Three-dimensional vertical nor flash thin-film transistor strings
A memory structure, includes active columns of polysilicon formed above a semiconductor substrate, each active column includes one or more vertical NOR strings, with each NOR string having thin-film storage transistors sharing a local source line and a local bit line, the local bit line is connected by one segment of a segmented global bit line to a sense amplifier provided in the semiconductor substrate.
1. A thin-film NOR memory string formed above a planar surface of a semiconductor substrate, the semiconductor substrate including circuitry formed therein or thereon for supporting memory circuit operations, comprising:
a common source region and a common drain region each extending lengthwise along a first direction substantially perpendicular to the planar surface;
a plurality of channel regions, each being provided between and in contact with both the common drain region and the common source region;
a plurality of regions of a data storage material, each region being associated with and in contact with a respective one of the channel regions; and
a plurality of gate electrodes that are spaced apart from each other and insulated from each other by a dielectric material, each gate electrode being positioned to be adjacent one of the channel regions, separated from that channel region by the associated region of the data storage material, each gate electrode extending lengthwise along a second direction substantially parallel the planar surface.
2. The thin-film NOR memory string of claim 1 , wherein each gate electrode, the common source region, the common drain region, the channel region to the gate electrode is adjacent and the region of the data storage region associated with that channel region together form a thin-film storage transistor.
3. The thin-film NOR memory string of claim 1 , wherein the data storage region comprises a charge-trapping material.
4. The thin-film NOR memory string of claim 1 , wherein the thin-film NOR memory string is formed in a semiconductor structure that further comprises:
a source line select transistor electrically coupled to the common source region and configured to receive a control signal that switches the source line select transistor between a conducting state and a non-conducting state; and
an interconnect conductor extending along a third direction substantially orthogonal to both the first and the second directions, the interconnect conductor electrically connecting the circuitry for supporting memory operations to the source line select transistor, such that, when the source line select transistor is in the conducting state, the common source region is electrically coupled to the circuitry for memory operations through the interconnect conductor.
5. The thin-film NOR memory string of claim 4 , wherein the interconnect conductor is provided above the thin-film NOR memory string.
6. The thin-film NOR memory string of claim 5 , wherein the source line select transistor comprises a thin-film transistor having a source region, a channel region and a drain region that are stacked along the first direction.
7. The thin-film NOR memory string of claim 1 , wherein the circuitry in the circuitry for supporting memory operations comprises one or more voltage sources.
8. The thin-film NOR memory string of claim 1 , wherein the thin-film NOR memory string is one thin-film NOR memory string in an array of thin-film NOR memory strings.
9. A memory structure formed above a planar surface of a semiconductor substrate, the semiconductor substrate including circuitry formed therein or thereon for supporting memory circuit operations, comprising:
an array of thin-film NOR memory strings including first, second and third thin-film NOR memory strings, the first, the second and the third thin-film NOR memory strings each being configured substantially as the thin-film NOR memory string of claim 1 ; first, second and third conductor segments, wherein (a) the first conductor segment is electrically connected to both the common drain region of the first thin-film NOR memory string and the common drain region of the second thin-film NOR memory string, (b) the second conductor segment is electrically connected to the common drain region of the third thin-film NOR memory string, and (c) the third conductor segment is electrically connected to the circuitry for supporting memory operations; and
first and second bit-line select transistors each configured to receive a control signal that causes the bit-line select transistor to switch between a conducting state and a non-conductive state, wherein (i) when the first bit-line select transistor is biased to its conducting state, the first bit-line select transistor connects the first conductor segment to the third conductor segment, and (ii) when the second bit-line select transistor is biased to its conducting state, the second bit-line select transistor connects the second conductor segment to the third conductor segment.
10. The memory structure of claim 9 , wherein the first and second conductor segments are provided between any one of the first, the second and the third thin-film NOR memory strings and the planar surface of the semiconductor substrate.
11. The memory structure of claim 9 , wherein both the first and the second bit-line select transistors are formed in the semiconductor substrate.
12. The memory structure of claim 9 , wherein the first, the second and the third conductor segments are each provided above the thin-film NOR memory strings.
13. The memory structure of claim 12 , wherein both the first and the second bit-line select transistors are formed between the first and the third conductor segments.
14. The memory structure of claim 9 , wherein the first bit-line select transistor and the second bit-line select transistor each comprise a thin-film transistor having a source region, a channel region and a drain region that are stacked along the first direction.
15. The memory structure of claim 9 , further comprising:
first, second and third source line select transistors electrically coupled respectively to the common source regions of the first, the second and the third thin-film NOR memory strings, each source line select transistor having a control terminal configured for receiving a control signal that switches the source line select transistor between a conducting state and a non-conducting state; and
first and second interconnect conductors each electrically coupled to the circuitry for supporting memory operations and each extending along a third direction substantially orthogonal to both the first and second directions, wherein the first interconnect conductor is electrically coupled to both the first and second source line select transistors and the second interconnect conductor is electrically coupled to the third source line select transistor, such that, when any of the first, the second and the third source line select transistors is in its conducting state, the common source region of the respective thin-film NOR memory string is electrically coupled to the circuitry for supporting memory operations through its electrically coupled source line select transistor.
16. The memory structure of claim 15 , wherein the first and the second interconnect conductors are provided above at least one of the first, the second and the third thin-film NOR memory strings.
17. The memory structure of claim 15 , further comprising a fourth thin-film NOR memory string (“charging column”) configured substantially the same as the first thin-film NOR memory string, the fourth thin-film NOR memory string having a common source region electrically coupled to the first and second interconnect conductors and a common drain region electrically coupled to the circuitry for supporting memory operations, wherein the charging column provides a current drawn from the circuitry for supporting memory operations to pre-charge any common source region electrically coupled to the first or the second interconnect conductor by its source line select transistor, prior to a read, programming or erase operation.
18. The memory structure of claim 17 , wherein one or more of the channel regions in the charging column are conducting during the pre-charging.
19. The memory structure of claim 17 , further comprising, a source-line select transistor that connects the circuitry for supporting memory operations to the fourth interconnect conductor.
20. The memory structure of claim 15 , wherein the first and the second interconnect conductors are each one interconnect conductor in a group of conductor segments formed in plane substantially parallel to the planar surface.
21. The memory structure of claim 9 , wherein the array of thin-film NOR memory strings is organized as rows and columns of thin-film NOR memory string, each row of thin-film NOR memory strings extending along a third direction.
22. The memory structure of claim 21 , wherein the thin-film NOR memory strings within the array of thin-film NOR memory strings are isolated from each other by an isolation dielectric material or by an air gap.
23. The memory structure of claim 9 , wherein the gate electrode of each thin-film NOR memory string in the array of thin-film NOR memory strings terminates at a staircase structure and wherein each gate electrode is electrically coupled at the staircase structure by conductor-filled vias to the circuitry for supporting memory operations.
24. The memory structure of claim 9 , wherein the common source regions of the first and the third thin-film NOR memory strings are implemented by the same semiconductor layer.
25. The memory structure of claim 9 , wherein the common drain regions of the first and the third thin-film NOR memory strings are implemented by the same semiconductor layer.
26. The thin-film NOR memory string of claim 1 , wherein the circuitry for supporting memory operations comprises sense amplifiers that are distributed throughout the planar surface of the semiconductor substrate.
27. The thin-film NOR memory string of claim 1 , further comprising a pre-charge transistor that, when biased to a conducting state, electrically connects the common source region and the common drain region.
28. The thin-film NOR memory string of claim 1 , wherein the circuitry for supporting memory operation comprises a body bias voltage source, wherein the channel regions of the thin-film NOR memory string are connected to the body bias voltage source.
29. The thin-film NOR memory string of claim 1 , wherein the gate electrodes are insulated from each other by an isolation dielectric material or air gap.
30. A composite memory structure comprising first and second modular memory structures provided one on top of the other, wherein each modular memory structure comprises a memory structure as the memory structure of claim 9 .
31. The composite memory structure of claim 30 , wherein the first and second modular memory structures are isolated from each other by a dielectric layer.
32. The composite memory structure of claim 31 , wherein the thin-film NOR memory strings in the first and the second modular memory structures are aligned along the first direction and wherein the common source regions of corresponding thin-film NOR memory strings of the first and second modular memory structures are connected by conductor-filled vias through the dielectric layer.
33. The thin-film NOR memory string of claim 1 , further comprising metallic pylons embedded in both the common source region and the common drain region.
34. The thin-film NOR memory string of claim 33 , wherein the metallic pylons each comprises one or more of titanium nitride, tungsten nitride or tungsten.
35. The thin-film NOR memory string of claim 32 , wherein each metallic pylon is formed using an atomic layer deposition technique.
36. The thin-film NOR memory string of claim 1 , wherein the channel regions each comprise a first section and a second section, and wherein the first section serves as a channel region for one of the thin-film memory transistors of the thin-film NOR memory string and wherein the second section has a dopant concentration multiple times that of the first section.
37. The thin-film NOR memory string of claim 1 , wherein the common source region and the common drain region are each implemented by a plurality of electrically connected conductive layers.
38. The thin-film NOR memory string of claim 1 , wherein the data storage material comprises one or more of: silicon nitride, conductive nanodots embedded in a non-conducting dielectric material, an isolated floating gate, and an oxide-nitride-oxide triple-laver.
39. The thin-film NOR memory string of claim 38 , wherein each region of the data storage material is capped by a layer of blocking dielectric, or a high dielectric constant film.
40. The thin-film NOR memory string of claim 39 , wherein the high dielectric constant film comprises aluminum oxide, hafnium oxide or any combination thereof.
41. The thin-film NOR memory string of claim 1 , wherein each channel region is substantially semi-annular.
42. The thin-film NOR memory string of claim 40 , wherein the data storage material forms an annular ring enclosing the channel regions.