Reloading of die carriers without removal of die carriers from sockets on test boards
A method of testing microelectronic dies is described. A respective set of dies is inserted into die carrier bodies releasably held within a set of sockets secured to a burn-in board. A set of die carrier covers is closed, each die carrier cover being secured to a respective die carrier body and closing over a respective die. The burn-in board is then inserted into a burn-in oven. Burn-in testing of the dies is then carried out while in the burn-in oven. The burn-in board is then removed from the oven. The die carrier covers are then opened. The dies are removed from the die carrier bodies without removing the die carrier bodies from the sockets. The process is then repeated with subsequent sets of dies.
1. A method of testing microelectronic dies, comprising:
inserting a first set of dies into a set of die carriers releasably held within a set of sockets secured to a test board;
testing the first set of dies while being held in the die carriers;
removing the first set of dies from the die carriers without removing the die carriers from the sockets;
inserting a second set of dies into the die carriers releasably held within the socket secured to the test board;
testing the second set of dies while being held in the die carriers; and
removing the second set of dies from the die carriers without removing the die carriers from the sockets.
2. The method of claim 1 , wherein the dies are bare dies.
3. The method of claim 1 , wherein each die is inserted into a die carrier body of the respective die carrier, further comprising:
closing a respective die carrier cover over each respective die after inserting the respective die into the respective die carrier body; and
opening the die carrier covers after testing the respective dies, the die carrier covers opening sufficiently to allow for removal of the dies from the die carriers.
4. The method of claim 1 , wherein the test board is a burn-in board, further comprising:
inserting the burn-in board with the first set of dies into a burn-in oven to test the dies; and
removing the burn-in board with the dies from the burn-in oven after the dies are tested.
5. The method of claim 1 , further comprising:
removing the set of die carriers from the set of sockets.
6. A method of testing microelectronic dies, comprising:
inserting a first set of die carriers into a set of sockets secured to the test board;
inserting a set of dies into the first set of die carriers;
testing the first set of dies while being held in the first set of die carriers;
removing the first set of dies from the first set of die carriers without removing the first set of die carriers from the sockets; and
removing the first set of die carriers from the set of sockets.
7. The method of claim 6 , further comprising:
inserting a second set of die carriers into the set of sockets.