IP Library Granted Patent US 7,924,092
Granted Patent B2
US 7,924,092 · App. 12/446,311 · Granted Apr 12, 2011

Inter-stage matching network to enhance common mode stability

Assignee: Microsemi Corporation
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Quick Facts
Patent No.
US 7,924,092
App. No.
12/446,311
Granted
Apr 12, 2011
Kind
B2
Abstract

A two stage amplifier with an inter-stage matching network constituted of a first and a second transistor forming a differential first stage, a third and a fourth transistor forming a differential second stage, an on-chip connection path connecting the emitters of the first and second transistor to the emitters of the third and fourth transistors, a first transformation network and a second transformation network. A collector of the first transistor is operatively connected to a base of the third transistor by the first transformation network and a collector of the second transistor is operatively connected to a base of the fourth transistor by the second transformation network. At least one resistor is provided in the on-chip connection path to stabilize the input of the third and fourth transistors.

Claims (33)

1. An amplifier comprising:

a. a first stage differential amplifier having

i. at least one first transistor, and

ii. at least one second transistor,

wherein said at least one first transistor and said at least one second transistor are arranged to form said first stage differential amplifier with a first stage common node;

b. a second stage differential amplifier having

i. at least one third transistor, and

ii. at least one fourth transistor;

wherein said at least one third transistor and said at least one fourth transistor are arranged to form said second stage differential amplifier with a second stage common node;

c. an on-chip connection path arranged to connect the first stage common node to the second stage common node;

d. a first transformation network comprising a first shunt component and a second shunt component, said first shunt component closer to said second stage than said second shunt component, an end of said first shunt component connected to a first node of said on-chip connection path and an end of said second shunt component connected to a second node of said on-chip connection path; and

e. a second transformation network comprising a third shunt component and a fourth shunt component, said third shunt component closer to said second stage than said fourth shunt component, an end of said third shunt component connected to the first node of said on-chip connection path, and an end of said fourth shunt component connected to the second node of said on-chip connection path,

wherein

a first output of said first differential stage, associated with said at least one first transistor, is operatively connected to a first input of said second differential stage, associated with said third transistor, by said first transformation network,

a second output of said first differential stage, associated with said at least one second transistor, is operatively connected to a second input of said second differential stage, associated with said fourth transistor, by said second transformation network, and

wherein said on-chip connection path comprises a first resistor inserted between the second stage common node and the first node of the on-chip connection.

2. The amplifier of claim 1 , wherein a first input of said first stage differential amplifier, associated with said at least one first transistor, and a second input of said first stage differential amplifier, associated with said at least one second transistor, are operatively coupled to an input of said amplifier.

3. The amplifier of claim 2 , wherein a first output of said second stage differential amplifier, associated with said at least one third transistor, and a second output of said second stage differential amplifier, associated with said at least one fourth transistor, are operatively coupled to an output of said amplifier.

4. The amplifier of claim 1 , wherein

a. said at least one first transistor further comprises a plurality of transistors connected in parallel;

b. said at least one second transistor further comprises a plurality of transistors connected in parallel;

c. said at least one third transistor further comprises a plurality of transistors connected in parallel; and

d. said at least one fourth transistor further comprises a plurality of transistors connected in parallel.

5. The amplifier of claim 1 , further comprising:

a first wirebond arranged to connect the second stage common node to ground.

6. The amplifier of claim 5 , further comprising a second wirebond arranged to connect the first stage common node to ground.

7. The amplifier of claim 6 , wherein said on-chip connection path further comprises a second resistor inserted between the first node and the second node of the on-chip connection path.

8. The amplifier of claim 1 , wherein each of said first transformation network and said second transformation network further comprises an additional shunt path comprising a series connected inductor and capacitor, one end of the additional shunt path of each of said first transformation network and said second transformation network connected to the second node of said on-chip connection path.

9. The amplifier of claim 1 , wherein said at least one first transistor and said at least one second transistor are constituted of bipolar transistors.

10. The amplifier of claim 1 , wherein said at least one third transistor and said at least one fourth transistor are constituted of bipolar transistors.

11. The amplifier of claim 1 , wherein said at least one first transistor and said at least one second transistor are constituted of field effect transistors.

12. The amplifier of claim 1 , wherein said at least one third transistor and said at least one fourth transistor are constituted of field effect transistors.

13. The amplifier of claim 1 , wherein at least one of said first stage differential amplifier and said second stage differential amplifier are constituted of three terminal transconductance amplifier devices.

Assignments (13)
RELEASE OF SECURITY INTEREST Recorded Mar 9, 2022
From: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 059358/0001 →
RELEASE OF SECURITY INTEREST Recorded Feb 25, 2022
From: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 059333/0222 →
SECURITY INTEREST Recorded Sep 18, 2018
From: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
Reel/Frame 047103/0206 →
SECURITY INTEREST Recorded Jun 25, 2018
From: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 046426/0001 →
RELEASE OF SECURITY INTEREST Recorded May 29, 2018
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: MICROSEMI CORPORATION; MICROSEMI SEMICONDUCTOR (U.S.), INC.; MICROSEMI FREQUENCY AND TIME CORPORATION; MICROSEMI COMMUNICATIONS, INC.; MICROSEMI SOC CORP.; MICROSEMI CORP. - POWER PRODUCTS GROUP; MICROSEMI CORP. - RF INTEGRATED SOLUTIONS
Reel/Frame 046251/0391 →
PATENT SECURITY AGREEMENT Recorded Feb 3, 2016
From: MICROSEMI CORPORATION; MICROSEMI SEMICONDUCTOR (U.S.) INC. (F/K/A LEGERITY, INC., ZARLINK SEMICONDUCTOR (V.N.) INC., CENTELLAX, INC., AND ZARLINK SEMICONDUCTOR (U.S.) INC.); MICROSEMI FREQUENCY AND TIME CORPORATION (F/K/A SYMMETRICON, INC.); MICROSEMI COMMUNICATIONS, INC. (F/K/A VITESSE SEMICONDUCTOR CORPORATION); MICROSEMI SOC CORP. (F/K/A ACTEL CORPORATION); MICROSEMI CORP. - POWER PRODUCTS GROUP (F/K/A ADVANCED POWER TECHNOLOGY INC.); MICROSEMI CORP. - RF INTEGRATED SOLUTIONS (F/K/A AML COMMUNICATIONS, INC.)
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 037691/0697 →
RELEASE OF SECURITY INTEREST Recorded Jan 19, 2016
From: BANK OF AMERICA, N.A.
To: MICROSEMI CORPORATION; MICROSEMI CORP.-ANALOG MIXED SIGNAL GROUP, A DELAWARE CORPORATION; MICROSEMI SOC CORP., A CALIFORNIA CORPORATION; MICROSEMI SEMICONDUCTOR (U.S.) INC., A DELAWARE CORPORATION; MICROSEMI FREQUENCY AND TIME CORPORATION, A DELAWARE CORPORATION; MICROSEMI COMMUNICATIONS, INC. (F/K/A VITESSE SEMICONDUCTOR CORPORATION), A DELAWARE CORPORATION; MICROSEMI CORP.-MEMORY AND STORAGE SOLUTIONS (F/K/A WHITE ELECTRONIC DESIGNS CORPORATION), AN INDIANA CORPORATION
Reel/Frame 037558/0711 →
NOTICE OF SUCCESSION OF AGENCY Recorded Apr 9, 2015
From: ROYAL BANK OF CANADA (AS SUCCESSOR TO MORGAN STANLEY & CO. LLC)
To: BANK OF AMERICA, N.A., AS SUCCESSOR AGENT
Reel/Frame 035657/0223 →
SUPPLEMENTAL PATENT SECURITY AGREEMENT Recorded Nov 11, 2011
From: MICROSEMI CORPORATION; MICROSEMI CORP. - ANALOG MIXED SIGNAL GROUP; MICROSEMI CORP. - MASSACHUSETTS; ACTEL CORPORATION
To: MORGAN STANLEY & CO. LLC
Reel/Frame 027213/0611 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 4, 2011
From: MICRO RF SILICON, INC.
To: MICROSEMI CORPORATION
Reel/Frame 025576/0642 →
CORRECTIVE ASSIGNMENT TO CORRECT THE ASSIGNEE NAME AND DOCUMENT DATE PREVIOUSLY RECORDED ON REEL 025178 FRAME 0677. ASSIGNOR(S) HEREBY CONFIRMS THE ORIGINAL DOCUMENT WAS EXECUTED IN ERROR, AFTER EXECUTION OF THE PRESENT DOCUMENT. Recorded Nov 29, 2010
From: VT SILICON, INC.
To: MICRO RF SILICON, INC.
Reel/Frame 025413/0626 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 25, 2010
From: VT SILICON
To: MICROSEMI CORPORATION
Reel/Frame 025178/0677 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 20, 2009
From: HERSHBERGER, KYLE MARK
To: VT SILICON, INC.
Reel/Frame 022975/0235 →
Continuity (2)
Provisional Application 60853130 · Oct 20, 2006
Related Publication 20100315167A1 · Dec 16, 2010