Splitter circuit for wafer processing system
The present disclosure describes a semiconductor wafer processing system that uses a splitter circuit to delivery RF power from a power supply to multiple process chambers. The wafer processing system includes a first process chamber, a second process chamber, a power supply, a match circuit, and a splitter circuit. The power supply produces an electric current. The match circuit receives the electric current from the power supply and presents an impedance to the power supply. The splitting circuit includes a first leg and a second leg. The first leg includes a first capacitor that directs a first portion of the electric current from the match circuit to the first process chamber. The second leg includes a second capacitor that directs a second portion of the electric current from the match circuit to the second process chamber.
1 . A wafer processing system comprising:
a first process chamber;
a second process chamber;
a power supply arranged to produce an electric current;
a match circuit arranged to receive the electric current from the power supply and to present an impedance to the power supply; and
a splitter circuit comprising:
a first leg comprising a first capacitor, wherein the first leg is arranged to direct a first portion of the electric current from the match circuit to the first process chamber; and
a second leg comprising a second capacitor, wherein the second leg is arranged to direct a second portion of the electric current from the match circuit to the second process chamber.
2 . The wafer processing system of claim 1 , wherein the first process chamber is connected in series with the first capacitor.
3 . The wafer processing system of claim 1 , wherein the first process chamber is connected in parallel with the first capacitor.
4 . The wafer processing system of claim 1 , wherein the first capacitor is a variable capacitor, and wherein adjusting a capacitance of the first capacitor adjusts the first portion of the electric current.
5 . The wafer processing system of claim 1 , wherein the first leg further comprises a first inductor connected in series with the first capacitor.
6 . The wafer processing system of claim 5 , wherein the first inductor is a variable inductor, and wherein adjusting an inductance of the first inductor adjusts the first portion of the electric current.
7 . The wafer processing system of claim 1 , wherein the first leg further comprises a first resistor connected in series with the first capacitor.
8 . The wafer processing system of claim 1 , wherein the match circuit comprises a variable capacitor, and wherein adjusting a capacitance of the variable capacitor adjusts the impedance.
9 . A method comprising:
producing, by a power supply, an electric current;
receiving, by a match circuit, the electric current from the power supply;
presenting, by the match circuit, an impedance to the power supply;
directing, by a first leg of a splitter circuit, a first portion of the electric current from the match circuit to a first process chamber, wherein the first leg comprises a first capacitor; and
directing by a second leg of the splitter circuit, a second portion of the electric current from the match circuit to a second process chamber, wherein the second leg comprises a second capacitor.
10 . The method of claim 9 , wherein the first process chamber is connected in series with the first capacitor.
11 . The method of claim 9 , wherein the first process chamber is connected in parallel with the first capacitor.
12 . The method of claim 9 , wherein the first capacitor is a variable capacitor, and wherein adjusting a capacitance of the first capacitor adjusts the first portion of the electric current.
13 . The method of claim 9 , wherein the first leg further comprises a first inductor connected in series with the first capacitor.
14 . The method of claim 13 , wherein the first inductor is a variable inductor, and wherein adjusting an inductance of the first inductor adjusts the first portion of the electric current.
15 . The method of claim 9 , wherein the first leg further comprises a first resistor connected in series with the first capacitor.
16 . The method of claim 9 , wherein the match circuit comprises a variable capacitor, and wherein adjusting a capacitance of the variable capacitor adjusts the impedance.
17 . A wafer processing system comprising:
a match circuit arranged to receive an electric current from a power supply and to present an impedance to the power supply; and
a splitter circuit comprising:
a first leg is configured to direct a first portion of the electric current from the match circuit to a first electrode; and
a second leg is configured to direct a second portion of the electric current from the match circuit to a second electrode, wherein the first electrode and the second electrode are positioned within different process chambers.
18 . The wafer processing system of claim 17 , wherein the first leg comprises a first capacitor connected in series with the first electrode.
19 . The wafer processing system of claim 17 , wherein the first leg comprises a first capacitor connected in parallel with the first electrode.
20 . The wafer processing system of claim 17 , wherein the match circuit comprises a variable capacitor, and wherein adjusting a capacitance of the variable capacitor adjusts the impedance.