Bump chip carrier semiconductor package system
A bump chip carrier semiconductor package system is provided including providing a lead frame, forming circuit sockets in the lead frame, mounting a semiconductor die on the lead frame, wherein the semiconductor die have electrical interconnects that connects to the circuit sockets, and encapsulating a molding compound to cover the semiconductor die and the electrical interconnects.
1. A method for manufacturing a bump chip carrier semiconductor package system comprising:
providing a lead frame having circuit sockets formed to a concave shape;
mounting a semiconductor die on the lead frame, wherein the semiconductor die faces the concavities of the circuit sockets and has electrical interconnects that extend into and connect to bottoms of the circuit sockets; and
encapsulating the semiconductor die and the compound filling a space around the electrical interconnects in the circuit sockets with a molding compound.
2. The method as claimed in claim 1 further comprising:
forming terminal bumps in the lead frame;
connecting lead frame interconnects to the terminal bumps and the circuit sockets to redistribute an electrical signal; and
applying a trace protective material to protect the lead frame interconnects.
3. The method as claimed in claim 1 wherein forming the circuit sockets in the lead frame comprises plating the lead frame with conductive materials.
4. The method as claimed in claim 1 wherein mounting the semiconductor die on the lead frame comprises connecting flip chip bumps from the semiconductor die to the circuit sockets.
5. The method as claimed in claim 1 wherein encapsulating the semiconductor die and the electrical interconnects comprises filling a space between the semiconductor die and the lead frame with the molding compound.
6. A method for manufacturing a bump chip carrier semiconductor package system comprising:
providing a lead frame having circuit sockets formed to a concave shape;
forming terminal bumps in the lead frame;
connecting lead frame interconnects to the terminal bumps and the circuit sockets to redistribute an electrical signal;
mounting a semiconductor die on the lead frame, wherein the semiconductor die faces the concavities of the circuit sockets and has electrical interconnects that extend into and connect to bottoms of the circuit sockets; and
encapsulating the semiconductor die and the electrical interconnects with a molding compound, the molding compound filling a space around the electrical interconnects in the circuit sockets.
7. The method as claimed in claim 6 further comprising half etching terminal recesses, pad recesses, and interconnect channels in the lead frame to form the terminal bumps, the circuit sockets, and the lead frame interconnects, respectively.
8. The method as claimed in claim 6 wherein encapsulating the semiconductor die and the electrical interconnects comprises exposing a non-active side of the semiconductor die.
9. The method as claimed in claim 6 further comprising exposing bottoms of the terminal bumps and the circuit sockets by a chemical etch of the lead frame.
10. The method as claimed in claim 6 wherein providing the lead frame comprises forming a metallic alloy to form the lead frame.
11. A bump chip carrier semiconductor package system comprising:
a lead frame having circuit sockets formed to a concave shape;
a semiconductor die on the lead frame, wherein the semiconductor die faces the concavities of the circuit sockets and has electrical interconnects that extend into and connect to bottoms of the circuit sockets; and
a molding compound for encapsulating the semiconductor die and the electrical interconnects, the molding compound filling a space around the electrical interconnects in the circuit sockets.
12. The system as claimed in claim 11 further comprising:
terminal bumps formed in the lead frame;
lead frame interconnects for connecting the terminal bumps and the circuit sockets to redistribute an electrical signal; and
a trace protective material for protecting the lead frame interconnects.
13. The system as claimed in claim 11 wherein the circuit sockets in the lead frame are conductive materials plated on the lead frame.
14. The system as claimed in claim 11 further comprising flip chip bumps connect semiconductor die to the circuit sockets.
15. The system as claimed in claim 11 wherein the molding compound fills a space between the semiconductor die and the lead frame.
16. The system as claimed in claim 11 further comprising:
the lead frame has terminal bumps formed in the lead frame; and
lead frame interconnects connected to the terminal bumps and the circuit sockets to redistribute an electrical signal.
17. The system as claimed in claim 16 further comprising terminal recesses, pad recesses, and interconnect channels in the lead frame for forming the terminal bumps, the circuit sockets, and the lead frame interconnects, respectively.
18. The system as claimed in claim 16 wherein the molding compound does not cover a non-active side of the semiconductor die.
19. The system as claimed in claim 16 wherein the lead frame does not cover the bottoms of the terminal bumps and the circuit sockets.
20. The system as claimed in claim 16 wherein the lead frame is a metallic alloy.