Replacement gate having work function at valence band edge
Replacement gate stacks are provided, which increase the work function of the gate electrode of a p-type field effect transistor (PFET). In one embodiment, the work function metal stack includes a titanium-oxide-nitride layer located between a lower titanium nitride layer and an upper titanium nitride layer. The stack of the lower titanium nitride layer, the titanium-oxide-nitride layer, and the upper titanium nitride layer produces the unexpected result of increasing the work function of the work function metal stack significantly. In another embodiment, the work function metal stack includes an aluminum layer deposited at a temperature not greater than 420° C. The aluminum layer deposited at a temperature not greater than 420° C. produces the unexpected result of increasing the work function of the work function metal stack significantly.
1. A method of forming a semiconductor structure comprising a field effect transistor, said method comprising:
forming a disposable gate structure on a semiconductor substrate;
forming and planarizing a planarization dielectric layer, wherein a top surface of said planarization dielectric layer is coplanar with a top surface of said disposable gate structure;
recessing said disposable gate structure to form a gate cavity; and
forming a replacement gate stack in said cavity, wherein said replacement gate stack is formed by depositing and patterning a stack including at least a gate dielectric layer, a work function metal layer deposited on said gate dielectric layer, a lower barrier metal layer comprising a metal deposited on said work function metal layer, a metal oxide monolayer comprising an oxide of said metal and contacting said lower barrier metal layer, an upper barrier metal layer contacting said metal oxide monolayer.
2. The method of claim 1 , wherein said lower barrier metal layer is a titanium nitride layer, said metal oxide monolayer is a monolayer of titanium oxide, and said upper barrier metal layer is another titanium nitride layer.
3. The method of claim 2 , wherein said lower barrier metal layer and said upper barrier metal layer are deposited by physical vapor deposition, and said monolayer of titanium oxide is formed by exposing a top surface of said titanium nitride layer to an oxidizing ambient.
4. The method of claim 2 , wherein said lower barrier metal layer has a thickness from 0.5 nm to 5 nm, and said upper barrier metal layer has a thickness from 1 nm to 10 nm.
5. The method of claim 1 , wherein said gate dielectric layer includes a dielectric material having a dielectric constant greater than 8.0, and said work function metal layer includes a metal having a work function that is greater than 4.55 eV.
6. The method of claim 1 , wherein stack further comprises an aluminum-including layer deposited on said upper barrier metal layer at a temperature not greater than 420 degrees Celsius.
7. The method of claim 6 , wherein said aluminum-including layer is deposited at a temperature greater than 380 degrees Celsius.
8. A method of forming a semiconductor structure comprising a field effect transistor, said method comprising:
forming a disposable gate structure on a semiconductor substrate;
forming and planarizing a planarization dielectric layer, wherein a top surface of said planarization dielectric layer is coplanar with a top surface of said disposable gate structure;
recessing said disposable gate structure to form a gate cavity; and
forming a replacement gate stack in said cavity, wherein said replacement gate stack is formed by depositing and patterning a stack including, from bottom to top, a gate dielectric layer, a work function metal layer, at least one barrier metal layer, and an aluminum-including layer, wherein said aluminum layer is deposited at a temperature not greater than 420 degrees Celsius, wherein said at least one barrier metal layer includes a lower barrier metal layer comprising a metal, a metal oxide monolayer comprising an oxide of said metal, and an upper barrier metal layer.
9. The method of claim 8 , wherein said aluminum-including layer is deposited at a temperature greater than 380 degrees Celsius.
10. The method of claim 8 , wherein said aluminum-containing layer includes at least 98% of aluminum in atomic concentration.
11. The method of claim 8 , wherein said aluminum-containing layer is deposited by physical vapor deposition in vacuum environment.
12. The method of claim 8 , wherein said gate dielectric layer includes a dielectric material having a dielectric constant greater than 8.0, and said work function metal layer includes a metal having a work function that is greater than 4.55 eV.
13. The method of claim 8 , wherein said lower barrier metal layer is a titanium nitride layer, said metal oxide monolayer is a monolayer of titanium oxide, and said upper barrier metal layer is another titanium nitride layer.
14. The method of claim 13 , wherein said lower barrier metal layer and said upper barrier metal layer are deposited by physical vapor deposition, and said monolayer of titanium oxide is formed by exposing a top surface of said titanium nitride layer to an oxidizing ambient.
15. A method of forming a semiconductor structure comprising a field effect transistor, said method comprising:
forming a disposable gate structure on a semiconductor substrate;
forming and planarizing a planarization dielectric layer, wherein a top surface of said planarization dielectric layer is coplanar with a top surface of said disposable gate structure;
recessing said disposable gate structure to form a gate cavity; and
forming a replacement gate stack in said cavity, wherein said replacement gate stack is formed by depositing and patterning a stack including at least a gate dielectric layer, a lower barrier metal layer comprising a metal, a metal oxide monolayer comprising an oxide of said metal and contacting said lower barrier metal layer, an upper barrier metal layer contacting said metal oxide monolayer, wherein said lower barrier metal layer is a titanium nitride layer, said metal oxide monolayer is a monolayer of titanium oxide, and said upper barrier metal layer is another titanium nitride layer.
16. The method of claim 15 , wherein said lower barrier metal layer and said upper barrier metal layer are deposited by physical vapor deposition, and said monolayer of titanium oxide is formed by exposing a top surface of said titanium nitride layer to an oxidizing ambient.