Integrated circuit package system using interposer
An integrated circuit package system is provided in which an interposer of predetermined thickness including a central cavity is formed. Additionally, one or more contacts are formed around the central cavity on the interposer. The interposer is employed for connecting first and second packages.
1. A method of manufacture of an integrated circuit package system comprising:
forming an interposer of predetermined thickness to include a central cavity;
forming one or more contacts around the central cavity on the interposer, the contacts including solder balls in a solder resist on opposing sides of the interposer; and
employing the interposer for connecting a top and a bottom package.
2. The method of claim 1 further comprising: forming the interposer substantially the same size as a bottom substrate of the bottom package; and forming the central cavity large enough to contain a mold portion of the bottom package.
3. The method of claim 1 further comprising:
forming the interposer to allow for various chip thickness configurations, chip stacking configurations, or multiple vertical packages by stacking the interposer between each package.
4. The method of claim 1 further comprising:
forming an epoxy mold compound selected from the group consisting of normal and fine filler sizes around an integrated circuit chip.
5. The method of claim 1 further comprising:
forming electrical connections between one or more pads on an integrated circuit and one or more terminals on a substrate by wirebonding.
6. A method of manufacture of an integrated circuit package system comprising:
forming a bottom package with a mold portion;
forming an interposer over the bottom package with a central cavity and one or more contacts for electrically interconnecting the bottom package and a top package through the interposer, the contacts including solder balls in a solder resist on opposing sides of the interposer; and
forming the top package over the interposer.
7. The method of claim 6 further comprising: forming the interposer substantially the same size as the bottom package; and forming the central cavity large enough to contain the mold portion of the bottom package.
8. The method of claim 6 further comprising:
forming the interposer to allow for various chip thickness configurations, chip stacking configurations, or multiple vertical packages by stacking the interposer between each package.
9. The method of claim 6 further comprising:
forming one or more of the contacts to include organic solderability preservatives or solder on pad.
10. The method of claim 6 further comprising:
forming electrical connections between one or more pads and one or more terminals by wirebonding.
11. An integrated circuit package system comprising:
an interposer with a central cavity and predetermined thickness for connecting a bottom and a top package; and
one or more contacts formed around the cavity, the contacts including solder balls in a solder resist on opposing sides of the interposer.
12. The system of claim 11 further comprising: the bottom package having a bottom substrate and a mold portion; and wherein: the interposer is substantially the same size as the bottom substrate; and the central cavity is large enough to contain the mold portion of the bottom package.
13. The system of claim 11 further comprising:
two or more of the interposer to provide various chip thickness configurations, chip stacking configurations, or multiple vertical stacked package configurations.
14. The system of claim 11 further comprising:
one or more epoxy mold compounds selected from the group consisting of normal and fine filler sizes on at least one side of the interposer.
15. The system of claim 11 further comprising:
electrical connections wirebonded between one or more pads on an integrated circuit and one or more terminals on a substrate.
16. An integrated circuit package system comprising:
a bottom package with a mold portion;
a top package; and
an interposer with a central cavity between the bottom package and the top package, the interposer electrically interconnecting the bottom package and the top package by one or more contacts around the central cavity and connected through the interposer, the contacts including solder balls in a solder resist on opposing sides of the interposer.
17. The system of claim 16 wherein: the interposer is substantially the same size as a bottom substrate; and the central cavity is large enough to contain the mold portion of the bottom substrate.
18. The system of claim 16 further comprising:
a plurality of packages; and
a plurality of the interposer for providing various chip thickness configurations, chip stacking configurations, or multiple vertical packages by stacking the interposer between each of the plurality of packages.
19. The system of claim 16 further comprising:
one or more epoxy mold compounds selected from the group consisting of normal and fine filler sizes on the interposer.
20. The system of claim 16 wherein:
the one or more contacts on the interposer include organic solderability preservatives or solder on pad.