IP Library Granted Patent US 12,261,558
Granted Patent B2
US 12,261,558 · App. 18/160,378 · Granted Mar 25, 2025

Systems and methods for cooling system and power module for inverter for electric vehicle

Inventors: Bryan Rohl (Westfield, IN); Chris Fruth (Kokomo, IN); Edward Choi (Lake Orion, MI); Todd Nakanishi (Elwood, IN)
Assignee: BorgWarner US Technologies LLC
H02P27/06B60L3/003B60L15/007B60L15/08B60L50/40B60L50/51B60L50/60B60L50/64B60L53/20B60L53/22B60L53/62B60R16/02G01R15/20G06F1/08G06F13/4004H01L21/4882H01L23/15H01L23/3672H01L23/3675H01L23/3735H01L23/4006H01L23/467H01L23/473H01L23/49562H01L23/5383H01L24/32H01L24/33H01L25/072H01L25/50H02J7/0063H02M1/0009H02M1/0054H02M1/08H02M1/084H02M1/088H02M1/123H02M1/32H02M1/322H02M1/327H02M1/4258H02M1/44H02M3/33523H02M7/003H02M7/537H02M7/5387H02M7/53871H02M7/53875H02M7/5395H02P27/08H02P27/085H02P29/024H02P29/027H02P29/68H05K1/145H05K1/181H05K1/182H05K5/0247H05K7/20154H05K7/2039H05K7/2049H05K7/20854H05K7/209H05K7/20927H10D64/018B60L15/20B60L2210/30B60L2210/40B60L2210/42B60L2210/44B60L2240/36G06F2213/40H01L2023/405H01L2023/4087H01L2224/32225H01L2224/32245H01L2224/33181H02J2207/20H02P2207/05H03K19/20H05K2201/042H05K2201/10166
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Quick Facts
Patent No.
US 12,261,558
App. No.
18/160,378
Granted
Mar 25, 2025
Kind
B2
Abstract

A subassembly for an electrical component includes: a first plate including: a wall, stepped walls extending from opposite sides of the wall, flange elements extending outwardly from the stepped walls, each flange element defining an engagement slot; a first heatsink positioned on the wall between the stepped walls; a second heatsink; a power module between the first heatsink and the second heatsink; and a second plate including: a plate wall extending across the second heatsink, transition walls extending from opposite sides of the plate wall, and prongs extending from the transition walls toward the first plate and substantially perpendicular to an inner surface of the plate wall in contact with the second heatsink, wherein the prongs are aligned with and configured to engage the engagement slots.

Claims (62)

1. A subassembly for an electrical component, the subassembly comprising:

a first plate including:

a wall,

stepped walls extending from opposite sides of the wall, and

flange elements extending outwardly from the stepped walls, each flange element defining an engagement slot;

a first heatsink positioned on the wall between the stepped walls;

a second heatsink;

a power module between the first heatsink and the second heatsink; and

a second plate including:

a plate wall extending across the second heatsink,

transition walls extending from opposite sides of the plate wall, and

prongs extending from the transition walls toward the first plate and substantially perpendicular to an inner surface of the plate wall in contact with the second heatsink,

wherein the prongs are aligned with and configured to engage the engagement slots.

2. The subassembly of claim 1 , wherein the power module includes a first power module and a second power module positioned between a first contact interface of the first heatsink and a second contact interface of the second heatsink.

3. The subassembly of claim 1 , further comprising:

thermal interface material disposed between the power module and the first and second heatsinks.

4. The subassembly of claim 1 , where each flange element defines an aperture configured to receive a fastener.

5. The subassembly of claim 1 , further comprising:

a first support positioned between the first heatsink and the second heatsink; and

a second support positioned between the first heatsink and the second heatsink,

wherein the power module is positioned between the first support and the second support along a longitudinal axis of the subassembly.

6. The subassembly of claim 1 , wherein the plate wall is configured to elastically deform with an application of force on the second plate directed toward the first plate.

7. The subassembly of claim 1 , wherein the plate wall of the second plate includes ribs that extend between the transition walls.

8. The subassembly of claim 7 , wherein each of the ribs defines a curved structure configured to elastically deform against the second heatsink with an application of force on the second plate directed toward the first plate.

9. The subassembly of claim 1 , wherein a lip extends outwardly from each of the stepped walls of the first plate along a first plane that is parallel to a second plane that includes the wall, and wherein the flange elements extend outwardly from the lips along the first plane.

10. The subassembly of claim 9 , wherein the prongs of the second plate are second prongs, and wherein first plate includes first prongs that extend from the lips perpendicular to the first and second planes.

11. The subassembly of claim 1 , wherein the first heatsink defines a first active cooling system including first channels, and

wherein the first channels are arranged to receive coolant flowing into the first heatsink and direct the coolant across and out of the first heatsink.

12. The subassembly of claim 11 , wherein first and second fittings of the first heatsink are positioned within first and second apertures defined by the first plate,

wherein the power module is positioned along a longitudinal axis of the subassembly between the first fitting and the second fitting, and

wherein the coolant flows past the first fitting into first heatsink, through the first channels, and past the second fitting out of the first heatsink.

13. The subassembly of claim 11 , wherein the second heatsink defines a second active cooling system including second channels, and wherein the second channels are arranged to receive the coolant flowing from the first heatsink and direct the coolant across the second heatsink and back to the first heatsink.

14. A plate system comprising:

a first plate including:

a wall,

stepped walls extending from opposite sides of the wall and perpendicular to a plane of the wall,

flange elements extending from the stepped walls and parallel to the plane of the wall, and

first prongs extending from the stepped walls toward the wall;

a second plate including:

a plate wall,

transition walls extending from opposite sides of the plate wall, and

second prongs extending from the transition walls toward the first plate,

wherein the second prongs are aligned with and configured to respectively move through and engage with engagement slots defined by the flange elements, and

wherein one or more of apertures defined by the flange elements or the first prongs is configured to secure the second plate to a substrate via the first plate.

15. The plate system of claim 14 , wherein the wall of the first plate and the plate wall of the second plate define a frame configured to house one or more heatsinks and a plurality of power modules.

16. The plate system of claim 14 , wherein a lip extends outwardly from each of the stepped walls of the first plate along a plane that is parallel to a plane of the wall, and wherein the first prongs extend toward the wall from the lips.

17. The plate system of claim 14 , wherein the plate wall is configured to elastically deform with an application of force on an inner surface of the plate wall.

18. The plate system of claim 14 , wherein the plate wall includes ribs that extend between the transition walls.

19. The plate system of claim 18 , wherein each of the ribs defines a curved structure configured to elastically deform against the second plate with an application of force on the second plate directed toward the first plate.

20. A module and cooling system subassembly comprising:

a cooling system;

one or more pair of power modules integrated into the cooling system;

a first plate including:

a wall extending across the cooling system,

stepped walls extending from opposite sides of the wall, and

flange elements extending outwardly from the stepped walls, each flange element defining an engagement slot;

a second plate including:

a plate wall extending across the cooling system,

transition walls extending from opposite sides of the plate wall, and

prongs extending from the transition walls toward the first plate and substantially perpendicular to an inner surface of the plate wall in contact with the cooling system; and

thermal interface material integrated into the cooling system,

wherein the prongs are aligned with and configured to engage the engagement slots.

Assignments (2)
CHANGE OF NAME Recorded Sep 18, 2024
From: DELPHI TECHNOLOGIES IP LIMITED
To: BORGWARNER US TECHNOLOGIES LLC
Reel/Frame 068987/0367 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 9, 2023
From: ROHL, BRYAN; FRUTH, CHRIS; CHOI, EDWARD; NAKANISHI, TODD
To: DELPHI TECHNOLOGIES IP LIMITED
Reel/Frame 062637/0128 →
Continuity (5)
Provisional Application 63378601 · Oct 6, 2022
Provisional Application 63377512 · Sep 28, 2022
Provisional Application 63377501 · Sep 28, 2022
Provisional Application 63377486 · Sep 28, 2022
Related Publication 20240107719A1 · Mar 28, 2024
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