IP Library Granted Patent US 8,066,553
Granted Patent B2
US 8,066,553 · App. 10/598,851 · Granted Nov 29, 2011

Wafer clamping device for a double side grinder

Assignee: MEMC Electronic Materials, Inc.
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 8,066,553
App. No.
10/598,851
Granted
Nov 29, 2011
Kind
B2
Abstract

A hydrostatic pad for use in holding a semiconductor wafer during grinding of the wafer by grinding wheels. The pad includes hydrostatic pockets formed in a face of the body directly opposed to the wafer. The pockets are adapted for receiving fluid through the body and into the pockets to provide a barrier between the body face and the workpiece while still applying pressure to hold the workpiece during grinding. The hydrostatic pads allow the wafer to rotate relative to the pads about their common axis. The pockets are oriented to reduce hydrostatic bending moments that are produced in the wafer when the grinding wheels shift or tilt relative to the hydrostatic pads, helping prevent nanotopology degradation of surfaces of the wafer commonly caused by shift and tilt of the grinding wheels.

Claims (22)

1. A hydrostatic pad for use in holding a workpiece during grinding of the workpiece by grinding wheels, the hydrostatic pad comprising:

a body for holding the workpiece during grinding, the body having a working surface area and a horizontal axis;

an opening formed in the body for receiving a first grinding wheel therethrough into engagement with the workpiece, the opening having a peripheral edge defined by the body;

at least one pocket formed in the body and being adapted for receiving fluid through the body into the pocket for providing a barrier between the body and the workpiece and for applying pressure to the workpiece during grinding, a total pocket surface area of all pockets in the body being less than said working surface area of the body such that a ratio of the pocket surface area to the working surface area is less than about 0.26; and

a free region recessed in the body between the peripheral edge of said opening and the radially opposed one pocket, the pad applying substantially no clamping pressure to the workpiece at the edge of the one pocket, said edge being spaced apart from the peripheral edge of the opening in the body such that the free region is therebetween.

2. A hydrostatic pad as set forth in claim 1 wherein the ratio of said pocket surface area to said working surface area is about 0.17.

3. A hydrostatic pad as set forth in claim 1 wherein said pocket surface area is less than about 225 cm 2 (34.87 in 2 ).

4. A hydrostatic pad as set forth in claim 1 wherein about 20% or less of said pocket surface area is formed below the horizontal axis of the body.

5. A hydrostatic pad as set forth in claim 1 comprising multiple pockets and further comprising drain channels between at least some of the pockets for removing excess fluid from the pockets, each pocket comprising an injection port for introducing fluid from the body into the respective pocket.

6. A hydrostatic pad as set forth in claim 5 wherein the opening in the body has a center generally corresponding to the axis of rotation of the grinding wheel when received in the opening, the hydrostatic pockets being arranged in radially opposed relation to portions of said peripheral edge and being located a radial distance from the center of said opening.

7. A hydrostatic pad as set forth in claim 6 wherein the opening in the body is formed adjacent a peripheral edge of the body.

8. A hydrostatic pad as set forth in claim 1 in combination with a grinding machine including a first grinding wheel received into the opening of the hydrostatic pad body, a second hydrostatic pad, a second grinding wheel received into an opening of a body of said second hydrostatic pad, wherein the two hydrostatic pads and two grinding wheels are arranged in opposed relation to each other for holding the workpiece therebetween and providing simultaneous double side grinding of the workpiece.

9. A hydrostatic pad for use in holding a workpiece during grinding of the workpiece by grinding wheels, the hydrostatic pad comprising:

a body for holding the workpiece during grinding, the body having a working surface area and a center, the body also having a horizontal axis passing through the center;

an opening formed in the body for receiving a first grinding wheel therethrough into engagement with the workpiece, the opening having a peripheral edge defined by the body and further having a center;

at least one pocket formed in the body and being adapted for receiving fluid through the body into the pocket for providing a fluid barrier between the body and the workpiece and for applying pressure to the workpiece during grinding, the one pocket being arranged in radially opposed relation to a portion of the peripheral edge of said opening at a radial distance from the center of said opening; and

a free region formed in the body between the peripheral edge of said opening and the radially opposed one pocket, the free region being constructed so that the hydrostatic pad applies substantially no clamping pressure to the workpiece at the free region when in use, wherein the free region is recessed from an edge of the one pocket, the pad applying substantially no clamping pressure to the workpiece at the edge of the one pocket, said edge being spaced apart from the peripheral edge of the opening in the body such that the free region is therebetween.

10. A hydrostatic pad as set forth in claim 9 wherein radial distances from the center of the opening in the pad to different portions of the edge of the one pocket are nonuniform along said edge.

11. A hydrostatic pad as set forth in claim 10 wherein at least one measure of said radial distances is at least about 1.1 times a radius of the opening in the body.

12. A hydrostatic pad as set forth in claim 9 wherein a spacing between a peripheral edge of the grinding wheel when received in the opening in the pad and a radially opposed portion of the pocket edge is nonuniform along said pocket edge and wherein at least one measure of said spacing is at least 0.1 times a radius of the opening in the body.

13. A hydrostatic pad as set forth in claim 9 comprising plural pockets arranged in radially opposed relation to the opening of the body and wherein said free region is formed between the peripheral edge of said opening and at least one of the radially opposed pockets.

14. A hydrostatic pad as set forth in claim 9 further comprising a second body and a second grinding wheel received into an opening of the second body, the two bodies and two grinding wheels being arranged in opposed relation to each other for holding the workpiece therebetween and providing simultaneous double side grinding of the workpiece.

Assignments (12)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 7, 2018
From: SUNEDISON SEMICONDUCTOR LIMITED; MEMC JAPAN LIMITED; MEMC ELECTRONIC MATERIALS S.P.A.
To: GLOBALWAFERS CO., LTD.
Reel/Frame 046327/0001 →
NOTICE OF LICENSE AGREEMENT Recorded Jun 6, 2014
From: SUNEDISON SEMICONDUCTOR LIMITED
To: SUNEDISON SEMICONDUCTOR TECHNOLOGY PTE. LTD.
Reel/Frame 033099/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 27, 2014
From: MEMC ELECTRONIC MATERIALS, INC.
To: SUNEDISON SEMICONDUCTOR LIMITED (UEN201334164H)
Reel/Frame 033023/0430 →
RELEASE OF SECURITY INTEREST Recorded Mar 3, 2014
From: DEUTSCHE BANK AG NEW YORK BRANCH
To: NVT, LLC; SUN EDISON LLC; SOLAICX; SUNEDISON, INC.
Reel/Frame 032382/0724 →
SECURITY AGREEMENT Recorded Jan 30, 2014
From: SUNEDISON, INC.; SOLAICX; SUN EDISON, LLC; NVT, LLC
To: DEUTSCHE BANK AG NEW YORK BRANCH
Reel/Frame 032177/0359 →
RELEASE OF SECURITY INTEREST Recorded Dec 26, 2013
From: BANK OF AMERICA, N.A.
To: ENFLEX CORPORATION; SUN EDISON LLC; SOLAICX; SUNEDISON, INC. (F/K/A MEMC ELECTRONIC MATERIALS, INC.)
Reel/Frame 031870/0031 →
RELEASE OF SECURITY INTEREST Recorded Dec 26, 2013
From: GOLDMAN SACHS BANK USA
To: NVT, LLC; SUN EDISON LLC; SOLAICX; SUNEDISON, INC. (F/K/A MEMC ELECTRONIC MATERIALS, INC.)
Reel/Frame 031870/0092 →
SECURITY AGREEMENT Recorded Oct 1, 2012
From: NVT, LLC; SUN EDISON LLC; SOLAICX, INC.; MEMC ELECTRONIC MATERIALS, INC.
To: GOLDMAN SACHS BANK USA
Reel/Frame 029057/0810 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 26, 2011
From: MEMC JAPAN LTD.
To: MEMC ELECTRONIC MATERIALS, INC.
Reel/Frame 026813/0773 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 26, 2011
From: BHAGAVAT, MILIND S.; GUPTA, PUNEET; VANDAMME, ROLAND
To: MEMC ELECTRONIC MATERIALS, INC.
Reel/Frame 026813/0719 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 26, 2011
From: KAZAMA, TAKUTO; TACHI, NORIYUKI
To: MEMC JAPAN LTD.
Reel/Frame 026813/0463 →
SECURITY AGREEMENT Recorded Apr 1, 2011
From: MEMC ELECTRONIC MATERIALS, INC.; SUNEDISON LLC; SOLAICX
To: BANK OF AMERICA, N.A.
Reel/Frame 026064/0720 →
Continuity (2)
Provisional Application 60554684 · Mar 19, 2004
Related Publication 20080020684A1 · Jan 24, 2008