Apparatus and methods for packaging antennas with integrated circuit chips for millimeter wave applications
Apparatus and methods are provided for integrally packaging antennas with semiconductor IC (integrated circuit) chips to provide highly-integrated and high-performance radio/wireless communications systems for millimeter wave applications including, e.g., voice communication, data communication, and radar applications. For example, wireless communication modules are constructed with IC chips having receiver/transmitter/transceiver integrated circuits and planar antennas that are integrally constructed from BEOL (back end of line) metallization structures of the IC chip.
1. An electronic apparatus, comprising:
a metallic package frame;
an IC (integrated circuit) chip comprising an active circuit region and an antenna region, wherein the antenna region comprises an antenna integrally formed as part of a BEOL (back-end-of-line) metallization structure of the IC chip;
a non-metallic package cover; and
a substrate mounted to the metallic package frame, wherein the IC chip is mounted to the substrate such that the antenna region of the IC chip extends past an edge of the substrate and is disposed over a metallic surface of the metallic package frame.
2. A semiconductor IC (integrated circuit) chip, comprising:
a semiconductor substrate comprising an active device region and an antenna region;
wherein the antenna region comprises a Yagi antenna that is integrally formed as part of the BEOL (back-end-of-line) metallization;
wherein the Yagi antenna comprises a reflector element, fed dipole element and director element, wherein the reflector element is disposed between the fed dipole element and the active device region, and wherein the Yagi antenna is directional in a horizontal plane of the semiconductor substrate in a direction away from the active device region towards an edge of the antenna region.
3. The IC chip of claim 2 , wherein the semiconductor substrate is formed of high-resistivity silicon.
4. The IC chip of claim 2 , wherein the semiconductor substrate is formed of GaAs.
5. The IC chip of claim 2 , wherein the semiconductor substrate is formed of InP.
6. The IC chip of claim 2 , wherein the active device region comprises an IC receiver circuit.
7. The IC chip of claim 2 , wherein the active device region comprises an IC transmitter circuit.
8. The IC chip of claim 2 , wherein the active device region comprises an IC transceiver circuit.
9. The IC chip of claim 2 , wherein the antenna region comprises a plurality of Yagi antennas forming a linear antenna array.
10. The IC chip of claim 2 , wherein the active device region comprises beam-forming circuitry for controlling a radiation pattern generated by the linear antenna array.
11. The IC chip of claim 2 , further comprises an antenna feed network connected to each Yagi antenna element in the linear antenna array.
12. The apparatus of claim 1 , wherein the antenna region of the IC chip is disposed over a cavity region of the metallic package frame, wherein the cavity region comprises metallic bottom and sidewall surfaces.
13. The apparatus of claim 12 , wherein the cavity is filled with a dielectric material.
14. The apparatus of claim 13 , wherein the dielectric material is encapsulant material that forms the non-metallic package cover.
15. The apparatus of claim 12 , wherein the cavity is filled with air.
16. The apparatus of claim 12 , wherein the cavity region comprises a parabolic reflector.
17. The apparatus of claim 1 , wherein the metallic package frame comprises a leaded package frame.
18. The apparatus of claim 1 , wherein the metallic package frame comprises a non-leaded package frame.