IP Library Granted Patent US 12,647,020
Granted Patent B2
US 12,647,020 · App. 18/153,810 · Granted Jun 2, 2026

Systems and methods for sensing temperature of inverter for electric vehicle

Inventor: Mark Wendell Gose (Kokomo, IN)
Assignee: BorgWarner US Technologies LLC
H02M1/327H02M1/44H02M7/003H02M7/5387
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 12,647,020
App. No.
18/153,810
Granted
Jun 2, 2026
Kind
B2
Abstract

A system comprises: an inverter configured to convert DC power from a battery to AC power to drive a motor, wherein the inverter includes: a power module including a drain terminal and a source terminal; one or more phase switches configured to control a current flow between the drain terminal and the source terminal; and a point-of-use controller including two or more thermal sensors on the point-of-use controller, the point-of-use controller configured to determine a temperature of the one or more phase switches using the two or more thermal sensors.

Claims (38)

1 . A system comprising:

an inverter configured to convert DC power from a battery to AC power to drive a motor, wherein the inverter includes:

a power module including a drain terminal and a source terminal;

one or more phase switches configured to control a current flow between the drain terminal and the source terminal; and

a point-of-use controller including two or more thermal sensors on the point-of-use controller, the point-of-use controller configured to determine a temperature of the one or more phase switches using the two or more thermal sensors,

wherein the point-of-use controller is configured to determine the temperature of the one or more phase switches using a temperature gradient of the point-of-use controller using the two or more thermal sensors.

2 . The system of claim 1 , wherein the point-of-use controller is an application-specific integrated circuit.

3 . The system of claim 1 , wherein the point-of-use controller is a gate driver for the one or more phase switches.

4 . The system of claim 1 , wherein the one or more phase switches include one or more silicon carbide dies.

5 . The system of claim 1 , wherein each of the two or more thermal sensors includes a stack of diodes having a voltage drop with a negative temperature coefficient.

6 . The system of claim 1 , wherein the point-of-use controller is configured to determine the temperature of the one or more phase switches using respective absolute temperatures of the two or more thermal sensors and a difference between the respective absolute temperatures of the two or more thermal sensors.

7 . The system of claim 1 , further comprising:

the battery configured to supply the DC power to the inverter; and

the motor configured to receive the AC power from the inverter to drive the motor.

8 . A system comprising:

a power module for an inverter configured to convert DC power to AC power, the power module including a drain terminal and a source terminal;

one or more phase switches configured to control a current flow between the drain terminal and the source terminal; and

a point-of-use controller including two or more thermal sensors on the point-of-use controller, the point-of-use controller configured to determine a temperature of the one or more phase switches using the two or more thermal sensors,

wherein the point-of-use controller is configured to determine the temperature of the one or more phase switches using respective absolute temperatures of the two or more thermal sensors and a difference between the respective absolute temperatures of the two or more thermal sensors.

9 . The system of claim 8 , wherein the point-of-use controller is an application-specific integrated circuit gate driver for the one or more phase switches.

10 . The system of claim 8 , wherein the one or more phase switches include one or more silicon carbide dies.

11 . The system of claim 8 , wherein each of the two or more thermal sensors includes a stack of diodes having a voltage drop with a negative temperature coefficient.

12 . The system of claim 8 , wherein the point-of-use controller is configured to determine the temperature of the one or more phase switches using a temperature gradient of the point-of-use controller using the two or more thermal sensors.

13 . A system including one or more controllers comprising:

a first thermal sensor at a first location on the one or more controllers; and

a second thermal sensor at a second location on the one or more controllers,

wherein the one or more controllers are configured to determine a temperature of a component outside the one or more controllers using the first thermal sensor and the second thermal sensor by:

determining a first temperature difference between the first thermal sensor and the second thermal sensor at a first time,

determining a second temperature difference between the first thermal sensor and the second thermal sensor at a second time, and

determining the temperature of the component based on the first temperature difference and the second temperature difference.

14 . The system of claim 13 , wherein the one or more controllers are further configured to:

determine the temperature of the component based on the first temperature difference, the second temperature difference, and a slope of a gradient between the first temperature difference and the second temperature difference.

15 . The system of claim 13 , wherein the one or more controllers are further configured to:

determine the temperature of the component based on the first temperature difference, the second temperature difference, a slope of a gradient between the first temperature difference and the second temperature difference, and a layout geometry of the component.

16 . The system of claim 13 , wherein the one or more controllers are further configured to:

determine the temperature of the component based on the first temperature difference, the second temperature difference, and a rate of change between the first temperature difference and the second temperature difference.

17 . The system of claim 13 , wherein the one or more controllers are further configured to:

determine the temperature of the component based on a temperature of the first thermal sensor, the first temperature difference, and the second temperature difference.

Assignments (2)
CHANGE OF NAME Recorded Sep 18, 2024
From: DELPHI TECHNOLOGIES IP LIMITED
To: BORGWARNER US TECHNOLOGIES LLC
Reel/Frame 068987/0367 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 12, 2023
From: GOSE, MARK WENDELL
To: DELPHI TECHNOLOGIES IP LIMITED
Reel/Frame 062363/0773 →
Continuity (5)
Provisional Application 63378601 · Oct 6, 2022
Provisional Application 63377501 · Sep 28, 2022
Provisional Application 63377512 · Sep 28, 2022
Provisional Application 63377486 · Sep 28, 2022
Related Publication 20240106381A1 · Mar 28, 2024
References Cited (243)
US 4054828A · Conzelmann et al. · 1977 [cited by applicant]
US 4128801A · Gansert et al. · 1978 [cited by applicant]
US 4564771A · Flohrs · 1986 [cited by applicant]
US 4618875A · Flohrs · 1986 [cited by applicant]
US 4716304A · Fiebig et al. · 1987 [cited by applicant]
US 5068703A · Conzelmann et al. · 1991 [cited by applicant]
US 5432371A · Denner et al. · 1995 [cited by applicant]
US 5559661A · Meinders · 1996 [cited by applicant]
US 5654863A · Davies · 1997 [cited by applicant]
US 5764007A · Jones · 1998 [cited by applicant]
US 5841312A · Mindl et al. · 1998 [cited by applicant]
US 6028470A · Michel et al. · 2000 [cited by applicant]
US 6163138A · Kohl et al. · 2000 [cited by applicant]
US 6351173B1 · Ovens et al. · 2002 [cited by applicant]
US 6426857B1 · Doster et al. · 2002 [cited by applicant]
US 6597556B1 · Michel et al. · 2003 [cited by applicant]
US 6812553B2 · Gerbsch et al. · 2004 [cited by applicant]
US 6943293B1 · Jeter et al. · 2005 [cited by applicant]
US 7095098B2 · Gerbsch et al. · 2006 [cited by applicant]
US 7229855B2 · Murphy · 2007 [cited by applicant]
US 7295433B2 · Taylor et al. · 2007 [cited by applicant]
US 7459954B2 · Kuehner et al. · 2008 [cited by applicant]
US 7538425B2 · Myers et al. · 2009 [cited by applicant]
US 7551439B2 · Peugh et al. · 2009 [cited by applicant]
US 7616047B2 · Rees et al. · 2009 [cited by applicant]
US 7724046B2 · Wendt et al. · 2010 [cited by applicant]
US 7750720B2 · Dittrich · 2010 [cited by applicant]
US 9088159B2 · Peuser · 2015 [cited by applicant]
US 9275915B2 · Heinisch et al. · 2016 [cited by applicant]
US 9373970B2 · Feuerstack et al. · 2016 [cited by applicant]
US 9431932B2 · Schmidt et al. · 2016 [cited by applicant]
US 9515584B2 · Koller et al. · 2016 [cited by applicant]
US 9548675B2 · Schoenknecht · 2017 [cited by applicant]
US 9806607B2 · Ranmuthu et al. · 2017 [cited by applicant]
US 9843320B2 · Richter et al. · 2017 [cited by applicant]
US 9871444B2 · Ni et al. · 2018 [cited by applicant]
US 9882490B2 · Veeramreddi et al. · 2018 [cited by applicant]
US 10111285B2 · Shi et al. · 2018 [cited by applicant]
US 10116300B2 · Blasco et al. · 2018 [cited by applicant]
US 10232718B2 · Trunk et al. · 2019 [cited by applicant]
US 10270354B1 · Lu et al. · 2019 [cited by applicant]
US 10291225B2 · Li et al. · 2019 [cited by applicant]
US 10525847B2 · Strobel et al. · 2020 [cited by applicant]
US 10673432B1 · Kaya · 2020 [cited by examiner]
US 10742205B1 · White · 2020 [cited by examiner]
US 10797579B2 · Hashim et al. · 2020 [cited by applicant]
US 10924001B2 · Li et al. · 2021 [cited by applicant]
US 11082052B2 · Jang et al. · 2021 [cited by applicant]
US 11108389B2 · Li et al. · 2021 [cited by applicant]
US 11342911B2 · Lee et al. · 2022 [cited by applicant]
US 11838011B2 · Li et al. · 2023 [cited by applicant]
US 11843320B2 · Sivakumar et al. · 2023 [cited by applicant]
US 11848426B2 · Zhang et al. · 2023 [cited by applicant]
US 11851038B2 · Solanki et al. · 2023 [cited by applicant]
US 11855522B2 · Rudolph et al. · 2023 [cited by applicant]
US 11855630B2 · Dake et al. · 2023 [cited by applicant]
US 11870338B1 · Narayanasamy · 2024 [cited by applicant]
US 11872997B2 · Hoos et al. · 2024 [cited by applicant]
US 11881859B2 · Gupta et al. · 2024 [cited by applicant]
US 11888391B2 · Balasubramanian et al. · 2024 [cited by applicant]
US 11888393B2 · Venkateswaran et al. · 2024 [cited by applicant]
US 11901803B2 · Ruck et al. · 2024 [cited by applicant]
US 11901881B1 · Narayanasamy · 2024 [cited by applicant]
US 11909319B2 · Esteghlal et al. · 2024 [cited by applicant]
US 11916426B2 · Oner et al. · 2024 [cited by applicant]
US 11923762B2 · Sethumadhavan et al. · 2024 [cited by applicant]
US 11923764B1 · Zhang · 2024 [cited by applicant]
US 11923799B2 · Ojha et al. · 2024 [cited by applicant]
US 11925119B2 · Male et al. · 2024 [cited by applicant]
US 11927624B2 · Patel et al. · 2024 [cited by applicant]
US 11938838B2 · Simonis et al. · 2024 [cited by applicant]
US 11942927B2 · Purcarea et al. · 2024 [cited by applicant]
US 11942934B2 · Ritter · 2024 [cited by applicant]
US 11945331B2 · Blemberg et al. · 2024 [cited by applicant]
US 11945522B2 · Matsumura et al. · 2024 [cited by applicant]
US 11949320B2 · Jaladanki et al. · 2024 [cited by applicant]
US 11949333B2 · Pahkala et al. · 2024 [cited by applicant]
US 11955896B2 · Liu et al. · 2024 [cited by applicant]
US 11955953B2 · Sinn et al. · 2024 [cited by applicant]
US 11955964B2 · Agarwal et al. · 2024 [cited by applicant]
US 11962234B2 · Narayanasamy et al. · 2024 [cited by applicant]
US 11962291B2 · Oberdieck et al. · 2024 [cited by applicant]
US 11964587B2 · Yukawa · 2024 [cited by applicant]
US 11970076B2 · Sarfert et al. · 2024 [cited by applicant]
US 11977404B2 · Chandrasekaran · 2024 [cited by applicant]
US 11984802B2 · Merkin et al. · 2024 [cited by applicant]
US 11984876B2 · Neidorff et al. · 2024 [cited by applicant]
US 11990776B2 · Dulle · 2024 [cited by applicant]
US 11990777B2 · Woll et al. · 2024 [cited by applicant]
US 11996686B2 · Chan et al. · 2024 [cited by applicant]
US 11996699B2 · Vasconcelos Araujo et al. · 2024 [cited by applicant]
US 11996714B2 · El Markhi et al. · 2024 [cited by applicant]
US 11996715B2 · Nandi et al. · 2024 [cited by applicant]
US 11996762B2 · Hembach et al. · 2024 [cited by applicant]
US 11996830B2 · Murthy et al. · 2024 [cited by applicant]
US 11996847B1 · Kazama et al. · 2024 [cited by applicant]
US 12003191B2 · Chaudhary et al. · 2024 [cited by applicant]
US 12003229B2 · Kaya et al. · 2024 [cited by applicant]
US 12003237B2 · Waters · 2024 [cited by applicant]
US 12008847B2 · Braun et al. · 2024 [cited by applicant]
US 12009679B2 · Gottwald et al. · 2024 [cited by applicant]
US 12012057B2 · Schneider et al. · 2024 [cited by applicant]
US 12015342B2 · Kienzler et al. · 2024 [cited by applicant]
US 12019112B2 · Jarmolowitz et al. · 2024 [cited by applicant]
US 12021517B2 · S et al. · 2024 [cited by applicant]
US 20120219033A1 · Tanimura · 2012 [cited by examiner]
US 20170331469A1 · Kilb et al. · 2017 [cited by applicant]
US 20180167013A1 · Xu et al. · 2018 [cited by applicant]
US 20190250046A1 · Sun · 2019 [cited by examiner]
US 20200195121A1 · Keskar et al. · 2020 [cited by applicant]
US 20210005711A1 · Martinez-Limia et al. · 2021 [cited by applicant]
US 20220052610A1 · Plum · 2022 [cited by applicant]
US 20220200512A1 · Anderson · 2022 [cited by examiner]
US 20220294441A1 · Purcarea et al. · 2022 [cited by applicant]
US 20220337239A1 · Kinoshita · 2022 [cited by examiner]
US 20220368216A1 · Miyake · 2022 [cited by examiner]
US 20230010616A1 · Gschwantner et al. · 2023 [cited by applicant]
US 20230061922A1 · Ritter · 2023 [cited by applicant]
US 20230082076A1 · Strache et al. · 2023 [cited by applicant]
US 20230126070A1 · Oberdieck et al. · 2023 [cited by applicant]
US 20230179198A1 · Winkler · 2023 [cited by applicant]
US 20230231210A1 · Joos et al. · 2023 [cited by applicant]
US 20230231400A1 · Oberdieck et al. · 2023 [cited by applicant]
US 20230231496A1 · Syed et al. · 2023 [cited by applicant]
US 20230238808A1 · Swoboda et al. · 2023 [cited by applicant]
US 20230268826A1 · Yan et al. · 2023 [cited by applicant]
US 20230298957A1 · Furukawa · 2023 [cited by examiner]
US 20230308026A1 · Byers · 2023 [cited by examiner]
US 20230335509A1 · Poddar · 2023 [cited by applicant]
US 20230365086A1 · Schumacher et al. · 2023 [cited by applicant]
US 20230370062A1 · Wolf · 2023 [cited by applicant]
US 20230378022A1 · Kim et al. · 2023 [cited by applicant]
US 20230386963A1 · Kim et al. · 2023 [cited by applicant]
US 20230402930A1 · Corry et al. · 2023 [cited by applicant]
US 20230420968A1 · Oner et al. · 2023 [cited by applicant]
US 20230421049A1 · Neidorff · 2023 [cited by applicant]
US 20240006869A1 · Kim et al. · 2024 [cited by applicant]
US 20240006899A1 · Wernerus · 2024 [cited by applicant]
US 20240006993A1 · Barjati et al. · 2024 [cited by applicant]
US 20240022187A1 · Fassnacht · 2024 [cited by applicant]
US 20240022240A1 · Balaz · 2024 [cited by applicant]
US 20240022244A1 · S et al. · 2024 [cited by applicant]
US 20240030730A1 · Wernerus · 2024 [cited by applicant]
US 20240039062A1 · Wernerus · 2024 [cited by applicant]
US 20240039402A1 · Bafna et al. · 2024 [cited by applicant]
US 20240039406A1 · Chen et al. · 2024 [cited by applicant]
US 20240048048A1 · Zhang · 2024 [cited by applicant]
US 20240055488A1 · Lee et al. · 2024 [cited by applicant]
US 20240067116A1 · Qiu · 2024 [cited by applicant]
US 20240072675A1 · Formenti et al. · 2024 [cited by applicant]
US 20240072817A1 · K et al. · 2024 [cited by applicant]
US 20240077899A1 · Chitnis et al. · 2024 [cited by applicant]
US 20240078204A1 · Roehrle et al. · 2024 [cited by applicant]
US 20240079950A1 · Narayanasamy · 2024 [cited by applicant]
US 20240079958A1 · Kumar et al. · 2024 [cited by applicant]
US 20240080028A1 · Dake et al. · 2024 [cited by applicant]
US 20240088647A1 · Ramadass et al. · 2024 [cited by applicant]
US 20240088896A1 · Bilhan et al. · 2024 [cited by applicant]
US 20240097437A1 · Goyal et al. · 2024 [cited by applicant]
US 20240097459A1 · Swoboda et al. · 2024 [cited by applicant]
US 20240105276A1 · Duryea · 2024 [cited by applicant]
US 20240106248A1 · Woll et al. · 2024 [cited by applicant]
US 20240106435A1 · Zhang et al. · 2024 [cited by applicant]
US 20240113517A1 · Sriraj et al. · 2024 [cited by applicant]
US 20240113611A1 · Kaufmann et al. · 2024 [cited by applicant]
US 20240113620A1 · Ranmuthu et al. · 2024 [cited by applicant]
US 20240113624A1 · Southard et al. · 2024 [cited by applicant]
US 20240120558A1 · Zhang et al. · 2024 [cited by applicant]
US 20240120765A1 · Oner et al. · 2024 [cited by applicant]
US 20240120962A1 · Miriyala et al. · 2024 [cited by applicant]
US 20240128851A1 · Ruck et al. · 2024 [cited by applicant]
US 20240128859A1 · Chen · 2024 [cited by applicant]
US 20240128867A1 · Wang et al. · 2024 [cited by applicant]
US 20240146177A1 · Mehdi et al. · 2024 [cited by applicant]
US 20240146306A1 · Ramkaj et al. · 2024 [cited by applicant]
US 20240149734A1 · Eisenlauer · 2024 [cited by applicant]
US 20240162723A1 · Zipf et al. · 2024 [cited by applicant]
US 20240178756A1 · El-Markhi et al. · 2024 [cited by applicant]
US 20240178824A1 · Kazama et al. · 2024 [cited by applicant]
US 20240186803A1 · Krieg et al. · 2024 [cited by applicant]
US 20240198937A1 · Benqassmi et al. · 2024 [cited by applicant]
US 20240198938A1 · Carlos et al. · 2024 [cited by applicant]
US 20240204540A1 · Majmunovic et al. · 2024 [cited by applicant]
US 20240204541A1 · Majmunovic et al. · 2024 [cited by applicant]
US 20240204671A1 · Liu et al. · 2024 [cited by applicant]
US 20240204765A1 · Dake · 2024 [cited by applicant]
US 20240213874A1 · Junnarkar et al. · 2024 [cited by applicant]
US 20240213971A1 · Lee · 2024 [cited by applicant]
US 20240213975A1 · Narayanasamy · 2024 [cited by applicant]
US 20240213981A1 · Agarwal et al. · 2024 [cited by applicant]
WO 2007093598A1 · 2007 [cited by applicant]
WO 2013054413A1 · 2013 [cited by applicant]
WO 2019034505A1 · 2019 [cited by applicant]
WO 2020156820A1 · 2020 [cited by applicant]
WO 2020239797A1 · 2020 [cited by applicant]
WO 2021110405A1 · 2021 [cited by applicant]
WO 2021213728A1 · 2021 [cited by applicant]
WO 2022012943A1 · 2022 [cited by applicant]
WO 2022229149A1 · 2022 [cited by applicant]
WO 2023006491A1 · 2023 [cited by applicant]
WO 2023046607A1 · 2023 [cited by applicant]
WO 2023094053A1 · 2023 [cited by applicant]
WO 2023110991A1 · 2023 [cited by applicant]
WO 2023147907A1 · 2023 [cited by applicant]
WO 2023151850A1 · 2023 [cited by applicant]
WO 2023227278A1 · 2023 [cited by applicant]
WO 2023237248A1 · 2023 [cited by applicant]
WO 2024006181A2 · 2024 [cited by applicant]
WO 2024012743A1 · 2024 [cited by applicant]
WO 2024012744A1 · 2024 [cited by applicant]
WO 2024022219A1 · 2024 [cited by applicant]
WO 2024041776A1 · 2024 [cited by applicant]
WO 2024046614A1 · 2024 [cited by applicant]
WO 2024049730A1 · 2024 [cited by applicant]
WO 2024049884A1 · 2024 [cited by applicant]
WO 2024049909A1 · 2024 [cited by applicant]
WO 2024056388A1 · 2024 [cited by applicant]
WO 2024068065A1 · 2024 [cited by applicant]
WO 2024068076A1 · 2024 [cited by applicant]
WO 2024068113A1 · 2024 [cited by applicant]
WO 2024068115A1 · 2024 [cited by applicant]
WO 2024083391A1 · 2024 [cited by applicant]
WO 2024093384A1 · 2024 [cited by applicant]
WO 2024104970A1 · 2024 [cited by applicant]
WO 2024108401A1 · 2024 [cited by applicant]
WO 2024110106A1 · 2024 [cited by applicant]
WO 2024110265A1 · 2024 [cited by applicant]
WO 2024110297A1 · 2024 [cited by applicant]
WO 2024114978A1 · 2024 [cited by applicant]
WO 2024114979A1 · 2024 [cited by applicant]
WO 2024114980A1 · 2024 [cited by applicant]
WO 2024128286A1 · 2024 [cited by applicant]
WO 2024132249A1 · 2024 [cited by applicant]
Balogh, L., “Fundamentals of MOSFET and IGBT Gate Driver Circuits,” Texas Instruments Application Report, SLUA618-March (2017), Retrieved from internet URL: https://ghioni.faculty.polimi.it/pel/readmat/gate-drive.pdf, 6… [cited by applicant]
Baranwal, S., “Common-mode transient immunity for isolated gate drivers,” Analog Applications Journal, Texas Instruments (2015), Retrieved from internet URL: https://www.ti.com/lit/an/slyt648/slyt648.pdf?ts=170205233606… [cited by applicant]
Boomer, K. and Ahmad H., “Performance Evaluation of an Automotive-Grade, High-Speed Gate Driver for SiC FETs, Type UCC27531, Over a Wide Temperature Range,” NASA Electronic Parts and Packaging Program No. GRC-E-DAA-TN25… [cited by applicant]
Ke, X, et al., “A 3-to-40V 10-to-30MHz Automotive-Use GaN Driver with Active BST Balancing and VSW Dual-Edge Dead-Time Modulation Achieving 8.3% Efficiency Improvement and 3.4ns Constant Propagation Delay,” 2016 IEEE In… [cited by applicant]
Sridhar, N., “Impact of an Isolated Gate Driver,” Texas Instruments: Dallas, Texas (2019), Retrieved from Internet URL: https://www.ti.com/lit/wp/slyy140a/slyy140a.pdf, 08 pages. [cited by applicant]
Sridhar, N., “Power Electronics in Motor Drives: Where is it?” Texas Instruments (2015), Retrieved from Internet URL: https://www.ti.com/lit/wp/slyy078a/slyy078a.pdf, 09 pages. [cited by applicant]
Sridhar, N., “Silicon Carbide Gate Drivers—a Disruptive Technology in Power Electronics,” Texas Instruments, Dallas, Texas (2019), Retrieved from Internet URL: https://www.ti.com/lit/wp/slyy139/slyy139.pdf, 07 pages. [cited by applicant]
Maniar, K., et al., “Addressing High-voltage Design Challenges With Reliable and Affordable Isolation Technologies,” 2024, pp. 1-12. Retrieved from internet URL: https://www.ti.com/lit/wp/slyy204c/slyy204c.pdf ts=171050… [cited by applicant]
“New products,” 5 Pages, Retrieved from internet URL:https://www.ti.com/product-category/new-products.html?% 20releasePeriod=364#releasePeriod=90. [cited by applicant]
“Qualcomm and Bosch Showcase New Central Vehicle Computer for Digital Cockpit and Driver Assistance Functions at CES 2024,” 2024, 8 Pages. Retrieved from internet URL:https://www.qualcomm.com/news/releases/2024/01/qualc… [cited by applicant]