Semiconductor device and method of fabricating the same
A semiconductor device may include a substrate including an active pattern, a source/drain pattern on the active pattern, an active contact on the source/drain pattern; a lower power line in the substrate, a lower contact that vertically connects the active contact to the lower power line, a conductive layer between the lower contact and the lower power line, and a power delivery network layer on a bottom surface of the substrate. The conductive layer may include silicon (Si) and a first element. The first element may include a transition metal or a metalloid. A concentration of the first element may decrease in a direction from the lower contact toward the lower power line.
1 . A semiconductor device, comprising:
a substrate including an active pattern;
a source/drain pattern on the active pattern;
an active contact on the source/drain pattern;
a lower power line in the substrate;
a lower contact that vertically connects the active contact to the lower power line;
a conductive layer between the lower contact and the lower power line; and
a power delivery network layer on a bottom surface of the substrate, wherein
the conductive layer includes silicon (Si) and a first element,
the first element includes a transition metal or a metalloid, and
a concentration of the first element decreases in a direction from the lower contact toward the lower power line.
2 . The semiconductor device of claim 1 , wherein
the lower power line includes a body part and a connection part,
the connection part is connected to the lower contact, and
the connection part surrounds a first lower sidewall of the lower contact.
3 . The semiconductor device of claim 2 , wherein the body part has a linear shape that extends in one direction.
4 . The semiconductor device of claim 2 , further comprising:
a liner on a sidewall of the lower contact, wherein
the connection part is in contact with a lower sidewall of the liner.
5 . The semiconductor device of claim 2 , further comprising:
a device isolation layer on the substrate, wherein
a part of the connection part and a part of the device isolation layer are spaced apart from each other to define a void between the part of the connection part and the part of the device isolation layer.
6 . The semiconductor device of claim 1 , wherein
the lower contact includes a second element,
the first element includes at least one of titanium (Ti), molybdenum (Mo), and germanium (Ge), and
the second element includes at least one of molybdenum (Mo), tungsten (W), and ruthenium (Ru).
7 . The semiconductor device of claim 1 , wherein the conductive layer includes a metal-silicide layer or a semiconductor epitaxial layer.
8 . The semiconductor device of claim 1 , wherein
a width of the lower contact decreases with decreasing distance from the bottom surface of the substrate, and
a width of the lower power line increases with decreasing distance from the bottom surface of the substrate.
9 . The semiconductor device of claim 1 , wherein
the lower contact includes grains and a grain boundary between the grains, and
an average grain size of the grains is in a range of about 100 Å to about 500 Å.
10 . The semiconductor device of claim 1 , wherein the power delivery network layer is configured to apply a source voltage or a drain voltage to the lower power line.
11 . A semiconductor device, comprising:
a substrate including an active pattern;
a source/drain pattern on the active pattern;
an active contact on the source/drain pattern;
a lower power line in the substrate;
a lower contact that vertically connects the active contact to the lower power line;
a conductive layer between the lower contact and the lower power line; and
a power delivery network layer on a bottom surface of the substrate, wherein
the conductive layer includes silicon (Si) and a first element,
the first element includes a transition metal or a metalloid,
a bottom surface of the lower contact is covered with the conductive layer, and
a first lower sidewall of the lower contact is covered with the lower power line.
12 . The semiconductor device of claim 11 , wherein
the lower contact includes a second element,
the first element includes at least one of titanium (Ti), molybdenum (Mo), and germanium (Ge), and
the second element includes at least one of molybdenum (Mo), tungsten (W), and ruthenium (Ru).
13 . The semiconductor device of claim 11 , further comprising:
a liner on a sidewall of the lower contact, wherein
a lower sidewall of the liner is covered with the lower power line.
14 . The semiconductor device of claim 11 , wherein the conductive layer includes a metal-silicide layer or a semiconductor epitaxial layer.
15 . The semiconductor device of claim 11 , wherein
the lower contact includes grains and a grain boundary between the grains, and
an average grain size of the grains is in a range of about 100 Å to about 500 Å.
16 . A semiconductor device, comprising:
a substrate including an active pattern;
a device isolation layer on the substrate, the device isolation layer defining the active pattern;
a channel pattern and a source/drain pattern on the active pattern;
a gate electrode on the channel pattern;
a gate dielectric layer between the gate electrode and the channel pattern;
a gate spacer on a sidewall of the gate electrode;
a gate capping pattern on a top surface of the gate electrode;
an interlayer dielectric layer on the source/drain pattern and the gate capping pattern;
an active contact penetrating the interlayer dielectric layer, the active contact being electrically connected to the source/drain pattern;
a metal-semiconductor compound layer between the active contact and the source/drain pattern;
a gate contact penetrating the interlayer dielectric layer and the gate capping pattern, the gate contact being electrically connected to the gate electrode;
a first metal layer on the interlayer dielectric layer, the first metal layer including a wiring line that is electrically connected to the gate contact;
a lower power line in the substrate;
a lower contact penetrating the device isolation layer and extending into the substrate, the lower contact vertically connecting the active contact to the lower power line; and
a power delivery network layer on a bottom surface of the substrate, wherein
the lower power line includes a body part and a connection part,
the connection part is connected to the lower contact, and
the connection part surrounds a first lower sidewall of the lower contact.
17 . The semiconductor device of claim 16 , wherein a region of the first lower sidewall of the lower contact is lower than a bottom surface of the device isolation layer.
18 . The semiconductor device of claim 16 , further comprising:
a liner on a sidewall of the lower contact, wherein
the connection part is in contact with a lower sidewall of the liner.
19 . The semiconductor device of claim 16 , wherein
a width of the lower contact decreases with decreasing distance from the bottom surface of the substrate, and
a width of the lower power line increases with decreasing distance from the bottom surface of the substrate.
20 . The semiconductor device of claim 16 , wherein
the lower contact includes grains and a grain boundary between the grains, and
an average grain size of the grains is in a range of about 100 Å to about 500 Å.