Thermal riser system
A cooling system used with a component on a printed circuit board is described. The cooling system comprises a thermal riser having a top including a plurality of thermal riser pads to receive interconnections on a bottom of the component, a bottom including a plurality of bottom connectors configured to be coupled to traces on the printed circuit board, pins coupling each thermal riser pad to a corresponding bottom connector, the pins being electrically conductive, and a transfer fluid within the thermal riser, the transfer fluid in contact with the pins to cool the interconnections of the component, and thereby cool a bottom of the component.
1 . A cooling system for a component on a substrate comprising a thermal riser, the thermal riser comprising:
a thermal riser casing;
a plurality of pins extending through the thermal riser casing, the pins having a top comprising a plurality of thermal riser pads to receive interconnection pins on a bottom of the component, and a plurality of thermal riser solder balls are configured to be coupled to pads on the substrate;
the pins coupling each of the plurality of thermal riser pads to a corresponding thermal riser solder ball, the pins being electrically conductive;
a transfer fluid within the thermal riser, the transfer fluid in contact with the pins to cool the interconnection pins of the component and thereby cool the bottom of the component; and
a leak-proof enclosure surrounding the thermal riser and the component on the substrate, the leak-proof enclosure filled with the transfer fluid.
2 . The cooling system of claim 1 , wherein the transfer fluid is thermally conductive and electrically non-conductive.
3 . The cooling system of claim 1 , further comprising:
a heat exchanger positioned on a top of the component, the heat exchanger cooling the top of the component.
4 . The cooling system of claim 3 , wherein the heat exchanger and the thermal riser utilize the transfer fluid.
5 . The cooling system of claim 1 , further comprising a cooler outside the thermal riser to cool the transfer fluid.
6 . The cooling system of claim 1 , wherein the thermal riser casing is open on one or more sides to enable a flow of the transfer fluid through the thermal riser within the enclosure.
7 . The cooling system of claim 1 , wherein the leak-proof enclosure comprises an extended heatsink including a contact area that is in physical contact with a top of the component, and a skirt coupled to the substrate to form the leak-proof enclosure.
8 . The cooling system of claim 1 , further comprising:
a heat exchanger channel through the enclosure, the heat exchanger channel carrying a coolant further to cool the transfer fluid in the enclosure.
9 . The cooling system of claim 8 , wherein the heat exchanger channel is a heat exchanger tube, and the coolant is cooled outside the enclosure.
10 . The cooling system of claim 8 , wherein the heat exchanger channel comprises a channel within a material of the enclosure.
11 . The cooling system of claim 8 , further comprising:
a transfer fluid inflow and a transfer fluid outflow into the enclosure, so that the transfer fluid is cooled outside the enclosure.
12 . The cooling system of claim 1 , wherein the enclosure is sealed to the substrate.
13 . The cooling system of claim 1 , wherein the enclosure is sealed to the thermal riser.
14 . The cooling system of claim 1 , further comprising:
a sealant around each pin in the thermal riser, to keep the transfer fluid from leaking.
15 . The cooling system of claim 14 , wherein the sealant comprises a potting compound on a top of the thermal riser casing, and a bottom of the thermal riser casing.
16 . The cooling system of claim 1 , further comprising:
a positioning fastener to position the thermal riser on the substrate.
17 . The cooling system of claim 1 , further comprising:
an in-bound transfer fluid connection; and
an out-bound transfer fluid connection, the transfer fluid circulating between the in-bound transfer fluid connection and the out-bound transfer fluid connection.
18 . The cooling system of claim 17 , further comprising:
a cooler to cool the transfer fluid outside the thermal riser.
19 . A thermal riser for a component on a printed circuit board comprising:
a thermal riser casing having a top and a bottom;
a plurality of pins extending through the thermal riser casing and extending from the thermal riser casing on the top and the bottom;
the thermal riser configured to be placed between the component and the printed circuit board, the thermal riser to provide an electrical connection between the component and the printed circuit board;
transfer fluid in the thermal riser casing to cool the plurality of pins, and thereby the component coupled to the pins;
a leak-proof enclosure surrounding the thermal riser and the component on the printed circuit board, the leak-proof enclosure filled with the transfer fluid.
20 . A thermal management system for a component on a substrate comprising:
a thermal riser including a plurality of pins, the thermal riser configured to be placed between the component and the substrate, the pins in the thermal riser configured provide electrical connections between the component and the substrate;
a leak-proof enclosure surrounding the thermal riser and the component on the substrate; and
transfer fluid in the leak-proof enclosure and the thermal riser to cool the component.
21 . The thermal management system of claim 20 , wherein the thermal riser is open on one or more sides to enable a flow of the transfer fluid through the thermal riser within the enclosure.
22 . The thermal management system of claim 20 , further comprising:
a heat exchanger channel through the enclosure, the heat exchanger channel carrying a coolant further to cool the transfer fluid in the enclosure.