Systems and methods for an interlocking feature on a power module
A system includes a power module, wherein the power module includes an interlocking feature on a first surface of the power module; and at least one heat sink, wherein the surface of the at least one heat sink includes a layer of thermal interface material.
1. A system comprising:
a power module, wherein the power module includes a first interlocking feature on a first surface of the power module and a second interlocking feature on a second surface of the power module, wherein the first surface is opposite of the second surface;
a first heat sink, wherein the first heat sink includes a surface including a first layer of thermal interface material, wherein the first interlocking feature mates with the surface of the first heat sink to form a first gap between the first surface and the surface of the first heat sink; and
a second heat sink, wherein the second heat sink includes a surface including second layer of thermal interface material, wherein the second interlocking feature of the second surface mates with the surface of the second heat sink to form a second gap between the second surface and the surface of the second heat sink.
2. The system of claim 1 , wherein the second surface is separated from the first surface by a width of the power module.
3. The system of claim 1 , wherein the first interlocking feature is a protruding interlocking feature.
4. The system of claim 1 , wherein the surface of the first heat sink is a flat surface.
5. The system of claim 1 , wherein the first layer of thermal interface material includes one or more of thermal tapes, gels, thermal epoxies, solders, greases, gap-filled pads, or phase change materials.
6. The system of claim 1 , wherein the first surface and second surface include a copper layer.
7. The system of claim 1 , wherein a portion of the surface of the first heat sink located outwardly from where the first interlocking feature mates with the surface of the first heat sink includes the first layer of thermal interface material.
8. The system of claim 1 , wherein the first gap between the first surface of the power module and the surface of the first heat sink is filled with the first layer of thermal interface material.
9. The system of claim 1 , wherein the first layer of thermal interface material extends across an area of the first heat sink where the first interlocking feature on the power module does not mate with the surface of the first heat sink.
10. The system of claim 1 , wherein the first heat sink includes an inlet port or an outlet port.
11. A system comprising:
a power module, wherein the power module includes a first interlocking feature on a first surface of the power module; and
at least one heat sink, wherein the at least one heat sink includes a second interlocking feature on a surface of the at least one heat sink,
wherein the first interlocking feature of the first surface of the power module mates with the second interlocking feature on the surface of the at least one heat sink,
wherein the first interlocking feature includes a height greater than a depth of the second interlocking feature,
wherein the surface of the at least one heat sink includes a first portion located interior to the second interlocking feature and a second portion located exterior to the second interlocking feature, and
wherein the first portion and second portion of the surface of the at least one heat sink includes a layer of thermal interface material.
12. The system of claim 11 , wherein the power module includes a third interlocking feature on a second surface of the power module, wherein the second surface is separated from the first surface by a width of the power module.
13. The system of claim 12 , wherein the first interlocking feature on the first surface mates with the second interlocking feature on the surface of the at least one heat sink to form a gap between the first surface of the power module and the surface of the at least one heat sink.
14. The system of claim 13 , wherein the gap between the first surface of the power module and the surface of the at least one heat sink is filled with thermal interface material.
15. The system of claim 12 , wherein the first surface and second surface include a copper layer.
16. The system of claim 11 , wherein the first interlocking feature is a protruding interlocking feature.
17. The system of claim 11 , wherein the second interlocking feature is a recessed interlocking feature.
18. The system of claim 17 , wherein the recessed interlocking feature is a blind cavity.
19. The system of claim 11 , wherein the thermal interface material extends across an area of the surface of the at least one heat sink where the first interlocking feature on the power module does not mate with the second interlocking feature on the at least one heat sink.
20. The system of claim 11 , wherein the at least one heat sink includes an inlet port or an outlet port.