Methods for producing a 3D semiconductor device and structure with memory cells and multiple metal layers
A method for producing 3D semiconductor devices including: providing a first level including first transistors and a first single crystal layer; forming a first metal layer on top of the first level; forming a second metal layer on top of the first metal layer; forming at least one second level on top of or above the second metal layer; performing a lithography step on the second level; forming at least one third level on top of or above the second level; performing processing steps to form first memory cells within the second level and second memory cells within the third level, where the first memory cells include at least one second transistor, the second memory cells include at least one third transistor, first transistors control power delivery to some second transistors; and then forming at least four independent memory arrays which include some first memory cells and/or second memory cells.
1. A method for producing a 3D semiconductor device, the method comprising:
providing a first level, said first level comprising a first single crystal layer;
forming a first metal layer on top of said first level;
forming a second metal layer on top of said first metal layer;
forming at least one second level disposed on top of or above said second metal layer;
performing a first lithography step on said second level;
forming at least one third level disposed on top of or above said at least one second level;
performing additional processing steps to form a plurality of first memory cells within said at least one second level;
performing said additional processing steps to form a plurality of second memory cells within said at least one third level,
wherein said additional processing steps comprise deposition processes and etch processes,
wherein each of said plurality of first memory cells comprises at least one second transistor,
wherein each of said plurality of second memory cells comprises at least one third transistor,
wherein said first level comprises a plurality of first transistors, and
wherein at least one of said first transistors control delivery of power to at least one of said second transistor; and then
forming at least four independent memory arrays,
wherein said at least four independent memory arrays comprise portions of said plurality of first memory cells and/or portions of said plurality of second memory cells.
2. The method according to claim 1 , further comprising:
forming a third metal layer disposed on top of or above said at least one third level; and
forming a through layer via (TLV) connecting said third metal layer to said second metal layer,
wherein said through layer via comprises an average diameter of less than 400 nm.
3. The method according to claim 1 , further comprising:
performing a second lithography step on said third level after said step of forming at least one third level.
4. The method according to claim 1 , further comprising:
forming peripheral circuitry on top of said third level,
wherein said peripheral circuitry comprises single crystal transistors.
5. The method according to claim 1 ,
wherein said second transistors comprise gate electrodes, and
wherein said gate electrodes comprise metal.
6. The method according to claim 1 , further comprising:
forming a plurality of single crystal transistors within said first level prior to said step of forming a first metal layer.
7. The method according to claim 1 , further comprising:
performing a bonding step of a support wafer disposed on top of said third level,
wherein said bonding comprises oxide to oxide bonds.
8. A method for producing a 3D semiconductor device, the method comprising:
providing a first level, said first level comprising a first single crystal layer;
forming a first metal layer on top of said first level;
forming a second metal layer on top of said first metal layer;
forming at least one second level disposed on top of or above said second metal layer;
performing a first lithography step on said second level;
forming at least one third level disposed on top of or above said at least one second level;
performing additional processing steps to form a plurality of first memory cells within said at least one second level;
performing said additional processing steps to form a plurality of second memory cells within said at least one third level,
wherein said additional processing steps comprise deposition processes and etch processes,
wherein each of said plurality of first memory cells comprises at least one second transistor,
wherein each of said plurality of second memory cells comprises at least one third transistor;
forming a third metal layer disposed on top of or above said at least one third level; and
forming a through layer via (TLV) connecting said third metal layer to said second metal layer,
wherein said through layer via comprises an average diameter of less than 400 nm; and
forming at least four independent memory arrays,
wherein said at least four independent memory arrays comprise portions of said plurality of first memory cells and/or portions of said plurality of second memory cells.
9. The method according to claim 8 ,
wherein said first metal layer has an average thickness which is 50% greater than an average thickness of said second metal layer.
10. The method according to claim 8 , further comprising:
performing a second lithography step on said third level after said step of forming at least one third level.
11. The method according to claim 8 , further comprising:
forming peripheral circuitry on top of said third level,
wherein said peripheral circuitry comprises single crystal transistors.
12. The method according to claim 8 ,
wherein said second transistors comprise gate electrodes, and
wherein said gate electrodes comprise metal.
13. The method according to claim 8 , further comprising:
forming a plurality of single crystal transistors within said first level prior to said step of forming a first metal layer.
14. The method according to claim 8 , further comprising:
performing a bonding step of a support wafer disposed on top of said third level,
wherein said bonding comprises oxide to oxide bonds.
15. A method for producing a 3D semiconductor device, the method comprising:
providing a first level, said first level comprising a first single crystal layer;
forming a first metal layer on top of said first level;
forming a second metal layer on top of said first metal layer;
forming at least one second level disposed on top of or above said second metal layer;
performing a first lithography step on said second level;
forming at least one third level disposed on top of or above said at least one second level;
performing additional processing steps to form a plurality of first memory cells within said at least one second level;
performing said additional processing steps to form a plurality of second memory cells within said at least one third level,
wherein said additional processing steps comprise deposition processes and etch processes,
wherein each of said plurality of first memory cells comprises at least one second transistor,
wherein each of said plurality of second memory cells comprises at least one third transistor, and
wherein said first metal layer has an average thickness which is 50% greater than an average thickness of said second metal layer; and
forming at least four independent memory arrays,
wherein said at least four independent memory arrays comprise portions of said plurality of first memory cells and/or portions of said plurality of second memory cells.
16. The method according to claim 15 , further comprising:
forming a third metal layer disposed on top of or above said at least one third level; and
forming a through layer via (TLV) connecting said third metal layer to said second metal layer,
wherein said through layer via comprises an average diameter of less than 400 nm, and
wherein said forming a through layer via (TLV) comprises the use of ALD (Atomic Layer Deposition).
17. The method according to claim 15 , further comprising:
performing a second lithography step on said third level after said step of forming at least one third level.
18. The method according to claim 15 ,
wherein said second transistors comprise gate electrodes, and
wherein said gate electrodes comprise metal.
19. The method according to claim 15 , further comprising:
forming a plurality of single crystal transistors within said first level prior to said step of forming a first metal layer.
20. The method according to claim 15 , further comprising:
performing a bonding step of a support wafer disposed on top said third level,
wherein said bonding comprises oxide to oxide bonds.