IP Library Granted Patent US 12,300,974
Granted Patent B2
US 12,300,974 · App. 18/244,752 · Granted May 13, 2025

Laser architectures using quantum well intermixing techniques

Inventors: Alfredo Bismuto (Sunnyvale, CA); Mark Alan Arbore (Los Altos, CA); Ross M. Audet (Menlo Park, CA)
Assignee: Apple Inc.
H01S5/4087H01S5/04256H01S5/162H01S5/2059H01S5/2228H01S5/3414
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 12,300,974
App. No.
18/244,752
Granted
May 13, 2025
Kind
B2
Abstract

A laser chip including a plurality of stripes is disclosed, where a laser stripe can be grown with an initial optical gain profile, and its optical gain profile can be shifted by using an intermixing process. In this manner, multiple laser stripes can be formed on the same laser chip from the same epitaxial wafer, where at least one laser stripe can have an optical gain profile shifted relative to another laser stripe. For example, each laser stripe can have a shifted optical gain profile relative to its neighboring laser stripe, thereby each laser stripe can emit light with a different range of wavelengths. The laser chip can emit light across a wide range of wavelengths. Examples of the disclosure further includes different regions of a given laser stripe having different intermixing amounts.

Claims (42)

1. A laser chip comprising:

an epitaxial wafer comprising a plurality of laser stripes including at least two adjacent and parallel laser stripes, each respective laser stripe comprising:

respective one or more first sub-regions along an active region of the respective laser stripe, the one or more first sub-regions including a respective first transition energy; and

respective one or more second sub-regions along the active region, the one or more second sub-regions including a respective second transition energy different from the respective first transition energy, wherein:

the second transition energy is different from the respective first transition energy;

the one or more first sub-regions include an epitaxial wafer, and the one or more second sub-regions include the epitaxial wafer.

2. The laser chip of claim 1 , further comprising:

an unexposed laser stripe, the unexposed laser stripe including a third transition energy,

wherein the third transition energy is same as a transition energy of the epitaxial wafer.

3. The laser chip of claim 1 , wherein at least one respective first sub-regions are located proximate to facets of the respective laser stripe, and the respective one or more second sub-regions are located proximate to a gain region of the respective at least one laser stripe.

4. The laser chip of claim 3 , wherein the plurality of laser stripes includes another laser stripe exhibiting a transition energy matching at least one respective first transition energy or respective second transition energy.

5. A laser chip comprising:

an epitaxial wafer comprising:

an epitaxial stack formed in the epitaxial wafer, the epitaxial stack defining a quantum well structure comprising multiple regions, each respective region comprising a respective amount of dopant diffusion within the quantum well structure; and

a cladding layer disposed over the epitaxial stack, the cladding layer comprising a set of etched channels between each adjacent region of the multiple regions of the epitaxial stack, the set of etched channels defining a set of ridge waveguides each positioned over a respective one region of the multiple regions of the epitaxial stack.

6. The laser chip of claim 5 , wherein a first region of the multiple regions of the epitaxial stack exhibits a first transition energy and a second region of the multiple regions of the epitaxial stack exhibits a second transition energy different from the first transition energy.

7. The laser chip of claim 5 , comprising an electrode disposed over at least one ridge waveguide of the set of ridge waveguides.

8. The laser chip of claim 5 , wherein each region of the multiple region of the epitaxial stack exhibits a different transition energy.

9. The laser chip of claim 8 , wherein each region of the epitaxial stack stimulates emission of a different wavelength of light.

10. The laser chip of claim 5 , wherein at least one region of the multiple regions comprises a rectangular shape.

11. The laser chip of claim 10 , wherein each region of the multiple regions comprises a rectangular shape, and each region is arranged parallel to each other respective region of the multiple regions.

12. The laser chip of claim 5 , wherein:

at least one region of the multiple regions comprises a first subregion and a second subregion;

the first subregion exhibits a first transition energy; and

the second subregion exhibits a second transition energy different form the first transition energy.

13. The laser chip of claim 5 , wherein each region of the quantum well structure defines a respective one laser stripe.

14. The laser chip of claim 5 , wherein at least one region of the quantum well structure comprises a dopant diffusion equivalent to an undoped region of the quantum well structure.

15. The laser chip of claim 14 , wherein the at least one region has a transition energy different from each respective transition energy of each other region of the multiple regions of the quantum well structure.

16. A laser chip comprising:

an epitaxial wafer comprising:

an epitaxial stack; and

a cladding layer formed over the epitaxial stack defining an upper surface and comprising:

a first channel etched into the upper surface;

a second channel etched into the upper surface and oriented parallel to the first channel;

a first ridge waveguide between the first channel and the second channel, the first ridge waveguide formed over a first region of the epitaxial stack exhibiting a first dopant diffusion amount;

a third channel etched into the upper surface and oriented parallel to the second channel and offset from the second waveguide;

a fourth channel etched into the upper surface and oriented parallel to the third channel; and

a second ridge waveguide between the third channel and the fourth channel, the second ridge waveguide formed over a second region of the epitaxial stack exhibiting a second dopant diffusion amount different form the first dopant diffusion amount.

17. The laser chip of claim 16 , where the first region of the epitaxial stack defines a first laser stripe and the second region of the epitaxial stack defines a second laser stripe.

18. The laser chip of claim 17 , wherein the first laser stripe emits a first wavelength of light and the second laser stripe emits a second wavelength of light.

19. The laser chip of claim 18 , wherein the first wavelength is greater than the second wavelength.

20. The laser chip of claim 16 , wherein the first waveguide has a rectangular shape.

Continuity (4)
Continuation 17478670 · Sep 17, 2021
Continuation 16649965
Provisional Application 62564419 · Sep 28, 2017
Related Publication 20240113508A1 · Apr 4, 2024
References Cited (223)
US 4227091A · Sick · 1980 [cited by applicant]
US 4318058A · Mito · 1982 [cited by examiner]
US 4880304A · Jaeb · 1989 [cited by applicant]
US 4896325A · Coldren · 1990 [cited by applicant]
US 5140605A · Paoli · 1992 [cited by applicant]
US 5159700A · Reid · 1992 [cited by applicant]
US 5287376A · Paoli · 1994 [cited by examiner]
US 5319725A · Buchmann et al. · 1994 [cited by applicant]
US 5325392A · Tohmori · 1994 [cited by applicant]
US 5341391A · Ishimura · 1994 [cited by applicant]
US 5384797A · Welch · 1995 [cited by examiner]
US 5483261A · Yasutake · 1996 [cited by applicant]
US 5488204A · Mead et al. · 1996 [cited by applicant]
US 5515391A · Endriz · 1996 [cited by applicant]
US 5574561A · Boudreau · 1996 [cited by applicant]
US 5695520A · Bruckner et al. · 1997 [cited by applicant]
US 5708674A · Beernink · 1998 [cited by examiner]
US 5742631A · Paoli · 1998 [cited by applicant]
US 5780875A · Tsuji · 1998 [cited by applicant]
US 5825352A · Bisset et al. · 1998 [cited by applicant]
US 5835079A · Shieh · 1998 [cited by applicant]
US 5850411A · Major, Jr. · 1998 [cited by examiner]
US 5880411A · Gillespie et al. · 1999 [cited by applicant]
US 5898806A · Nishimoto · 1999 [cited by applicant]
US 5915165A · Sun · 1999 [cited by applicant]
US 6043104A · Uchida · 2000 [cited by examiner]
US 6160936A · You et al. · 2000 [cited by applicant]
US 6188391B1 · Seely et al. · 2001 [cited by applicant]
US 6250819B1 · Porte · 2001 [cited by applicant]
US 6263222B1 · Diab · 2001 [cited by applicant]
US 6310610B1 · Beaton et al. · 2001 [cited by applicant]
US 6341116B1 · Lee · 2002 [cited by applicant]
US 6345135B1 · Reid · 2002 [cited by applicant]
US 6373872B2 · Deacon · 2002 [cited by applicant]
US 6393185B1 · Deacon et al. · 2002 [cited by applicant]
US 6475153B1 · Khair et al. · 2002 [cited by applicant]
US 6516017B1 · Matsumoto · 2003 [cited by applicant]
US 6558335B1 · Thede · 2003 [cited by applicant]
US 6605045B2 · Ohsaki et al. · 2003 [cited by applicant]
US 6628686B1 · Sargent · 2003 [cited by applicant]
US 6643434B2 · Cayrefourcq et al. · 2003 [cited by applicant]
US 6647032B1 · Lee et al. · 2003 [cited by applicant]
US 6661955B1 · Calvet · 2003 [cited by applicant]
US 6690387B2 · Zimmerman et al. · 2004 [cited by applicant]
US 6690693B1 · Crowder · 2004 [cited by applicant]
US 6699199B2 · Asada et al. · 2004 [cited by applicant]
US 6788719B2 · Crowder · 2004 [cited by applicant]
US 6795453B2 · Pezeskhi et al. · 2004 [cited by applicant]
US 6803604B2 · Takahashi et al. · 2004 [cited by applicant]
US 6807206B2 · Tuskiji et al. · 2004 [cited by applicant]
US 6816529B2 · Vail · 2004 [cited by applicant]
US 6829400B2 · Nakano et al. · 2004 [cited by applicant]
US 6911629B2 · Lano et al. · 2005 [cited by applicant]
US 6915955B2 · Jung · 2005 [cited by applicant]
US 6987906B2 · Nakama et al. · 2006 [cited by applicant]
US 6990129B2 · Buimovich et al. · 2006 [cited by applicant]
US 7015894B2 · Morohoshi · 2006 [cited by applicant]
US 7106778B2 · Reid · 2006 [cited by applicant]
US 7130325B2 · Oh et al. · 2006 [cited by applicant]
US 7184064B2 · Zimmerman et al. · 2007 [cited by applicant]
US 7189011B2 · Harker · 2007 [cited by applicant]
US 7196355B2 · De La Grandiere et al. · 2007 [cited by applicant]
US 7283242B2 · Thornton · 2007 [cited by applicant]
US 7394734B2 · Ishimoto et al. · 2008 [cited by applicant]
US 7468637B2 · Braun et al. · 2008 [cited by applicant]
US 7469092B2 · Sappey et al. · 2008 [cited by applicant]
US 7480317B2 · Hu et al. · 2009 [cited by applicant]
US 7483453B2 · Diffily et al. · 2009 [cited by applicant]
US 7526007B2 · Chua et al. · 2009 [cited by applicant]
US 7558301B2 · Lin et al. · 2009 [cited by applicant]
US 7616110B2 · Crump et al. · 2009 [cited by applicant]
US 7620078B2 · Mori · 2009 [cited by applicant]
US 7663607B2 · Hotelling et al. · 2010 [cited by applicant]
US 7664156B2 · Yamazaki · 2010 [cited by applicant]
US 7701985B2 · Webster et al. · 2010 [cited by applicant]
US 7738935B1 · Turcott · 2010 [cited by applicant]
US 7751658B2 · Welch et al. · 2010 [cited by applicant]
US 7852898B2 · Yokoyama et al. · 2010 [cited by applicant]
US 7885302B2 · Eberhard · 2011 [cited by applicant]
US 7903704B2 · Patel et al. · 2011 [cited by applicant]
US 8000368B2 · Pezeshki · 2011 [cited by applicant]
US 8121169B2 · Nguyen et al. · 2012 [cited by applicant]
US 8222084B2 · Dallesasse et al. · 2012 [cited by applicant]
US 8259770B2 · Tagansky · 2012 [cited by applicant]
US 8279441B2 · Brown · 2012 [cited by applicant]
US 8320763B2 · Kim et al. · 2012 [cited by applicant]
US 8352008B2 · Kuhn et al. · 2013 [cited by applicant]
US 8378811B2 · Crump et al. · 2013 [cited by applicant]
US 8405699B2 · Niwa et al. · 2013 [cited by applicant]
US 8437825B2 · Dalvi et al. · 2013 [cited by applicant]
US 8442608B2 · Pav · 2013 [cited by applicant]
US 8457172B2 · Reid et al. · 2013 [cited by applicant]
US 8588266B2 · Fujii · 2013 [cited by applicant]
US 8618930B2 · Papadopoulos et al. · 2013 [cited by applicant]
US 8649839B2 · Chin · 2014 [cited by applicant]
US 8750341B2 · Bazzani · 2014 [cited by applicant]
US 8774243B2 · Kim et al. · 2014 [cited by applicant]
US 8781548B2 · Besko et al. · 2014 [cited by applicant]
US 8805129B2 · Han et al. · 2014 [cited by applicant]
US 8886465B2 · Cinbis et al. · 2014 [cited by applicant]
US 8954135B2 · Yuen et al. · 2015 [cited by applicant]
US 8964806B2 · Ensher et al. · 2015 [cited by applicant]
US 8995483B2 · Diehl et al. · 2015 [cited by applicant]
US 9065251B2 · Fukuda et al. · 2015 [cited by applicant]
US 9093813B2 · Pushkarsky et al. · 2015 [cited by applicant]
US 9172211B2 · Kuksenkov et al. · 2015 [cited by applicant]
US 9209602B2 · Davies et al. · 2015 [cited by applicant]
US 9323012B1 · Sun et al. · 2016 [cited by applicant]
US 9425365B2 · Kurtin · 2016 [cited by applicant]
US 9526421B2 · Papadopoulos et al. · 2016 [cited by applicant]
US 9526431B2 · Zakharov et al. · 2016 [cited by applicant]
US 9529160B2 · Orcutt et al. · 2016 [cited by applicant]
US 9543736B1 · Barwicz et al. · 2017 [cited by applicant]
US 9577410B2 · Yamazaki · 2017 [cited by applicant]
US 9595804B2 · Minneman et al. · 2017 [cited by applicant]
US 9755399B2 · Tulip · 2017 [cited by applicant]
US 9759652B2 · Yu · 2017 [cited by applicant]
US 9780266B2 · Lotito et al. · 2017 [cited by applicant]
US 9804027B2 · Fish · 2017 [cited by applicant]
US 9829631B2 · Lambert · 2017 [cited by applicant]
US 9882073B2 · Krasulick et al. · 2018 [cited by applicant]
US 9883824B2 · Tiao · 2018 [cited by applicant]
US 9888838B2 · Ito et al. · 2018 [cited by applicant]
US 9935426B2 · Kaneko · 2018 [cited by applicant]
US 9948063B2 · Caneau et al. · 2018 [cited by applicant]
US 10004408B2 · Naima · 2018 [cited by applicant]
US 10060788B2 · Fei · 2018 [cited by applicant]
US 10078183B2 · Adderly et al. · 2018 [cited by applicant]
US 10082625B2 · Budd · 2018 [cited by applicant]
US 10098555B2 · Yamaji · 2018 [cited by applicant]
US 10168497B2 · Merget · 2019 [cited by applicant]
US 10181696B2 · Evans et al. · 2019 [cited by applicant]
US 10215698B2 · Han et al. · 2019 [cited by applicant]
US 10319693B2 · Lambert · 2019 [cited by applicant]
US 10319878B2 · Ulmer et al. · 2019 [cited by applicant]
US 10413362B2 · Griffin · 2019 [cited by applicant]
US 10433739B2 · Weekly et al. · 2019 [cited by applicant]
US 10535979B2 · Audet et al. · 2020 [cited by applicant]
US 10678005B2 · Kinghorn · 2020 [cited by applicant]
US 10687718B2 · Allec et al. · 2020 [cited by applicant]
US 10697830B1 · Kangas et al. · 2020 [cited by applicant]
US 10710495B2 · Ichikawa et al. · 2020 [cited by applicant]
US 10788368B1 · Pelc et al. · 2020 [cited by applicant]
US 10852492B1 · Vermeulen et al. · 2020 [cited by applicant]
US 10868407B2 · Mathai et al. · 2020 [cited by applicant]
US 10895568B2 · Barwicz et al. · 2021 [cited by applicant]
US 10973446B2 · Schie · 2021 [cited by applicant]
US 11036015B2 · Shikama et al. · 2021 [cited by applicant]
US 11158996B2 · Bismuto · 2021 [cited by examiner]
US 11171464B1 · Bishop et al. · 2021 [cited by applicant]
US 11181702B2 · Chen et al. · 2021 [cited by applicant]
US 11385409B2 · Ishikawa · 2022 [cited by applicant]
US 11409059B1 · Vermeulen · 2022 [cited by applicant]
US 11437779B2 · Audet et al. · 2022 [cited by applicant]
US 11469570B2 · Audet et al. · 2022 [cited by applicant]
US 11493705B2 · Shikama · 2022 [cited by applicant]
US 11552454B1 · Arbore et al. · 2023 [cited by applicant]
US 11644618B2 · Bishop et al. · 2023 [cited by applicant]
US 11686906B1 · Venkatesan · 2023 [cited by applicant]
US 11777279B2 · Bismuto et al. · 2023 [cited by applicant]
US 20010055447A1 · Delprat et al. · 2001 [cited by applicant]
US 20020181521A1 · Crowder et al. · 2002 [cited by applicant]
US 20040126117A1 · Lo · 2004 [cited by examiner]
US 20040161206A1 · Harker · 2004 [cited by examiner]
US 20040174915A1 · Sarlet et al. · 2004 [cited by applicant]
US 20040255318A1 · Braetberg et al. · 2004 [cited by applicant]
US 20050127383A1 · Kikawa et al. · 2005 [cited by applicant]
US 20050169327A1 · Eden et al. · 2005 [cited by applicant]
US 20060088068A1 · Farrell et al. · 2006 [cited by applicant]
US 20070116076A1 · Wang et al. · 2007 [cited by applicant]
US 20070223549A1 · Livshits et al. · 2007 [cited by applicant]
US 20080063016A1 · Bhatia et al. · 2008 [cited by applicant]
US 20080310470A1 · Ooi et al. · 2008 [cited by applicant]
US 20090086782A1 · Yokoyama · 2009 [cited by examiner]
US 20100046562A1 · Donegan et al. · 2010 [cited by applicant]
US 20130292571A1 · Mukherjee et al. · 2013 [cited by applicant]
US 20160296173A1 · Culbert · 2016 [cited by applicant]
US 20170033531A1 · Treese et al. · 2017 [cited by applicant]
US 20170045450A1 · Lieber et al. · 2017 [cited by applicant]
US 20170249445A1 · Devries et al. · 2017 [cited by applicant]
US 20170325744A1 · Allec et al. · 2017 [cited by applicant]
US 20180054038A1 · Kim · 2018 [cited by applicant]
US 20180083421A1 · Audet et al. · 2018 [cited by applicant]
US 20180175587A1 · Mathai · 2018 [cited by examiner]
US 20200227895A1 · Takigawa · 2020 [cited by examiner]
US 20220046774A1 · Kersey et al. · 2022 [cited by applicant]
US 20220061135A1 · Gu et al. · 2022 [cited by applicant]
US 20220131340A1 · Bishop et al. · 2022 [cited by applicant]
US 20230076055A1 · Vallance et al. · 2023 [cited by applicant]
US 20230102867A1 · Kawabe et al. · 2023 [cited by applicant]
US 20230163573A1 · Arbore et al. · 2023 [cited by applicant]
CN 1173226A · 1998 [cited by applicant]
CN 1416533A · 2003 [cited by applicant]
CN 1488183A · 2004 [cited by applicant]
CN 1703783A · 2005 [cited by applicant]
CN 102522697 · 2012 [cited by applicant]
CN 104393482 · 2015 [cited by applicant]
CN 205680923U · 2016 [cited by applicant]
CN 114303038A · 2022 [cited by applicant]
DE 102008014093A1 · 2009 [cited by applicant]
DE 102010020625A1 · 2011 [cited by applicant]
EP 0203810A2 · 1986 [cited by applicant]
EP 1753104 · 2007 [cited by applicant]
EP 2091118 · 2009 [cited by applicant]
EP 2120301 · 2009 [cited by applicant]
EP 2849294 · 2015 [cited by applicant]
EP 2992821 · 2016 [cited by applicant]
GB 2380058 · 2003 [cited by applicant]
JP 04116878 · 1992 [cited by applicant]
JP 2000163031 · 2000 [cited by applicant]
JP 2002342033 · 2002 [cited by applicant]
JP 2005175021 · 2005 [cited by applicant]
JP 2008262116 · 2008 [cited by applicant]
JP 2010503987 · 2010 [cited by applicant]
JP 2015115411 · 2015 [cited by applicant]
WO WO96011416 · 1996 [cited by applicant]
WO WO05091036 · 2005 [cited by applicant]
WO WO08033251 · 2008 [cited by applicant]
WO WO16144831 · 2016 [cited by applicant]
WO WO16176364 · 2016 [cited by applicant]
WO WO17197033 · 2017 [cited by applicant]
He et al., “Integrated Polarization Compensator for WDM Waveguide Demultiplexers,” [cited by applicant]
Tohmori, et al., “Broad-Range Wavelength-Tunable Superstructure Grating (SSG) DBR Lasers,” IEEE Journal of Quantum Electronics, vol. 29, No. 6, Jun. 1993, pp. 1817-1823. [cited by applicant]