Integrated circuit packaging system with inward and outward interconnects and method of manufacture thereof
A method of manufacture of an integrated circuit packaging system includes: providing a base circuit assembly having an integrated circuit device; mounting a pre-formed conductive frame having an outer interconnect and an inner interconnect shorter than the outer interconnect over the base circuit assembly, the inner interconnect over the integrated circuit device and the outer interconnect around the integrated circuit device; applying an encapsulant over the inner interconnect and the outer interconnect; and removing a portion of the pre-formed conductive frame exposing an end of the inner interconnect and an end of the outer interconnect.
1. A method of manufacture of an integrated circuit packaging system comprising:
providing a base circuit assembly having an integrated circuit device;
mounting a pre-formed conductive frame having an outer interconnect and an inner interconnect shorter than the outer interconnect over the base circuit assembly, the inner interconnect over the integrated circuit device and the outer interconnect around the integrated circuit device;
applying an encapsulant over the inner interconnect and the outer interconnect; and
removing a portion of the pre-formed conductive frame exposing an end of the inner interconnect and an end of the outer interconnect.
2. The method as claimed in claim 1 wherein removing the portion of the pre-formed conductive frame includes removing a portion of the inner interconnect and a portion of the encapsulant to form an encapsulant cavity.
3. The method as claimed in claim 1 wherein removing the portion of the pre-formed conductive frame includes removing a portion of the inner interconnect and a portion of the encapsulant to form a step down surface.
4. The method as claimed in claim 1 further comprising:
connecting a first component to the inner interconnect;
mounting a second component over the first component; and
connecting the second component to the outer interconnect.
5. The method as claimed in claim 1 wherein removing the portion of the pre-formed conductive frame includes exposing an inner exposed contact surface on the end of the inner interconnect and an outer exposed contact surface on the end of the outer interconnect.
6. A method of manufacture of an integrated circuit packaging system comprising:
providing a base circuit assembly having an integrated circuit device;
mounting a pre-formed conductive frame having an outer interconnect and an inner interconnect shorter than the outer interconnect over the base circuit assembly, the inner interconnect over the integrated circuit device and the outer interconnect around the integrated circuit device;
applying an encapsulant over the base circuit assembly, the inner interconnect, and the outer interconnect; and
removing a portion of the pre-formed conductive frame exposing an inner exposed contact surface of the inner interconnect and an outer exposed contact surface of the outer interconnect.
7. The method as claimed in claim 6 wherein applying the encapsulant includes surrounding the inner interconnect and the outer interconnect with the encapsulant.
8. The method as claimed in claim 6 further comprising:
connecting a first component with the inner exposed contact surface over the top substrate;
mounting a second component over the first component; and
connecting the second component with the outer exposed contact surface.
9. The method as claimed in claim 6 wherein forming the base circuit assembly includes connecting the integrated circuit device to the bottom substrate or the top substrate.
10. The method as claimed in claim 6 wherein mounting the pre-formed conductive frame includes forming the inner interconnect and the outer interconnect from a non-vertical side of the pre-formed conductive frame.
11. An integrated circuit packaging system comprising:
a base circuit assembly having an integrated circuit device;
an outer interconnect;
an inner interconnect shorter than the outer interconnect over the base circuit assembly, the inner interconnect over the integrated circuit device and the outer interconnect around the integrated circuit device; and
an encapsulant applied over the inner interconnect and the outer interconnect and with an end of the inner interconnect and an end of the outer interconnect substantially exposed.
12. The system as claimed in claim 11 wherein the encapsulant includes an encapsulant cavity.
13. The system as claimed in claim 11 wherein the encapsulant includes a step down surface.
14. The system as claimed in claim 11 further comprising:
a first component connected with the inner interconnect;
a second component mounted over the first component; and
the second component connected with the outer interconnect.
15. The system as claimed in claim 11 wherein an inner exposed contact surface of the inner interconnect and an outer exposed contact surface of the outer interconnect exhibit physical tool marks.
16. The system as claimed in claim 11 wherein the encapsulant is over the base circuit assembly and with an inner exposed contact surface of the inner interconnect and an outer exposed contact surface of the outer interconnect substantially exposed.
17. The system as claimed in claim 16 wherein the encapsulant surrounds the inner interconnect and the outer interconnect.
18. The system as claimed in claim 16 further comprising:
a first component connected with the inner exposed contact surface;
a second component mounted over the first component; and
the second component connected with the outer exposed contact surface.
19. The system as claimed in claim 16 wherein the inner exposed contact surface is parallel with the outer exposed contact surface.
20. The system as claimed in claim 16 further comprising:
a first component connected with the inner exposed contact surface; and
a second component mounted with an offset over the first component.