wherein the data storage structure comprises a first atomic percentage of the first dopant and a second atomic percentage of the second dopant, wherein the second atomic percentage is greater than the first atomic percentage.
16. The method of claim 14 ,
wherein depositing the compound includes performing a physical vapor deposition process (PVD).
17. The method of claim 14 , wherein the dielectric material is aluminum oxide, the first dopant is nitrogen, and the second dopant is tantalum.
18. The method of claim 14 , wherein the co-doped dielectric material continuously vertically extends from a top surface of the bottom electrode layer to a bottom surface of the top electrode.
19. The method of claim 14 , wherein a width of the data storage structure is greater than a width of the top electrode.
20. The method of claim 14 , wherein patterning the bottom electrode layer, the data storage structure, and the top electrode comprises:
performing a first etch on the top electrode and the data storage structure; and
performing a second etch on the data storage structure and the bottom electrode layer after the first etch.