IP Library Patent Application 62575240
Patent Application Provisional
App. No. 62/575,240 · Confirmation No. 8913

Hybrid interconnect layers across multiple chips

Applicant: Xcelsis Corporation
Provisional Application Expired
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Code Description Pages PDF
2018-05-03 APP.FILE.REC Filing Receipt 3 View
2018-04-27 CFILE Request for Corrected Filing Receipt 1 View
2018-04-27 R3.73 Assignee showing of ownership per 37 CFR 3.73 3 View
2018-04-27 ADS Application Data Sheet 9 View
2018-04-27 N417 Electronic Filing System Acknowledgment Receipt 2 View
2017-11-01 APP.FILE.REC Filing Receipt 3 View
2017-10-20 ADS Application Data Sheet 9 View
2017-10-20 SPEC Specification 8 View
2017-10-20 WFEE Fee Worksheet (SB06) 2 View
2017-10-20 N417 Electronic Filing System Acknowledgment Receipt 2 View
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Quick Facts
App. No.
62/575,240
Filed
2017-10-20