Process for improving the adhesion of polymeric materials to metal surfaces
View Patent ↗An adhesion promoting composition and a process for treating metal surfaces with the adhesion promoting composition is described. The adhesion promoting composition comprises an oxidizer, an acid, a corrosion inhibitor, a source of halide ions and a material selected from a mercapto propane sulfonate, mercapto propane sulfonic acid, and bis-sodium sulfopropyl disulfide. The adhesion promoting composition increases the adhesion of polymeric materials to the metal surfaces and also provides increased acid resistance.
1. An adhesion promoting composition useful in treating metal surfaces prior to bonding polymeric materials to the metal surfaces, the adhesion promoting composition comprising:
a) an oxidizer;
b) an inorganic acid;
c) a corrosion inhibitor;
d) a source of halide ions; and
e) at least one material selected from the group consisting of a mercapto propane sulfonate, mercapto propane sulfonic acid, and bis-sodium sulfopropyl disulfide.
2. The adhesion promoting composition according to claim 1 , wherein the oxidizer is hydrogen peroxide.
3. The adhesion promoting composition according to claim 1 , wherein the inorganic acid is a mineral acid.
4. The adhesion promoting composition according to claim 3 , wherein the mineral acid is sulfuric acid.
5. The adhesion promoting composition according to claim 1 , wherein the corrosion inhibitor is selected from the group consisting of triazoles, benzotriazoles, tetrazoles, imidazoles, benzimidazoles and combinations of one or more of the foregoing.
6. The adhesion promoting composition according to claim 5 , wherein the corrosion inhibitor is a benzotriazole.
7. The adhesion promoting composition according to claim 1 , wherein the at least one material is mercapto propane sulfonate.
8. The adhesion promoting composition according to claim 7 , wherein the mercapto propane sulfonate is present in the composition at a concentration of between about 300 ppm and about 800 ppm.
9. The adhesion promoting composition according to claim 1 , wherein the at least one material is bis-sodium sulfopropyl disulfide.
10. The adhesion promoting composition according to claim 9 , wherein bis-sodium sulfopropyl disulfide is present in the composition at a concentration of between about 600 ppm and about 1000 ppm.
11. A process for increasing the adhesion of a polymeric material to a metal surface, wherein the metal surface comprises copper, the process comprising:
a) contacting the metal surface with an adhesion promoting composition comprising:
1) hydrogen peroxide;
2) an inorganic acid;
3) a corrosion inhibitor;
4) a source of halide ions; and
5) at least one material selected from the group consisting of a mercapto propane sulfonate, mercapto propane sulfonic acid, and bis-sodium sulfopropyl disulfide; and thereafter
b) bonding the polymeric material to the metal surface.
12. The method according to claim 11 , wherein the inorganic acid is a mineral acid.
13. The method according to claim 12 , wherein the mineral acid is sulfuric acid.
14. The method according to claim 11 , wherein the corrosion inhibitor is selected from the group consisting of triazoles, benzotriazoles, tetrazoles, imidazoles, benzimidazoles and combinations of one or more of the foregoing.
15. The method according to claim 14 , wherein the corrosion inhibitor is a benzotriazole.
16. The method according to claim 11 , wherein the at least one material is mercapto propane sulfonate.
17. The method according to claim 16 , wherein the mercapto propane sulfonate is present in the composition at a concentration of between about 300 ppm and about 800 ppm.
18. The method according to claim 11 , wherein the at least one material is bis-sodium sulfopropyl disulfide.
19. The method according to claim 18 , wherein bis-sodium sulfopropyl disulfide is present in the composition at a concentration of between about 600 ppm and about 1000 ppm.
20. The method according to claim 11 , wherein the metal surface is contacted with a pre-dip solution immediately prior to contacting the metal surface with the adhesion promoting composition.
21. The method according to claim 11 , wherein the metal surface comprises a copper or copper alloy surface.