Detection of security attacks through die-attach pad
An electronic device includes an Integrated Circuit (IC) and a package including a die-attach pad for connecting the IC. The IC includes (i) a measurement circuit configured to measure an electrical characteristic of the die-attach pad, and (ii) a security control circuit configured to initiate a responsive action responsively to detecting a deviation of the measured electrical characteristic of the die-attach pad from an initial measurement of the electrical characteristic.
1 . An electronic device, comprising:
an Integrated Circuit (IC);
a package; and
a die-attach pad that connects the IC to the package,
wherein the IC comprises:
a measurement circuit, configured to measure a capacitance between the die-attach pad and a metal deposition layer in the IC; and
a security control circuit, configured to initiate a responsive action responsively to detecting a deviation of the measured capacitance from an initial measurement of the capacitance.
2 . An electronic device, comprising:
an Integrated Circuit (IC);
a package; and
a die-attach pad that connects the IC to the package,
wherein the IC comprises:
a measurement circuit, configured to measure a resistance between at least two wires that are bonded to the die-attach pad; and
a security control circuit, configured to initiate a responsive action responsively to detecting a deviation of the measured resistance from an initial measurement of the resistance.
3 . The electronic device according to claim 1 , wherein the IC further comprises a non-volatile memory (NVM), configured to store the initial measurement of the capacitance.
4 . The electronic device according to claim 3 , wherein the NVM is programmed with the initial measurement during manufacturing of the electronic device.
5 . The electronic device according to claim 1 , further comprising a glue or a film for connecting the IC to the die-attach pad.
6 . A method for securing an electronic device that includes an Integrated Circuit (IC) and a package comprising a die-attach pad that connects the IC to the package, the method comprising:
measuring a capacitance between the die-attach pad and a metal deposition layer in the IC; and
initiating a responsive action responsively to detecting a deviation of the measured capacitance from an initial measurement of the capacitance.
7 . The method according to claim 6 , further comprising storing the initial measurement of the capacitance in a non-volatile memory (NVM) in the IC.
8 . The method according to claim 7 , wherein storing the initial measurement comprises programming the NVM with the initial measurement during manufacturing of the electronic device.
9 . The method according to claim 6 , further comprising a glue or a film for connecting the IC to the die-attach pad.