High-K metal gate CMOS

1. A method of forming a semiconductor device comprising:

forming a Ge-containing layer atop p-type device regions of a substrate, wherein the Ge-containing layer is not present in the n-type device regions of the substrate;

forming a first dielectric layer atop the p-type device regions and the n-type device regions;

removing the first dielectric layer from a second portion of the substrate including at least one of the p-type device regions and at least one of the n-type device regions, wherein a remaining portion of the first dielectric layer is present in a first portion of the substrate;

forming a second dielectric layer overlying the first dielectric layer in the first portion of the substrate and overlying the second portion of the substrate;

forming gate structures atop the p-type device regions and the n-type device regions, the gate structures to the n-type device regions including a rare earth metal; and

forming analog devices in the first portion of the substrate and digital devices in the second portion of the substrate.

2. The method of claim 1 , wherein the providing of the substrate having p-type device regions and n-type device regions further comprises forming a hardmask dielectric layer at an upper surface of each of the p-type device regions and the n-type device regions.

3. The method of claim 1 , wherein prior to the forming of the Ge-containing layer atop the p-type device regions of the substrate, the method further comprises forming an etch mask atop the n-type device regions that exposes the p-type device regions, etching a hardmask dielectric layer in the n-type device regions to expose an upper surface of the substrate in the p-type device regions, and removing the etch mask.

4. The method of claim 1 , wherein the Ge-containing layer is composed of SiGe.

5. The method of claim 4 , wherein the forming of the first dielectric layer overlying the p-type device regions and the n-type device regions comprises removing a remaining portion of a hardmask dielectric layer from the n-type device regions and depositing the dielectric layer having a thickness ranging from about 1 nm to about 10 nm.

6. The method of claim 5 , wherein the forming of the second dielectric layer overlying the first dielectric layer in the first portion of the substrate and overlying the second portion of the substrate comprises depositing a high-k dielectric material having a thickness ranging from about 1 nm to about 3 nm.

7. A method of forming a semiconductor device comprising:

forming a Ge-containing layer atop p-type device regions of a substrate, wherein the Ge-containing layer is not present in the n-type device regions of the substrate;

forming a first dielectric layer atop the p-type device regions and the n-type device regions;

removing the first dielectric layer from a second portion of the substrate including at least one of the p-type device regions and at least one of the n-type device regions, wherein a remaining portion of the first dielectric layer is present in a first portion of the substrate;

forming a high-k dielectric layer overlying the first dielectric layer in the first portion of the substrate and overlying the second portion of the substrate;

depositing a rare earth metal atop the high-k dielectric material;

removing the rare earth metal from the p-type device regions;

forming a metal nitride layer overlying the rare earth metal in the n-type device regions and atop the high-k dielectric material in the p-type device regions;

forming a Si-containing layer atop the metal nitride layer; and

patterning the rare earth metal, the high-k dielectric material, the metal nitride layer and the Si-containing layer to provide gate structures atop the p-type device regions and the n-type device regions.