Method of assembling semiconductor devices with LEDS
Methods of forming integrated circuit packages having an LED molded into the package, and the integrated circuit package formed thereby. An integrated circuit including one or more semiconductor die, passive components and an LED may be assembled on a panel. The one or more semiconductor die, passive components and LED may all then be encapsulated in a molding compound, and the integrated circuits then singularized to form individual integrated circuit packages. The integrated circuits are cut from the panel so that a portion of the lens of the LED is severed during the singularization process, and an end of the lens remaining within the package lies flush with an edge of the package to emit light outside of the package.
1. An integrated circuit package, comprising:
a base;
one or more semiconductor die mounted on the base;
a light emitting diode mounted on the base;
molding compound encapsulating the one or more semiconductor die and at least partially encapsulating the light emitting diode, an end of the light emitting diode lying flush with an edge of the integrated circuit package and capable of emitting light outside the package.
2. An integrated circuit package as recited in claim 1 , wherein the base comprises one of a substrate, a leadframe and a tape.
3. An integrated circuit package as recited in claim 1 , further comprising one or more passive components mounted on the base.
4. An integrated circuit package as recited in claim 1 , the LED capable of indicating a state of the integrated circuit package.
5. An integrated circuit package as recited in claim 1 , further comprising at least a second light emitting diode mounted on the base, the at least second light emitting diode being encapsulated in the molding compound, and an end of the at least second light emitting diode lying flush with an edge of the integrated circuit package and capable of emitting light outside the package.