IP Library Granted Patent US 12,277,465
Granted Patent B2
US 12,277,465 · App. 18/227,499 · Granted Apr 15, 2025

Removable memory card with efficient card lock mechanism, XY ratios, and pads layout

Inventor: Yoseph Pinto (Tel Aviv, IL)
Assignee: Sandisk Technologies, Inc.
G06K19/07743
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Quick Facts
Patent No.
US 12,277,465
App. No.
18/227,499
Granted
Apr 15, 2025
Kind
B2
Abstract

A memory card is provided with various pad layouts to prevent a data signal pad from contacting a power contact in a host during insertion and removal of the memory card. The memory card can have a form factor and features that accommodate a relatively-large memory with relatively-high performance and accompanying thermal conditions. An efficient card lock mechanism is also provided.

Claims (52)

1. A memory card comprising:

a top surface; and

a bottom surface opposite the top surface, wherein the bottom surface comprises a plurality of pads;

wherein:

a first row of pads located toward a front of the memory card comprises a plurality of pads, none of which is a power pad;

a last row of pads located toward a rear of the memory card comprises at least one power pad;

the at least one power pad is positioned on the memory card such that there are no other non-power pads between the at least one power pad and the front of the memory card;

a width of the memory card is larger than a length of the memory card, wherein the width of the memory card corresponds to a back edge of the memory card in a direction of insertion into a host; and

a distance between two adjacent pads of the plurality of pads in the first row is about 0.15 mm.

2. The memory card of claim 1 , wherein the width of the memory card is about 18 mm and the length of the memory card is about 14 mm.

3. The memory card of claim 1 , wherein the width of the memory card is about 18 mm and the length of the memory card is about 16 mm.

4. The memory card of claim 1 , wherein a thickness of a portion of the memory card is between about 1.0 mm and about 1.4 mm.

5. The memory card of claim 1 , wherein a thickness of a portion of the memory card is between about 1.4 mm and about 2 mm.

6. The memory card of claim 1 , wherein:

a thickness of a first portion of the memory card is between about 1.0 mm and about 1.4 mm; and

a thickness of a second portion of the memory card is between about 1.4 mm and about 2 mm.

7. The memory card of claim 1 , wherein the at least one power pad comprises one or more power pads located at a first end of the last row and one or more power pads located at a second end of the last row.

8. The memory card of claim 7 , wherein:

the one or more power pads located at the first end of the last row comprise three power pads; and

the one or more power pads located at the second end of the last row comprise three power pads.

9. The memory card of claim 7 , wherein:

the one or more power pads located at the first end of the last row comprise a single power pad; and

the one or more power pads located at the second end of the last row comprise a single power pad.

10. The memory card of claim 9 , wherein the single power pad at the first end of the last row and/or the single power pad at the second end of the last row is larger than any other pad of the plurality of pads.

11. The memory card of claim 9 , wherein the single power pad at the first end of the last row and/or the single power pad at the second end of the last row is about 1.5 mm×about 2.5 mm.

12. The memory card of claim 1 , wherein the plurality of pads comprises at least one pad comprising a length of about 1.6 mm to about 1.65 mm.

13. The memory card of claim 12 , wherein the plurality of pads comprises at least one additional pad comprising a length of about 1.35 mm.

14. The memory card of claim 1 , wherein the plurality of pads comprises at least one pad comprising a width of about 0.70 mm to about 0.72 mm.

15. The memory card of claim 1 , further comprising a microSD™ card locking mechanism.

16. A memory card comprising:

a top surface; and

a bottom surface opposite the top surface, wherein the bottom surface comprises a plurality of pads;

wherein:

a first row of pads located toward a front of the memory card comprises a plurality of pads, none of which is a power pad;

a last row of pads located toward a rear of the memory card comprises at least one power pad;

the at least one power pad is positioned on the memory card such that there are no other non-power pads between the at least one power pad and the front of the memory card;

the at least one power pad comprises one or more power pads located at a first end of the last row and one or more power pads located at a second end of the last row;

a width of the memory card is about 18 mm and a length of the memory card is about 14 mm, wherein the width of the memory card corresponds to a back edge of the memory card in a direction of insertion into a host; and

a distance between two adjacent pads of the plurality of pads in the first row is about 0.15 mm.

17. The memory card of claim 16 , wherein:

the one or more power pads located at the first end of the last row comprise three power pads; and

the one or more power pads located at the second end of the last row comprise three power pads.

18. The memory card of claim 16 , wherein:

the one or more power pads located at the first end of the last row comprise a single power pad; and

the one or more power pads located at the second end of the last row comprise a single power pad.

19. A memory card comprising:

a top surface;

a bottom surface opposite the top surface, wherein the bottom surface comprises a plurality of pads; and

means for preventing a signal pad of the plurality of pads from contacting a power pad of a host during insertion and removal of the memory card;

wherein:

a width of the memory card is about 18 mm and a length of the memory card is about 16 mm, wherein the width of the memory card corresponds to a back edge of the memory card in a direction of insertion into the host; and

a distance between two adjacent pads of the plurality of pads is about 0.15 mm.

Assignments (8)
PARTIAL RELEASE OF SECURITY INTERESTS Recorded Apr 25, 2025
From: JPMORGAN CHASE BANK, N.A., AS AGENT
To: SANDISK TECHNOLOGIES, INC.
Reel/Frame 071382/0001 →
SECURITY AGREEMENT Recorded Apr 25, 2025
From: SANDISK TECHNOLOGIES, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 071050/0001 →
PATENT COLLATERAL AGREEMENT Recorded Aug 23, 2024
From: SANDISK TECHNOLOGIES, INC.
To: JPMORGAN CHASE BANK, N.A., AS THE AGENT
Reel/Frame 068762/0494 →
CHANGE OF NAME Recorded Jun 27, 2024
From: SANDISK TECHNOLOGIES, INC.
To: SANDISK TECHNOLOGIES, INC.
Reel/Frame 067982/0032 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 29, 2024
From: WESTERN DIGITAL TECHNOLOGIES, INC.
To: SANDISK TECHNOLOGIES, INC.
Reel/Frame 067567/0682 →
PATENT COLLATERAL AGREEMENT - DDTL Recorded Nov 21, 2023
From: WESTERN DIGITAL TECHNOLOGIES, INC.
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 065657/0158 →
PATENT COLLATERAL AGREEMENT- A&R Recorded Nov 21, 2023
From: WESTERN DIGITAL TECHNOLOGIES, INC.
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 065656/0649 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 31, 2023
From: PINTO, YOSEPH
To: WESTERN DIGITAL TECHNOLOGIES, INC.
Reel/Frame 064441/0828 →
Continuity (2)
Provisional Application 63522206 · Jun 21, 2023
Related Publication 20240428038A1 · Dec 26, 2024
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Cited By (1)
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