Methods for fabrication of an air gap-containing interconnect structure
Methods for producing air gap-containing metal-insulator interconnect structures for VLSI and ULSI devices using a photo-patternable low k material as well as the air gap-containing interconnect structure that is formed are disclosed. More particularly, the methods described herein provide interconnect structures built in a photo-patternable low k material in which air gaps are defined by photolithography in the photo-patternable low k material. In the methods of the present invention, no etch step is required to form the air gaps. Since no etch step is required in forming the air gaps within the photo-patternable low k material, the methods disclosed in this invention provide highly reliable interconnect structures.
1. A method of forming an air-gap containing interconnect structure comprising:
providing a photo-patternable low k (PPLK) material atop a substrate;
forming at least one gap within said PPLK material, wherein said forming the at least one gap comprises directly subjecting at least one predetermined portion of said PPLK material to irradiation to form at least one exposed PPLK region and at least one non-exposed PPLK region in said PPLK material and removing the at least one exposed PPLK region or the at least one non-exposed PPLK region utilizing a developer solution;
curing the PPLK material, wherein prior to curing the PPLK material, a plurality of conductive structures are formed into portions of the PPLK material by first providing a plurality of openings in the PPLK material, filling each of the plurality of openings provided in the PPLK material with a conductive material and then performing a planarization process to provide a structure in which the uppermost surface of each conductive structure is coplanar with an uppermost surface of the PPLK material; and
forming a dielectric cap atop the cured PPLK material and atop the at least one gap forming at least one air gap within the cured PPLK material.
2. The method of claim 1 wherein said plurality of conductive structures are formed within said PPLK material prior to forming the at least one gap.
3. The method of claim 1 wherein said plurality of conductive structures are formed within said PPLK material after forming the at least one gap.
4. The method of claim 1 wherein said irradiation comprises a light source.
5. The method of claim 1 wherein said curing includes a thermal cure, an electron beam cure, an UV cure, an ion beam cure, a plasma cure, a microwave cure or any combinations thereof.
6. The method of claim 1 wherein said curing includes a combination of thermal curing and UV curing, said UV curing is performed using a wavelength of light from 50 nm to 300 nm and the light source for UV curing is a UV lamp, an excimer laser or combinations thereof.
7. The method of claim 1 wherein an antireflective coating is located between the PPLK material and the substrate.
8. The method of claim 1 wherein a low k dielectric material is located between the PPLK material and the substrate.
9. The method of claim 1 wherein said forming the at least one gap further comprises performing an isotropic etching process after said removing said at least one exposed PPLK region or said at least one non-exposed PPLK region.
10. The method of claim 1 wherein said forming the at least one gap provides a plurality of gaps each having a same or different depth.
11. The method of claim 1 wherein a positive or negative PPLK material is employed.
12. A method of forming an air gap containing interconnect structure comprising:
providing a photo-patternable low k (PPLK) material atop a substrate;
forming a plurality of conductively filled openings within said PPLK material, wherein said plurality of conductively filled openings are formed by providing a plurality of openings within the PPLK material, filling each of said plurality of openings provided in the PPLK material with a conductive material and then performing a planarization process to provide a structure in which the uppermost surface of each conductively filled opening is coplanar with an uppermost surface of the PPLK material;
forming at least one gap within said PPLK material between preselected neighboring said conductively filled openings, wherein said forming the at least one gap comprises directly subjecting at least one predetermined portion of said PPLK material to irradiation to form at least one exposed PPLK region and at least one non-exposed PPLK region in said PPLK material and removing the at least one exposed PPLK region or the at least one non-exposed PPLK region utilizing a developer solution;
curing the PPLK material, wherein said curing occurs after both said plurality of conductively filled openings and said at least one gap are formed within the PPLK material; and
forming a dielectric cap atop the cured PPLK material and atop the at least one gap forming at least one air gap within the cured PPLK material.
13. The method of claim 12 wherein said irradiation comprises a light source.
14. The method of claim 12 wherein said curing includes a thermal cure, an electron beam cure, an UV cure, an ion beam cure, a plasma cure, a microwave cure or any combinations thereof.
15. A method of forming an air gap containing interconnect structure comprising:
providing a photo-patternable low k (PPLK) material atop a substrate;
forming at least one gap within said PPLK material, wherein said forming the at least one gap comprises directly subjecting at least one predetermined portion of said PPLK material to irradiation to form at least one exposed PPLK region and at least one non-exposed PPLK region in said PPLK material and removing the at least one exposed PPLK region or the at least one non-exposed PPLK region utilizing a developer solution;
forming a plurality of conductively filled openings within said PPLK material, wherein said at least one gap is positioned between at least one pair of neighboring said conductively filled openings and wherein said plurality of conductively filled openings are formed by providing a plurality of openings within the PPLK material, filling each of said plurality of openings provided in the PPLK material with a conductive material and then performing a planarization process to provide a structure in which the uppermost surface of each conductively filled opening and an uppermost portion of each gap are coplanar with an uppermost surface of the PPLK material;
curing the PPLK material, wherein said curing occurs after both said plurality of conductively filled openings and said at least one gap are formed within the PPLK material; and
forming a dielectric cap atop the cured PPLK material and atop the at least one gap forming at least one air gap within the cured PPLK material.
16. The method of claim 15 wherein said irradiation comprises a light source.
17. The method of claim 15 wherein said curing includes a thermal cure, an electron beam cure, an UV cure, an ion beam cure, a plasma cure, a microwave cure or any combinations thereof.