Stacked integrated circuit package system
A stacked integrated circuit package system includes: forming a recessed integrated circuit package system having a first encapsulation over a first integrated circuit and an interior cavity in the first encapsulation; forming a mountable integrated circuit package system having a second integrated circuit over a carrier; and mounting the recessed integrated circuit package system over the mountable integrated circuit package system with the second integrated circuit within the interior cavity and the first integrated circuit coupled with the carrier.
1. A method for manufacturing a stacked integrated circuit package system comprising:
forming a recessed integrated circuit package system having a first encapsulation over a first integrated circuit, an interior cavity in the first encapsulation, a mounting structure, a conductive site comprised of substantially the same material as the mounting structure. and the first integrated circuit connected with the conductive site over a peripheral cavity of the first encapsulation:
forming a mountable integrated circuit package system having a second integrated circuit over a carrier; and
mounting the recessed integrated circuit package system over the mountable integrated circuit package system with the second integrated circuit within the interior cavity and the first integrated circuit coupled with the carrier.
2. The method as claimed in claim 1 wherein forming the recessed integrated circuit package system includes:
forming the mounting structure and the conductive site comprised of substantially the same material as the mounting structure; and
mounting the first integrated circuit over the mounting structure and over the interior cavity.
3. The method as claimed in claim 1 wherein:
forming the mountable integrated circuit package system includes forming a second encapsulation over the second integrated circuit; and
mounting the recessed integrated circuit package system over the mountable integrated circuit package system includes fitting the second encapsulation within the interior cavity.
4. The method as claimed in claim 1 wherein:
forming the recessed integrated circuit package system includes connecting the first integrated circuit with the conductive site over the peripheral cavity of the first encapsulation;
forming the mountable integrated circuit package system includes forming a stacking interconnect over the carrier; and
mounting the recessed integrated circuit package system over the mountable integrated circuit package system includes connecting the stacking interconnect within the peripheral cavity.
5. A method for manufacturing a stacked integrated circuit package system comprising:
forming a recessed integrated circuit package system having a first encapsulation over a first integrated circuit, an interior cavity in the first encapsulation, and the first encapsulation having a peripheral cavity with a conductive site exposed and a wall of the peripheral cavity in a non-vertical configuration includes:
forming a mounting structure and the conductive site comprised of substantially the same material as the mounting structure,
mounting the first integrated circuit over the mounting structure and over the interior cavity, and
connecting the first integrated circuit and the conductive site;
forming a mountable integrated circuit package system having a second integrated circuit over a carrier; and
mounting the recessed integrated circuit package system over the mountable integrated circuit package system with the second integrated circuit within the interior cavity and the first integrated circuit coupled with the carrier.
6. The method as claimed in claim 5 wherein mounting the recessed integrated circuit package system over the mountable integrated circuit package system includes connecting the conductive site and the carrier.
7. The method as claimed in claim 5 wherein forming the mountable integrated circuit package system having the second integrated circuit includes mounting a flip chip over the carrier.
8. The method as claimed in claim 5 further comprising attaching an external interconnect below and to the carrier.
9. A stacked integrated circuit package system comprising:
a recessed integrated circuit package system having a first encapsulation over a first integrated circuit, an interior cavity in the first encapsulation, a mounting structure exposed by the first encapsulation. a conductive site exposed by the first encapsulation and comprised of substantially the same material as the mounting structure, and the first integrated circuit connected with the conductive site over a peripheral cavity of the first encapsulation: and
a mountable integrated circuit package system having a second integrated circuit over a carrier with the recessed integrated circuit package system thereover with the second integrated circuit within the interior cavity and the first integrated circuit coupled with the carrier.
10. The system as claimed in claim 9 wherein the recessed integrated circuit package system includes:
the mounting structure exposed by the first encapsulation;
the conductive site exposed by the first encapsulation and comprised of substantially the same material as the mounting structure; and
the first integrated circuit over the mounting structure and over the interior cavity.
11. The system as claimed in claim 9 wherein:
the mountable integrated circuit package system includes a second encapsulation over the second integrated circuit; and
the recessed integrated circuit package system over the mountable integrated circuit package system includes the second encapsulation within the interior cavity.
12. The system as claimed in claim 9 wherein:
the recessed integrated circuit package system includes the first integrated circuit connected with the conductive site over the peripheral cavity of the first encapsulation;
the mountable integrated circuit package system includes a stacking interconnect over the carrier; and
the recessed integrated circuit package system mounted over the mountable integrated circuit package system includes the stacking interconnect within the peripheral cavity.
13. The system as claimed in claim 9 wherein the recessed integrated circuit package system includes:
the mounting structure exposed by the first encapsulation;
the conductive site exposed by the first encapsulation and comprised of substantially the same material as the mounting structure; and
the first integrated circuit over the mounting structure and over the interior cavity, and connected with the conductive site.
14. The system as claimed in claim 13 wherein the recessed integrated circuit package system over the mountable integrated circuit package system includes the conductive site connected with the carrier.
15. The system as claimed in claim 13 wherein the recessed integrated circuit package system includes the first encapsulation having the peripheral cavity with the conductive site exposed and a wall of the peripheral cavity in a non-vertical configuration.
16. The system as claimed in claim 13 wherein the mountable integrated circuit package system having the second integrated circuit includes a flip chip over the carrier.
17. The system as claimed in claim 13 further comprising an external interconnect below and attached to the carrier.