Fin-type field effect transistor structure with merged source/drain silicide and method of forming the structure
View Patent ↗Disclosed herein are embodiments of a design structure of a multiple fin fin-type field effect transistor (i.e., a multiple fin dual-gate or tri-gate field effect transistor) in which the multiple fins are partially or completely merged by a highly conductive material (e.g., a metal silicide). Merging the fins in this manner allow series resistance to be minimized with little, if any, increase in the parasitic capacitance between the gate and source/drain regions. Merging the semiconductor fins in this manner also allows each of the source/drain regions to be contacted by a single contact via as well as more flexible placement of that contact via.
1. A design structure embodied in a machine readable medium used in a design process, the design structure comprising a field effect transistor comprising:
a substrate;
a plurality of semiconductor fins on said substrate, each of said semiconductor fins having a top surface, sidewalls, a first end region, a second end region and a center region positioned laterally between said first end region and said second end region, said first end region and said second end region comprising source/drain regions and said center region comprising a channel region;
a gate electrode on said top surface and said sidewalls of each of said semiconductor fins at said center region;
gate sidewall spacers on said top surface and said sidewalls of each of said semiconductor fins immediately adjacent to opposite sides of said gate electrode; and
a conductor, comprising a metal silicide material on said top surface and said sidewalls of each of said semiconductor fins at only said first end region immediately adjacent to one of said gate sidewall spacers such that said metal silicide material fills at least an upper portion of a space extending between adjacent first end regions of adjacent semiconductor fins so as to electrically connect said first end regions, said one of said gate sidewall spacers electrically isolating said conductor from said gate electrode.
2. The design structure according to claim 1 , said metal silicide material comprising any one of nickel silicide, cobalt silicide and titanium silicide.
3. The design structure according to claim 1 , further comprising an epitaxial silicon layer on said top surface and said opposing sidewalls of each of said semiconductor fins at said first end region such that said epitaxial silicon layer is positioned between said semiconductor fins and said conductive material.
4. The design structure according to claim 1 , said design structure comprising a netlist which describes a circuit.
5. The design structure according to claim 1 , said design structure residing on a storage medium as a data format used for the exchange of layout data of integrated circuits.
6. The design structure according to claim 1 , said design structure including at least one of test data files, characterization data, verification data, and design specifications.
7. A design structure embodied in a machine readable medium used in a design process, the design structure comprising a field effect transistor comprising:
a substrate;
a plurality of semiconductor fins on said substrate, each of said semiconductor fins having a top surface, sidewalls, a first end region, a second end region and a center region positioned laterally between said first end region and said second end region, said first end region and said second end region comprising source/drain regions and said center region comprising a channel region;
a gate electrode on said top surface and said sidewalls of each of said semiconductor fins at said center region;
gate sidewall spacers on said top surface and said sidewalls of each of said semiconductor fins immediately adjacent to opposite sides said gate electrode; and
a conductor comprising a conductive material covering said top surface and said sidewalls of each of said semiconductor fins at only said first end region immediately adjacent to one of said gate sidewall spacers such that said conductive material completely fills a space extending between adjacent first end regions of adjacent semiconductor fins so as to electrically connect said adjacent first end regions, said one of said gate sidewall spacers electrically isolating said conductor from said gate electrode.
8. The design structure according to claim 7 , said metal silicide material comprising any one of nickel silicide, cobalt silicide and titanium silicide.
9. The design structure according to claim 7 , further comprising an epitaxial silicon layer on said top surface and said opposing sidewalls of each of said semiconductor fins at said first end region such that said epitaxial silicon layer is positioned between said semiconductor fins and said conductive material.
10. The design structure according to claim 9 , said design structure comprising a netlist which describes a circuit.
11. The design structure according to claim 7 , said design structure residing on a storage medium as a data format used for the exchange of layout data of integrated circuits.
12. The design structure according to claim 7 , said design structure including at least one of test data files, characterization data, verification data, and design specifications.
13. A design structure embodied in a machine readable medium used in a design process, the design structure comprising a field effect transistor comprising:
a substrate;
a plurality of semiconductor fins on said substrate, each of said semiconductor fins having a top surface, sidewalls, a first end region, a second end region and a center region positioned laterally between said first end region and said second end region, said first end region and said second end region comprising source/drain regions and said center region comprising a channel region;
a gate electrode on said top surface and said sidewalls of each of said semiconductor fins at said center region;
gate sidewall spacers on said top surface and said sidewalls of each of said semiconductor fins immediately adjacent to opposite sides said gate electrode;
a first conductor comprising a metal silicide material on said top surface and said sidewalls of each of said semiconductor fins at said first end region immediately adjacent to one of said gate sidewall spacers such that said metal silicide material fills at least a first upper portion of a first space extending between adjacent first end regions of adjacent semiconductor fins so as to electrically connect said adjacent first end regions; and
a second conductor comprising said metal silicide material on said top surface and said sidewalls of each of said semiconductor fins at said second end region immediately adjacent to another one of said gate sidewall spacers such that said metal silicide material fill at least a second upper portion of a second space extending between adjacent second end regions of adjacent semiconductor fins so as to electrically connect said adjacent second end regions,
said gate sidewall spacers electrically isolating said first conductor and said second conductor from said gate electrode.
14. The design structure according to claim 13 , said metal silicide material comprising any one of nickel silicide, cobalt silicide and titanium silicide.
15. The design structure according to claim 13 , comprising an epitaxial silicon layer on said top surface and said opposing sidewalls of each of said semiconductor fins such that said epitaxial silicon layer is positioned between said semiconductor fins and said conductive material.
16. The design structure according to claim 13 , said plurality of semiconductor fins comprising at least two semiconductor fins.
17. The design structure according to claim 13 , said semiconductor fins being approximately parallel.
18. The design structure according to claim 13 , said design structure comprising a netlist which describes a circuit.
19. The design structure according to claim 13 , said design structure residing on a storage medium as a data format used for the exchange of layout data of integrated circuits.
20. The design structure according to claim 13 , said design structure including at least one of test data files, characterization data, verification data, and design specifications.