IP Library Granted Patent US 12,348,221
Granted Patent B2
US 12,348,221 · App. 18/344,631 · Granted Jul 1, 2025

Circuit and method for controlling charge injection in radio frequency switches

Inventors: Alexander Dribinsky (Naperville, IL); Tae Youn Kim (Irvine, CA); Dylan J. Kelly (San Diego, CA); Christopher N. Brindle (Poway, CA)
Assignee: pSemi Corporation
H03K17/161H03K17/102H03K17/284H03K17/6874H03K17/689H03K17/04H03K17/06H03K17/08H03K2217/0009
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Quick Facts
Patent No.
US 12,348,221
App. No.
18/344,631
Granted
Jul 1, 2025
Kind
B2
Abstract

A circuit and method for controlling charge injection in a circuit are disclosed. In one embodiment, the circuit and method are employed in a semiconductor-on-insulator (SOI) Radio Frequency (RF) switch. In one embodiment, an SOI RF switch includes switching transistors coupled in series, referred to as “stacked” transistors, and implemented as a monolithic integrated circuit on an SOI substrate. Charge injection control elements are coupled to receive injected charge from resistively-isolated nodes located between the switching transistors, and to convey the injected charge to at least one node that is not resistively-isolated. The charge injection control elements include resistors or transistors. A method for controlling charge injection in a switch circuit is disclosed whereby injected charge is generated at resistively-isolated nodes between series coupled switching transistors, and the injected charge is conveyed to at least one node of the switch circuit that is not resistively-isolated.

Claims (25)

1. A switch circuit comprising:

a plurality of series-coupled transistors configured to selectively couple a signal from an input of the plurality of series-coupled transistors to an output of the plurality of series-coupled transistors based on a switch control signal applied to each transistor of the plurality of series-coupled transistors, wherein a transistor of the plurality of series-coupled transistors is configured to operate in an off state or an on state based on the switch control signal applied to the transistor, wherein the transistor comprises a gate and an accumulated charge sink (ACS) coupled to the gate, and wherein the ACS is configured to control accumulated charge in the transistor when the transistor is operated in the off state; and

a plurality of charge injection control resistors, wherein each charge injection control resistor of the plurality of charge injection control resistors has at least one end coupled to a node between two transistors of the plurality of series-coupled transistors to control injected charge at the node.

2. The switch circuit of claim 1 , wherein, for each of the plurality of charge injection control resistors, the at least one end is coupled to the node to control the injected charge at the node by receiving the injected charge from the node and conveying the injected charge to the input and/or the output of the plurality of series-coupled transistors.

3. The switch circuit of claim 1 , wherein each transistor of the plurality of series-coupled transistors comprises a metal-oxide-semiconductor field effect transistor (MOSFET).

4. The switch circuit of claim 1 , further comprising a resistor having a resistance Rg and coupled to one of the plurality of series-coupled transistors, wherein the plurality of series-coupled transistors comprises a plurality of N transistors, and wherein an impedance of at least one charge injection control resistor of the plurality of charge injection control resistors is in the range between 10 Rg/N and Rg/10N.

5. The switch circuit of claim 1 , wherein at least one charge injection control resistor of the plurality of charge injection control resistors has an impedance sufficiently low to control the injected charge at the node to which the at least one end of the at least one charge injection control resistor is coupled and/or avoid degradation of a switching time associated with the switch circuit.

6. The switch circuit of claim 5 , wherein the impedance of the at least one charge injection control resistor is sufficiently high to prevent degradation of isolation performance associated with the switch circuit.

7. The switch circuit of claim 5 , further comprising a resistor having a resistance Rg and coupled to one of the plurality of series-coupled transistors.

8. The switch circuit of claim 7 , wherein the plurality of series-coupled transistors comprises a plurality of N transistors, and wherein the impedance of the at least one charge injection control resistor is in the range between 10 Rg/N and Rg/10N.

9. The switch circuit of claim 7 , wherein the resistance Rg of the resistor is at least ten times larger than an impedance of a gate-to-drain capacitance associated with the one of the plurality of series-coupled transistors.

10. The switch circuit of claim 7 , wherein the impedance of the at least one charge injection control resistor is smaller than the resistance Rg of the resistor.

11. The switch circuit of claim 7 , wherein the plurality of series-coupled transistors comprises a plurality of N transistors, and wherein the impedance of the at least one charge injection control resistor is greater than or equal to about Rg/N.

12. The switch circuit of claim 7 , wherein the plurality of series-coupled transistors comprises a plurality of N transistors, and wherein the impedance of the at least one charge injection control resistor is approximately equal to Rg/N.

13. The switch circuit of claim 1 , further comprising a diode coupled to the gate and the ACS, wherein the diode is configured to selectively convey accumulated charge from the ACS to the gate.

14. A method comprising:

selectively coupling a signal from an input of a plurality of series-coupled transistors to an output of the plurality of series-coupled transistors based on a switch control signal applied to each transistor of the plurality of series-coupled transistors, wherein a transistor of the plurality of series-coupled transistors selectively operates in an off state or an on state based on the switch control signal applied to the transistor, wherein the transistor comprises a gate and an accumulated charge sink (ACS) coupled to the gate;

controlling, by a plurality of charge injection control resistors, injected charge at nodes of the plurality of series-coupled transistors, wherein each of the nodes is between two transistors of the plurality of series-coupled transistors; and

controlling, by the ACS, accumulated charge in the transistor when the transistor is operated in the off state.

15. The method of claim 14 , wherein the controlling the injected charge comprises receiving, by the plurality of charge injection control resistors, the injected charge from the nodes and conveying the injected charge to the input and/or the output of the plurality of series-coupled transistors.

16. The method of claim 14 , wherein each transistor of the plurality of series-coupled transistors comprises a metal-oxide-semiconductor field effect transistor (MOSFET).

17. The method of claim 14 , wherein at least one charge injection control resistor of the plurality of charge injection control resistors has an impedance sufficiently low to control the injected charge at one or more of the nodes and/or sufficiently high to prevent degradation of isolation performance associated with the plurality of series-coupled transistors and the plurality of charge injection control resistors.

18. The method of claim 14 , wherein the plurality of series-coupled transistors comprises a plurality of N transistors, wherein a resistor has a resistance Rg and is coupled to one of the plurality of series-coupled transistors, and wherein an impedance of at least one charge injection control resistor of the plurality of charge injection control resistors is in the range between 10 Rg/N and Rg/10N.

19. The method of claim 14 , wherein the controlling the accumulated charge in the transistor comprises applying a series of voltage pulses to the gate of the transistor.

20. The method of claim 14 , wherein the controlling the accumulated charge comprises conveying the accumulated charge from the ACS of the transistor to the gate of the transistor.

Assignments (2)
CHANGE OF NAME Recorded Mar 13, 2024
From: PEREGRINE SEMICONDUCTOR CORPORATION
To: PSEMI CORPORATION
Reel/Frame 066803/0296 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 1, 2024
From: DRIBINSKY, ALEXANDER; KIM, TAE YOUN; KELLY, DYLAN J.; BRINDLE, CHRISTOPHER N.
To: PEREGRINE SEMICONDUCTOR CORPORATION
Reel/Frame 066724/0566 →
Continuity (13)
Continuation 17543720 · Dec 6, 2021
Continuation 16921790 · Jul 6, 2020
Continuation 15826453 · Nov 29, 2017
Continuation 14987360 · Jan 4, 2016
Continuation 14257808 · Apr 21, 2014
Continuation 11881816 · Jul 26, 2007
Continuation In Part 11520912 · Sep 14, 2006
Continuation In Part 11484370 · Jul 10, 2006
Continuation In Part 11484370 · Jul 10, 2006
Provisional Application 60833562 · Jul 26, 2006
Provisional Application 60718260 · Sep 15, 2005
Provisional Application 60698523 · Jul 11, 2005
Related Publication 20240007098A1 · Jan 4, 2024
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RFMD's Opening Brief on Claim Construction (Public Redacted Version) filed Mar. 4, 2014 in CASD-3-12-cv-00911, 27 pages, Doc8048. [cited by applicant]
RFMD's Declaration of Mark Tung in Support of RFMD's Opening Claim Construction Brief filed Mar. 4, 2014 in CASD-3-12-cv-00911, 162 pages, Doc 8049. [cited by applicant]
RFMD's Reply Memorandum in Support of Its Motion to Dismiss Peregrine's 4th, 6th, 7th and 8th Counts for Lack of Subject Matter Jurisdiction filed Mar. 10, 2014 in CASD-3- 12-cv-00911, 37 pages, Doc 8051. [cited by applicant]
Peregrine's Memorandum in Opposition to Benton's Motion to Dismiss (Public Redacted Version) filed Mar. 14, 2014 in CASD-3-12-cv-00911, 86 pages, Doc 8052. [cited by applicant]
Order (1) Granting in Part and Denying in Part RFMD's Motion to Dismiss; (2) Granting Benton's Motion to Dismiss; and (3) Denying Peregrine's Motion to Stay filed Mar. 18, 2014 in CASD-3-12-cv-00911, 10 pages, Doc 8053. [cited by applicant]
Stricken Document: Response to Claim Construction Brief Pursuant to Order 214 filed Mar. 18, 2014 in CASD-3-12-cv-00911, 1 page, Doc 8054. [cited by applicant]
RFMD's Responsive Brief on Claim Construction filed Mar. 18, 2014 in CASD-3-12-cv-00911, 36 pages, Doc 8055. [cited by applicant]
Order Striking Peregrine's Mar. 18, 2014 Filings and Granting Peregrine's Motion to File Responsive Claim Construction Brief filed Mar. 20, 2014 in CASD-3-12-cv-00911, 2 pages, Doc 8056. [cited by applicant]
Peregrine's Substitute Responsive Claim Construction Brief (Public Redacted Version) filed Mar. 24, 2014 in CASD-3-12-cv-00911, 20 pages, Doc 8057. [cited by applicant]
Peregrine's Opening Claim Construction Brief for U.S. Pat. No. 6,903,426 filed Apr. 4, 2014 in CASD-3-12-cv-00911, 149 pages, Doc 8058. [cited by applicant]
RFMD's Opening Brief on Claim Construction for U.S. Pat. No. 6,903,426 filed Apr. 4, 2014 in CASD-3-12-cv-00911, 148 pages, Doc 8059. [cited by applicant]
Peregrine's Responsive Claim Construction Brief for U.S. Pat. No. 6,903,426 filed Apr. 11, 2014 in CASD-3-12-cv-00911,31 pages, Doc 8060. [cited by applicant]
RFMD's Responsive Brief on Claim Construction filed Apr. 11, 2014 in CASD-3-12-cv- 00911, 79 pages, Doc 8061. [cited by applicant]
Tentative Claim Construction Order for U.S. Pat. No. 7,910,993, 8,405,147 and 6,903,426 filed Apr. 16, 2014 in CASD-3-12-cv-00911, 87 pages, Doc 8062. [cited by applicant]
Peregrine's Markman Hearing Slide Deck filed Apr. 18, 2014 in CASD-3-12-cv-00911,62 pages, Doc 8063. [cited by applicant]
RFMD's Markman Hearing Slide Deck filed Apr. 18, 2014 in CASD-3-12-cv-00911, 36 pages, Doc 8064. [cited by applicant]
Claim Construction Order for U.S. Pat. No. 7,910,993, 8,405,147 and6,903,426 filed Apr. 23, 2014 in CASD-3-12-cv-00911, 16 pages, Doc 8065. [cited by applicant]
Claim Construction Charts for U.S. Pat. No. 7,910,993, 8,405,147 and6,903,426 filed Apr. 23, 2014 in CASD-3-12-cv-00911, 72 pages, Doc 8066. [cited by applicant]
Declaration of Brian Floyd, Ph.D. filed 3/'- 12016 1n CASD-3-12-cv-00911, 23 pages, Doc 8050. [cited by applicant]
Peregrine's Complaint for Damages and Injunctive Relief filed May 11, 2012 in CASD-3-12-cv-01160, 9 pages, Doc 8083. [cited by applicant]
Peregrine's Complaint and Demand for Jury Trial filed Mar. 26, 2013 in CASD-3-13-cv-00725, 68 pAGES, 68 pages, Doc 8084. [cited by applicant]
RFMD's Complaint for Declaratory Judgment of Patent Non-Infringement and Invalidity filed Apr. 16, 2012 in NCMD-1-12-cv-00377, 246 pages, Doc 8085. [cited by applicant]
Voldman—“Dynamic Threshold Body- and Gate-coupled SOI ESD Protection Networks”, Journal of Electrostatics 44, Mar. 20, 1998, pp. 239-255, Doc 8015. [cited by applicant]
Matloubian—“Smart Body Contact for SOI MOSFETs” 1989 IEEE SOS/SOI Technology Conference pp. 128-129, Oct. 3-5, 1989, 2 pages, Doc 0425. [cited by applicant]
Hieda—Floating-Body Effect Free Concave SOI-MOSFETs (COSMOS), ULSI Research Center, Toshiba Corporation, IEEE 1991, pp. 26.2.1-26.2.4, Dec. 8-11, 1991, 4 pages, Doc 0187. [cited by applicant]
Patel—“A Novel Body Contact for SIMOX Based SOI MOSFETs”, Solid-State Electronics vol. 34, No. 10, pp. 1071-1075, Apr. 22, 1991, 6 pages, Doc 3000. [cited by applicant]
Katzin—“High Speed 100+ W RF Switched Using GaAs MMICs”, IEEE Transactions on Microwave Theory and Techniques, Nov. 1992, pp. 1989-1996, 8 pages, Doc 0194. [cited by applicant]
Armijos—“High Speed DMOS FET Analog Switches and Switch Arrays”, Temic Semiconductors Jun. 22, 1994, pp. 1-10, 10 pages, Doc 0202. [cited by applicant]
Li—“Suppression of Geometric Component of Charge Pumping Current SOI/MOSFETs”, Proc. Int. Symp. VLSI Technology, Systems & Applications (IEEE May 31-Jun. 2, 1995), pp. 144-148, 5 pages, Doc 8016. [cited by applicant]
Chan—“A Novel SOI CBiCMOS Compatible Device Structure for Analog and Mixed-Mode Circuits”, Dept. of EECS, University of California at Berkeley, IEEE Nov. 1995, pp. 40-43, 4 pages, Doc 1078. [cited by applicant]
Kohama—“High Power DPDT Antenna Switch MMIC for Digital Cellular Services”, IEEE Journal of Solid-State Circuits, Oct. 1996, pp. 1406-1411, 6 pages, Doc 0244. [cited by applicant]
Tenbroek—“Electrical Measure of Silicon Film and Oxide Thickness in Partially Depleted SOI Technologies”, Solid-State Electronics, vol. 39, No. 7, pp. 1011-1014, Nov. 14, 1995,4pages, Doc8019. [cited by applicant]
NEC Corporation—“uPG13xG Series L-Band SPOT Switch GaAs MMIC”, Document No. P1096EJ1VOANDO (1st Edition), Feb. 1996, 30 pages, Doc 0248. [cited by applicant]
Kuge—“SOI-DRAM Circuit Technologies for Low Power High Speed Multigiga Scale Memories”, Jun. 8-10, 1995, IEEE Journal of Solid-State Circuits, vol. 31, No. 4, Apr. 1996, pp. 586-591, 6 pages, Doc 0259. [cited by applicant]
Fung—“Frequency Dispersion in Partially Depleted SOI MOSFET Output Resistance”, Proceedings 1996 IEEE International SOI Conference, Oct. 1996, pp. 146-147, 2 pages, Doc 0268. [cited by applicant]
Yamamoto—“A Single-Chip GaAs RF Transceiver for 1.9GHz Digital Mobile Communication Systems”, IEEE Dec. 1996, pp. 1964-1973, 10 pages, Doc 0255. [cited by applicant]
Johnson—“Silicon-On-Sapphire Technology for Microwave Circuit Applications”, Dissertation UCSD Jan. 1997, IEEE May 1998, pp. 1-184, 214 pages, Doc 0288. [cited by applicant]
Koh—“1Giga Bit SOI DRAM with Fully Bulk Compatible Process and Body-Contacted SOI MOSFET Structure”, IEEE Dec. 10, 1997, pages, Doc 8021. [cited by applicant]
Maeda—“A Highly Reliable .35um Field Body-Tied SOI Gate Array for Substrate-Bias-Effect Free Operation”, 1997 Symposium on VLSI Technology Digest of Technical Papers, Jun. 10-12, 1997, 2 pages, Doc 8020. [cited by applicant]
Koh—“Body-ContactedSOI MOSFET Structure with Fully Bulk CMOS Compatible Layout and Process”, IEEE Electron Device Letters, vol. 18, No. 3, Mar. 1997, pp. 102-104, 3 pages, Doc 0305. [cited by applicant]
Huang—“Device Physics, Performance Simulations and Measured Results of SOI MOS and DTMOS Transistors and Integrated Circuits”, Beijing Microelectronics Technology Institute, Oct. 23, 1998 IEEE, pp. 712-715, 4 pages, Doc… [cited by applicant]
Hirota—“0.5V 320MHz 8b Multiplexer/Demultiplier Chips Based on a Gate Array with Regular-Structured DRMOS/SOI”, Feb. 5-7, 1998, 1998 IEEE International Solid-State Circuits Conference. Digest of Technical Papers, ISSCC.… [cited by applicant]
Chuang—“SOI for Digital Cmos Vlsi Design: Design Considerations and Advances”, Proceedings of the IEEE vol. 86, No. 4, Apr. 1, 1998 pp. 689-720, 32 pages, Doc 1079. [cited by applicant]
Duyet—“Suppression of Geometric Component of Charge Pumping Current in Thin Film Silicon on insulator Metal-Oxide-Semiconductor Field-Effect Transistors”, Japanese Journal of Applied Physics, Jul. 15, 1998, vol. 37, pp.… [cited by applicant]
Gil—“A High Speed and Low Power SOI Inverter using Active Body-Bias”, Proceedings International Symposium on Low Power Electronics and Design, Sep. 1998, pp. 59-63, 5 pages, Doc 0359. [cited by applicant]
Tseng—“AC Floating-Body Effects an Submicron Fully Depleted (FS) SOI nMOSFETs and the Impact on Analog Applications”, IEEE Electron Devices, vol. 19, No. 9, Sep. 1998, pp. 351-353, 3 pages, Doc0362. [cited by applicant]
Duyet—“Effects of Body Reverse Pulse Bias on Geometric Component of Charge Pumping Current in FD SOI MOSFETs”, Proceedings IEEE Intl SOI Conference, Oct. 5-8, 1998, pp. 79-80, 2 pages, Doc 0364. [cited by applicant]
Chung—“A New SOI MOSFET Structure with Junction Type Body Contact”, International Electron Device Meeting (IEDM) Technical Digest, Dec. 5-8, 1999, pp. 59-62, 4 pages, Doc 0379. [cited by applicant]
Devlin—“The Design of Integrated Switches and Phase Shifters”, Nov. 24, 1999, 15 pages, Doc 0381. [cited by applicant]
Lim—“Partial SOI LDMOSFETs for High-Side Switching”, Dept. of Engineering, University of Cambridge, Oct. 5-9, 1999 IEEE, pp. 149-152, 4 pages, Doc 0393. [cited by applicant]
Maeda—“Substrate Bias Effect and Source Drain Breakdown Characteristics in Body Tied Short Channel SOI MOSFETs”, IEEE Transactions on Electron Devices, vol. 46, No. 1, Jan. 1999, pp. 151-158, 8 pages, Doc 0397. [cited by applicant]
Rodgers—“Silicon UTSi CMOS RFIC for CDMA Wireless Communications System”, IEEE MTT-S Digest, Jun. 14-15, 1999, pp. 485-488, 4 pages, Doc 0406. [cited by applicant]
Yamamoto—“A 2.2-V Operation, 2.4-GHz Single-Chip GaAs MMIC Transceiver for Wireless Applications”, IEEE Journal of Solid-State Circuits, vol. 34, No. 4, Apr. 1999, pp. 502-512, 11 pages, Doc 0417. [cited by applicant]
Chen—“Low Power, Multi-Gigabit DRAM Cell Design Issues Using SOI Technologies”, http://bwrc.eecs.berkeley.edu/people/grad_students/chenff/reports, May 14, 1999, 6 pages, Doc 0418. [cited by applicant]
Allen—“Characterization and Modeling of Silicon-on-Insulator Field Effect Transistors”, Department of Electrical Engineering and Computer Science, MIT May 20, 1999, 80 pages, Doc 0419. [cited by applicant]
Tseng—“AC Floating-Body Effects and the Resultant Analog Circuit Issues in Submicron Floating Body and Body-Grounded SOI MOSFETs”, IEEE Transactions on Electron Devices, vol. 46, No. 8, Aug. 1999, 8 pages, Doc 0420. [cited by applicant]
Fung—“Controlling Floating-Body Effects for 0.13um and .10um SOI CMOS”, IDEM 00-231-234, Dec. 10-13, 2000, IEEE, 4 pages, Doc 8017. [cited by applicant]
Imam—“A Simple Method to Determine the Floating-Body Voltage of SOI CMOS Devices”, IEEE Electron Device Letters, vol. 21, No. 1, Jan. 2000, pp. 21-23, 3 pages, Doc 0441. [cited by applicant]
Kanda—“A Si RF Switch MMIC for the Cellular Frequency Band Using SOI-CMOS Technology”, The Institute of Electronics, Information and Communication Engineers, vol. 100, No. 152, Jun. 2000, pp. 79-83, 5 pages, Doc 0443. [cited by applicant]
Shahid!—“Issues in SOI CMOS Technology and Design”, IEEE 2000 Custom Integrated Circuits Conference, Publication/Presentation dated May 21, 2000, 78 pages, Doc 8014. [cited by applicant]
Horiuchi—“A Dynamic-Threshold SOI Device with a J-FET Embedded Source Structure and a Merged Body-Bias-Control Transistor—Part II: Circuit Simulation”, IEEE Transactions on Electron Devices, vol. 47, No. 8, Aug. 2000, p… [cited by applicant]
Horiuchi—“A Dynamic-Threshold SOI Device with a J-FET Embedded Source Structure and a Merged Body-Bias-Control Transistor—Part I: a J-FETt Embedded Source Structure Properties”, IEEE Transactions on Electron Devices, vo… [cited by applicant]
Scheinberg—“A Computer Simulation Model for Simulating Distortion in FET Resistors”, IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems, vol. 19, No. 9, Sep. 2000, pp. 981-989, 9 pages, Doc 04… [cited by applicant]
Cristoloveanu—“The Four-Gate Transistor”, Institute of Microelectronics, Electromagnetism and Photonics, ESSDERC Sep. 24-26, 2002, pp. 323-326, 4 pages, Doc 0478. [cited by applicant]
Reedy—“Utsi CMOS: A Complete RF SOI Solution”, Peregrine Semiconductor Nov. 2000, pp. 1-6, 6 pages, Doc 0508. [cited by applicant]
Yamamoto—“A 2.4GHz Band 1.8V Operation Single Chip SI-CMOS T/R MMIC Front End with a Low Insertion Loss Switch”, IEEE Journal of Solid-State Circuits, vol. 36, No. 8, Aug. 2001, pp. 1186-1197, 12 pages, Doc0527. [cited by applicant]
Adan—“OFF-State Leakage Current Mechanisms in BulkSi and SOI MOSFETs and Their Impact on CMOS ULSIs Standby Current”, IEEE Transactions on Electron Devices, vol. 48, No. 9, Sep. 2001, pp. 2050-2057, 8 pages, Doc 0528. [cited by applicant]
Goldman—“0.15um SOI DRAM Technology Incorporating Sub-Volt Dynamic Threshold Devices for Embedded Mixed-Signal & RF Circuits”, Oct. 1-4, 2001 IEEE SOI Conference, pp. 97-98, 2 pages, Doc 0531. [cited by applicant]
Fung—“Present Status and Future Direction of BSIM SOIL Model for High-Performance/Low-Power/RF Application”, IBM Microelectronics, Semiconductor Research and Development Center, Apr. 2002, 4 pages, Doc 0554. [cited by applicant]
Adan—“Linearity and Low-Noise Performance of SOI MOSFETs for RF Applications”, IEEE Transactions on Electron Devices, May 2002 Vol. 49, No. 5, pp. 881-888, 8 pages, Doc 0555. [cited by applicant]
Akarvardar—“Multi-Bias Dependence of Threshold Voltage, Subthreshold Swing, and Mobility in G4-FETs”, Institute of Microelectronics, Electromagnetism, and Photonics, IEEE Oct. 2003, pp. 127-130, 4 pages, Doc 1075. [cited by applicant]
Dufrene—“The G4-FET: Low Voltage to High Voltage Operation and Performance”, Dept. of Electrical and Computer Engineering, The University of Tennessee, IEEE Jan. 2003, pp. 55-56, 2 pages, Doc 0565. [cited by applicant]
Marks—“SOI for Frequency Synthesis in RF Integrated Circuits”, Thesis submitted to North Carolina State University, May 2003, 155 pages, Doc 0574. [cited by applicant]
Zhu Ming—“A New Structure of Silicon-on-Insulator Metal-Oxide Semiconductor Field Effect Transistor to Suppress the Floating Body Effect”, Nov. 4, 2002, Chin. Phys. Lett., vol. 20, No. 5 (2003) pp. 767-769, 3 pages, Doc… [cited by applicant]
Fung—“On the Body-Source Built-In Potential Lowering of SOI MOSFETS”, IEEE Electron Device Letters, vol. 24, No. 2, Feb. 2003, pages, Doc 8018. [cited by applicant]
Tinella—“Study of the Potential of CMOS-SOI Technologies Partially Abandoned for Radiofrequency Applications”, Thesis for obtaining the standard of Doctor of INPG, National Polytechnic of Grenoble, Sep. 25, 2003, 187 pa… [cited by applicant]
De Houck—“Design of EEPROM Memory Cells in Fully Depleted 'CMOS SOI Technology”, Universite Catholique de Louvain Faculty of Applied Science, Laboratory of Electronics and Microelectronics, Academic Year 2003-2004, Jan.… [cited by applicant]
Streetman—“Solid State Electronic Devices”, Microelectronics Research Center, Dept. of Electrical and Computer Engineering, The University of Texas at Austin, Chapter 6, Jan. 2004 by Pearson Education Inc., 4 pages, Doc… [cited by applicant]
Zhu—“Simulation of Suppression of Floating-Body Effect in Partially Depleted SOI MOSFET Using a Sil-xGex Dual Source Structure”, Materials Science and Engineering B 114-115 Dec. 15, 2004, pp. 264-268, 5 pages, Doc 0604. [cited by applicant]
Chen—“G4-FET Based Voltage Reference”, Masters Theses, University of Tennessee, Knoxville, Trace: Tennessee Research and Creative Exchange, May 2004, 57 pages, Doc 0607. [cited by applicant]
Ippoushi—“SOI Structure Avoids Increases in Chip Area and Parasitic Capacitance Enables Operational Control of Transistor Threshold Voltage”, Renesas Edge, vol. 2004.Jul. 5, 2004, p. 15, 1 page, Doc 0610. [cited by applicant]
Akarvardar—“Threshold Voltage Model of the SOI 4-Gate Transistor”, 2004 IEEE International SOI Conference, Oct. 4-7, 2004, pp. 89-90, 2 pages, Doc 0613. [cited by applicant]
Dufrene—“Investigation of the Four-Gate Action in G4-FETs”, IEEE Transactions on Electron Devices, vol. 51, No. 11, Dec. 2004, pp. 1931-1935, 5 pages, Doc 0617. [cited by applicant]
Cathelin—“Antenna Switch Devices in RF Modules for Mobile Applications”, ST Microelectronics, Front-End Technology Manufacturing, Crolles, France, Mar. 2005, 42 pages, Doc 0623. [cited by applicant]