Local area semiconductor cooling system
View Patent ↗A system and method in which a semiconductor chip has electrically inactive metal-filled vias adjacent to a semiconductor device or devices to be cooled and the semiconductor device or devices are preferably surrounded by thermally insulating vias. The metal-filled vias are contacted with a thermoelectric cooler to remove excess heat from the semiconductor device or devices.
1. A semiconductor cooling system comprising:
a semiconductor chip comprising a semiconductor portion having a plurality of semiconductor devices and a plurality of electrically inactive metal-filled vias extending through the semiconductor portion, the semiconductor chip having a back (inactive) side and a front (active) side;
a thermally conducting layer on the back side of the semiconductor chip and in thermal contact with the plurality of metal-filled vias, wherein the plurality of metal-filled vias in combination with the thermally conducting layer provide a path for the removal of heat from at least one device; and
a thermoelectric cooler in contact with the thermally conducting layer.
2. The semiconductor cooling system of claim 1 further comprising a plurality of thermally insulating vias extending through the semiconductor portion and surrounding at least one semiconductor device, the plurality of thermally insulating vias providing a thermal insulating wall to confine heat output from the at least one semiconductor device.
3. The semiconductor cooling system of claim 1 wherein the metal-filled vias are situated between, and not in contact with, the plurality of semiconductor devices.
4. The semiconductor cooling system of claim 2 wherein the plurality of metal-filled vias and plurality of insulating vias extend only through the semiconductor portion.
5. The semiconductor cooling system of claim 1 wherein the semiconductor chip is joined face side down onto a printed circuit board by solder ball connections.
6. The semiconductor cooling system of claim 1 further comprising a thermally conducting lid in contact with the thermoelectric cooler and a heat sink in contact with the thermally conducting lid.
7. The semiconductor cooling system of claim 1 further comprising a thermal sensor to control an output of the thermoelectric cooler.
8. The semiconductor cooling system of claim 7 wherein the thermal sensor and thermoelectric cooler are configured in a closed-loop feedback system.
9. A semiconductor cooling system comprising:
a semiconductor chip comprising:
a plurality of semiconductor devices,
a plurality of thermally insulating vias surrounding at least one semiconductor device, the plurality of thermally insulating vias providing a thermal insulating wall to confine heat output from the at least one semiconductor device, and
a plurality of electrically inactive metal-filled vias adjacent to the at least one semiconductor device, the plurality of metal-filled vias moving the heat output from the at least one semiconductor device to a side of the semiconductor chip; and
a thermoelectric cooler in contact with the side of the semiconductor chip.
10. A semiconductor cooling system comprising:
a semiconductor chip comprising a semiconductor portion having a plurality of semiconductor devices and a metallization portion having a plurality of electrically inactive metal-filled vias and no semiconductor devices, the semiconductor chip having a back (inactive side) and a front (active) side wherein the plurality of metal-filled vias extending through the metallization portion to a front side of the die; and
a thermoelectric cooler in contact with the front side of the semiconductor chip.
11. The semiconductor cooling system of claim 10 further comprising a plurality of thermally insulating vias extending through the semiconductor portion and surrounding at least one semiconductor device, the plurality of thermally insulating vias providing a thermal insulating wall to confine heat output from the at least one semiconductor device.
12. The semiconductor cooling system of claim 10 wherein the metal-filled vias are situated adjacent to, and not in contact with, the plurality of semiconductor devices.
13. The semiconductor cooling system of claim 11 wherein the plurality of metal-filled vias extend only through the metallization portion and the plurality of insulating vias extend only through the semiconductor portion.
14. The semiconductor cooling system of claim 10 further comprising a printed circuit board to which a back side of the semiconductor chip is joined and a plurality of wires extending from a periphery of the front side of the semiconductor chip and making electrical contact with the printed circuit board and wherein the thermoelectric cooler is in contact with a central portion of the front side of the die.
15. The semiconductor cooling system of claim 10 further comprising a thermally conducting lid in contact with the thermoelectric cooler and a heat sink in contact with the thermally conducting lid.
16. The semiconductor cooling system of claim 10 further comprising a thermal sensor to control an output of the thermoelectric cooler.
17. The semiconductor cooling system of claim 16 wherein the thermal sensor and thermoelectric cooler are configured in a closed-loop feedback system.
18. A method of cooling a semiconductor chip comprising the steps of:
placing a plurality of electrically inactive metal-filled vias adjacent to at least one semiconductor device to be cooled;
surrounding the at least one semiconductor device to be cooled with a plurality of thermally insulating vias so as to provide a thermally insulating wall to confine heat output from the at least one semiconductor device; and
contacting the plurality of metal-filled vias with a thermoelectric cooler so as to remove excess heat from the semiconductor device.
19. The method of claim 18 further comprising the step of controlling the thermoelectric cooler with a thermal sensor.
20. The method of claim 19 wherein the thermal sensor is in a closed loop feedback system with the thermoelectric cooler.