3D-interconnect
A method of making a microelectronic package includes bonding a conductive structure to a carrier so that the conductive structure overlies a rear surface of a microelectronic element disposed on the carrier and an exposed top surface of the carrier. The conductive structure may be a monolithic structure having a base and a plurality of interconnections extending continuously away from the base toward the carrier. The microelectronic element may be positioned between at least two adjacent interconnections of the plurality of interconnections. The plurality of interconnections and the microelectronic element may be encapsulated with an encapsulant. The conductive structure may be patterned to form external contacts. At least some of the external contacts may overlie the microelectronic element.
1 . A microelectronic assembly comprising:
a microelectronic element;
an etched monolithic conductive structure comprising a routing layer and interconnection elements integrally formed with the routing layer and extending in a direction away from the routing layer, and wherein at least a portion of the routing layer overlies a surface of the microelectronic element; and
an encapsulant disposed between each interconnection element of the etched monolithic conductive structure.
2 . The microelectronic assembly of claim 1 , wherein the microelectronic element comprises a semiconductor chip, and the etched monolithic conductive structure carries one of a signal, a power, or a ground.
3 . The microelectronic assembly of claim 2 , wherein the etched monolithic conductive structure carry ground.
4 . The microelectronic assembly of claim 1 , wherein the routing layer form an electromagnetic interference shield.
5 . The microelectronic assembly of claim 1 , wherein the routing layer is configured to dissipate heat.
6 . The microelectronic assembly of claim 1 , wherein the routing layer is configured to form an antenna.
7 . The microelectronic assembly of claim 1 , wherein the surface of the microelectronic element is spaced away from a surface of the encapsulant.
8 . The microelectronic assembly of claim 1 , wherein ends of the interconnection elements are positioned adjacent a surface of the encapsulant.
9 . The microelectronic assembly of claim 8 , further comprising:
a second conductive structure configured to conductively connect bond pads of the microelectronic element with terminals of the microelectronic assembly;
wherein the second conductive structure further comprises contacts disposed at a first surface of the second conductive structure, the bond pads of the microelectronic element being directly joined to the contacts of the second conductive structure.
10 . The microelectronic assembly of claim 1 , further comprising a thermal interface material overlying the surface of the microelectronic element.
11 . A system comprising:
an assembly according to claim 1 ; and
one or more other electronic components electrically connected to the assembly.
12 . The system of claim 11 , further comprising a housing, the assembly and the other electronic components being mounted to the housing.