Granted Patent B2

US 12,724,121 · App. 18/112,087 · Granted Sep 1, 2026

Inventors: Romain Coffy (Voiron, FR); Younes Boutaleb (Grenoble, FR)

Assignee: STMicroelectronics (Grenoble 2) SAS

G01S7/4813H10W90/00

Abstract

Claims (76)

1 . A time-of-flight sensor, comprising:

a light ray generation circuit including a first region configured to emit light rays;

a light ray reception circuit including a second region configured to receive light rays and a third region configured to receive light rays; and

a first resin layer encapsulating the light ray generation circuit and the light ray reception circuit, said first resin layer having a first surface and a second surface opposed to the first surface;

said first, second and third regions being flush with the first surface of the first resin layer;

wherein said first region, second region and third region are exposed at the first surface of the first resin layer;

wherein said first surface of the first resin layer is configured to be directed towards a scene;

a first stack of insulating layers covering the first surface of the first resin layer;

wherein the first stack of insulating layers includes a first opening exposing both the first region and the third region and further includes a second opening exposing the second region;

a component resting on the first stack of insulating layers;

said component comprising a third opening coupled to the first opening and a fourth opening coupled to the second opening;

wherein a portion of the component extends over the third region;

first conductive tracks located in said first stack of insulating layers;

wherein said first conductive tracks are in contact with one or more of the light ray generation circuit and the light ray reception circuit;

a second stack of insulating layers covering the second surface of the first resin layer;

second conductive tracks located in said second stack of insulating layers; and

conductive vias within the first resin layer;

wherein said conductive vias electrically couple between the first conductive tracks and the second conductive tracks.

2 . The sensor according to claim 1 , further comprising:

a first optical instrument bonded in the third opening and positioned at least partially located in front of the first region of the light ray generation circuit; and

a second optical instrument bonded in the fourth opening and positioned at least partially located in front of the second region of light ray reception circuit.

3 . The sensor according to claim 2 , wherein the component is made of resin and wherein each of the third and fourth openings includes an edge to which the first and second optical instruments, respectively, are bonded.

4 . A time-of-flight sensor, comprising:

a light ray generation circuit including a first region configured to emit light rays;

a light ray reception circuit including a second region configured to receive light rays and a third region configured to receive light rays; and

a first resin layer encapsulating the light ray generation circuit and the light ray reception circuit, said first resin layer having a first surface and a second surface opposed to the first surface;

said first, second and third regions being flush with the first surface of the first resin layer;

wherein said first region, second region and third region are exposed at the first surface of the first resin layer;

wherein said first surface of the first resin layer is configured to be directed towards a scene;

a first stack of insulating layers covering the first surface of the first resin layer;

wherein the first stack of insulating layers includes a first opening exposing both the first region and the third region and further includes a second opening exposing the second region;

a component resting on the first stack of insulating layers;

said component comprising a third opening coupled to the first opening and a fourth opening coupled to the second opening; and

wherein a portion of the component extends over the third region;

first conductive tracks located in said first stack of insulating layers;

wherein said first conductive tracks are in contact with one or more of the light ray generation circuit and the light ray reception circuit;

a second stack of insulating layers covering the second surface of the first resin layer;

second conductive tracks located in said second stack of insulating layers; and

conductive vias within the first resin layer;

wherein said conductive vias electrically couple one or more of the light ray generation circuit and the light ray reception circuit to the second conductive tracks.

5 . The sensor according to claim 4 , further comprising:

a first optical instrument bonded in the third opening and positioned at least partially located in front of the first region of the light ray generation circuit; and

a second optical instrument bonded in the fourth opening and positioned at least partially located in front of the second region of light ray reception circuit.

6 . The sensor according to claim 5 , wherein the component is made of resin and wherein each of the third and fourth openings includes an edge to which the first and second optical instruments, respectively, are bonded.

7 . A method of manufacturing a time-of-flight sensor, comprising:

bonding a light ray generation circuit and a light ray reception circuit to a surface of a support;

wherein a first region configured to emit light rays of said light ray generation circuit faces said surface;

wherein a second region and a third region configured to receive light rays of said light ray reception circuit faces said surface;

forming a first resin layer on said support which encapsulates the light ray generation circuit and the light ray reception circuit;

detaching the support to provide the first resin layer with a first surface and a second surface opposed to the first surface;

wherein said first region, second region and third region are exposed at the first surface of the first resin layer;

wherein said first surface of the first resin layer is configured to be directed towards a scene;

forming a first stack of insulating layers covering the first surface of the first resin layer;

forming a first opening in said first stack of insulating layers which exposes both the first region of the first light ray generation circuit and the third region of the light ray reception circuit;

forming a second opening in said first stack of insulating layers which exposes the second region of the light ray reception circuit;

forming a component resting on the first stack of insulating layers;

forming a third opening in said component coupled to the first opening, wherein the third opening is positioned at least partially located in front of the light ray generation circuit;

forming a fourth opening in said component coupled to the second opening, wherein the fourth opening is positioned at least partially located in front of the light ray reception circuit;

wherein a portion of the component extends over the third region.

8 . The method according to claim 7 , wherein forming the first layer comprises forming by a method of panel embedded packaging type.

9 . The method according to claim 7 , further comprising:

said first stack of insulating layers including first conductive tracks; and

electrically connecting said first conductive tracks with one or more of the light ray generation circuit and the light ray reception circuit.

10 . The method according to claim 9 , further comprising:

forming a second stack of insulating layers covering the second surface of the first resin layer, said second stack of insulating layers including second conductive tracks.

11 . The method according to claim 10 , further comprising:

forming conductive vias within the first resin layer;

said conductive vias coupling between the first conductive tracks and the second conductive tracks.

12 . The method according to claim 10 , further comprising:

forming conductive vias within the first resin layer;

said conductive vias coupling one or more of the light ray generation circuit and the light ray reception circuit to the second conductive tracks.

13 . The method according to claim 7 , further comprising:

mounting a first optical instrument in the third opening; and

mounting a second optical instrument in the fourth opening.

14 . The method according to claim 13 , wherein the third and fourth openings each comprise an edge, and wherein mounting the first and second optical instruments comprises bonding the first and second optical instruments to the edges in the third and fourth openings, respectively.

15 . The method according to claim 7 , wherein the component is made of resin.

Assignments (1)

Priority Claims (1)

Continuity (1)

References Cited (23)