Printed circuit board having a temperature profiling connection pad
A printed circuit board (PCB) includes an identified temperature profiling location. The identified temperature profiling location may be a connection pad from a grid of connection pads on the PCB. The connection pad may be located near a center of the grid of connection pads. The connection pad may be coupled to a no-connect pin of an electronic component that is surface mounted to the PCB. Traces extend from the connection pad to test pads provided near a perimeter of the grid of connection pads. A temperature measurement device may be coupled to the test pads, which enables the temperature measurement device to capture accurate temperature readings underneath the electronic component during a reflow profiling process.
1. A printed circuit board (PCB), comprising:
a grid of connection pads, each connection pad of the grid of connection pads receiving a corresponding connection point from a grid of connection points associated with an electronic component when the electronic component is surface mounted to the PCB;
a test pad positioned proximate to a perimeter of the grid of connection pads, the test pad acting as an attachment point for a temperature measurement device that measures a temperature proximate to an identified connection pad of the grid of connection pads; and
a trace extending from the identified connection pad of the grid of connection pads to the test pad.
2. The PCB of claim 1 , wherein the identified connection pad is located proximate to a center of the grid of connection pads.
3. The PCB of claim 1 , wherein the identified connection pad is associated with a no-connect connection point from the grid of connection points.
4. The PCB of claim 1 , wherein the trace extends from the identified connection pad in a dual trace configuration.
5. The PCB of claim 1 , wherein the trace extends from the identified connection pad using a double dog bone configuration.
6. The PCB of claim 1 , wherein a wire of the temperature measurement device is soldered to the test pad.
7. The PCB of claim 6 , wherein the wire of the temperature measurement device and the test pad are at least partially covered with an insulation material.
8. The PCB of claim 1 , wherein the trace and a wire of the temperature measurement device are formed from copper.
9. A printed circuit board (PCB), comprising:
a grid of connection means adapted to receive interconnection means associated with an integrated circuit;
a testing means positioned proximate to a perimeter of the grid of connection means, the testing means adapted to receive wires of a temperature measurement means that measures a temperature proximate to an identified connection means of the grid of connection means; and
a conducting means extending from the identified connection means of the grid of connection means to the testing means.
10. The PCB of claim 9 , wherein the identified connection means is adapted to receive a particular interconnection means associated with the integrated circuit.
11. The PCB of claim 10 , wherein the particular interconnection means is selected from a group comprising:
a no-connect interconnection means;
a do not connect interconnection means; and
a do not use interconnection means.
12. The PCB of claim 10 , wherein the conducting means and the wires of the temperature measurement means are formed from copper.
13. The PCB of claim 9 , wherein the identified connection means is located proximate to a center of the grid of connection means.
14. A printed circuit board (PCB), comprising:
a grid of connection pads adapted to receive connection points of a grid of connection points associated with an electronic component surface mounted to the PCB;
a test pad operable to be coupled to at least a portion of a temperature measurement device that measures a temperature proximate to an identified connection pad of the grid of connection pads, the test pad located proximate to a perimeter of the grid of connection pads; and
a trace extending between the identified connection pad and the test pad.
15. The PCB of claim 14 , wherein the identified connection pad is in a center portion of the grid of connection pads.
16. The PCB of claim 14 , wherein the identified connection pad is associated with a no-connect connection point of the grid of connection points.
17. The PCB of claim 14 , wherein the trace has a dual trace configuration.
18. The PCB of claim 14 , wherein the trace has a double dog bone configuration.
19. The PCB of claim 14 , wherein a wire of the temperature measurement device is soldered to the test pad.
20. The PCB of claim 19 , wherein the wire of the temperature measurement device and the test pad are at least partially covered with an insulation material.