High capacitance trench capacitor
A dual node dielectric trench capacitor includes a stack of layers formed in a trench. The stack of layers include, from bottom to top, a first conductive layer, a first node dielectric layer, a second conductive layer, a second node dielectric layer, and a third conductive layer. The dual node dielectric trench capacitor includes two back-to-back capacitors, which include a first capacitor and a second capacitor. The first capacitor includes the first conductive layer, the first node dielectric layer, the second conductive layer, and the second capacitor includes the second conductive layer, the second node dielectric layer, and the third conductive layer. The dual node dielectric trench capacitor can provide about twice the capacitance of a trench capacitor employing a single node dielectric layer having a comparable composition and thickness as the first and second node dielectric layers.
1. A method of forming a structure including a capacitor structure, said method comprising:
forming a trench in a substrate;
forming a first conductive layer contiguously contacting a bottom surface and sidewalls of said trench;
forming a first node dielectric layer contiguously contacting sidewalls of said first conductive layer;
forming a second conductive layer contiguously contacting sidewalls of said first node dielectric layer;
forming a second node dielectric layer contiguously contacting sidewalls of said second conductive layer;
forming a third conductive layer contiguously contacting sidewalls of said second node dielectric layer; and
patterning a stack of said first conductive layer, said first node dielectric layer, said second conductive layer, said second node dielectric layer, and said third conductive layer, wherein remaining portions of said first conductive layer, said first node dielectric layer, said second conductive layer, said second node dielectric layer, and said third conductive layer collectively form a capacitor structure, wherein sidewalls of said first conductive layer, said first node dielectric layer, said second conductive layer, said second node dielectric layer, and said third conductive layer are vertically coincident with one another after said patterning of said stack.
2. The method of claim 1 , further comprising forming a contact via structure that contacts remaining portions of first conductive layer and said third conductive layer after said patterning, wherein said contact via structure is electrically isolated from said second conductive layer.
3. A method of forming a structure including a capacitor structure, said method comprising:
forming a trench in a substrate;
forming a first conductive layer contiguously contacting a bottom surface and sidewalls of said trench;
forming a first node dielectric layer contiguously contacting sidewalls of said first conductive layer;
forming a second conductive layer contiguously contacting sidewalls of said first node dielectric layer;
forming a second node dielectric layer contiguously contacting sidewalls of said second conductive layer;
forming a third conductive layer contiguously contacting sidewalls of said second node dielectric layer;
forming a via cavity that extends through said first conductive layer, said first node dielectric layer, said second conductive layer, said second node dielectric layer, and said third conductive layer;
patterning a stack of said first conductive layer, said first node dielectric layer, said second conductive layer, said second node dielectric layer, and said third conductive layer, wherein remaining portions of said first conductive layer, said first node dielectric layer, said second conductive layer, said second node dielectric layer, and said third conductive layer collectively form a capacitor structure;
laterally removing a material of said second conductive layer selective to materials of said first conductive layer and said third conductive layer, and
forming a contact via structure that contacts remaining portions of first conductive layer and said third conductive layer after said patterning, wherein said contact via structure is formed by filling said via cavity with a conductive material and is electrically isolated from said second conductive layer.
4. The method of claim 1 , further comprising:
forming a first contact via structure that contacts a top surface of said third conductive layer and laterally surrounded by a first dielectric spacer;
forming a second contact via structure that contacts a top surface of said second conductive layer and laterally spaced from said third conductive layer by a second dielectric spacer; and
forming a third contact via structure that contacts a top surface of said first conductive layer and laterally spaced from said second conductive layer and said third conductive layer by a third dielectric spacer.
5. The method of claim 1 , further comprising forming a metal-semiconductor-alloy region in said substrate, wherein said metal-semiconductor alloy region contacts a peripheral bottom surface of said first conductive layer.
6. A method of forming a structure including a capacitor structure, said method comprising:
forming a trench in a substrate;
forming a first conductive layer contiguously contacting a bottom surface and sidewalls of said trench;
forming a first node dielectric layer contiguously contacting sidewalls of said first conductive layer;
forming a second conductive layer contiguously contacting sidewalls of said first node dielectric layer;
forming a second node dielectric layer contiguously contacting sidewalls of said second conductive layer;
forming a third conductive layer contiguously contacting sidewalls of said second node dielectric layer;
forming at least one first-type via cavity and at least one second-type via cavity through horizontal portions of said first conductive layer, said first node dielectric layer, said second conductive layer, said second node dielectric layer, and said third conductive layer; and
patterning a stack of said first conductive layer, said first node dielectric layer, said second conductive layer, said second node dielectric layer, and said third conductive layer, wherein remaining portions of said first conductive layer, said first node dielectric layer, said second conductive layer, said second node dielectric layer, and said third conductive layer collectively form a capacitor structure.
7. The method of claim 6 , further comprising recessing a bottom surface of said at least one first-type via cavity or said at least one second-type via cavity below a topmost surface of said substrate.
8. The method of claim 6 , further comprising:
covering said at least one first-type via cavity with a patterned photoresist material, while physically exposing said at least one second-type via cavity; and
performing an etch that removes a conductive material of said second conductive layer selective to conductive materials of said first and third conductive layers from within said at least one second-type via cavity.
9. The method of claim 8 , wherein said etch is selective to dielectric materials of said first and second node dielectric layers.
10. The method of claim 8 , wherein said etch forms a peripheral cavity that is contiguous with one of said at least one second-type via cavity in each laterally recessed portion of said second conductive layer.
11. The method of claim 8 , further comprising:
cover said at least one second-type via cavity with another patterned photoresist material, while physically exposing said at least one first-type via cavity; and
performing another etch that removes said conductive materials of said first and third conductive layers selective to said conductive material of said second conductive layer within the at least one first-type via cavity.
12. The method of claim 11 , wherein said another etch is selective to dielectric materials of said first and second node dielectric layers.
13. The method of claim 11 , wherein said another etch forms a peripheral cavity that is contiguous with one of said at least one second-type via cavity in each laterally recessed portion of said first and third conductive layers.
14. The method of claim 6 , further comprising:
laterally recessing a sidewall of said second conductive layer relative to sidewalls of said first and third conductive layers in said at least one first-type via cavity; and
laterally recessing other sidewalls of said first and third conductive layers relative another sidewall of said second conducive layer in said at least one second-type via cavity.
15. The method of claim 14 , further comprising depositing a conductive liner in said at least one first-type via cavity and said at least one second-type via cavity.
16. The method of claim 15 , wherein said conductive liner is deposited by a non-conformal method, and does not contact said second conductive layer in said at least one first-type via cavity, and does not contact said first and third conductive layers in said at least one second-type via cavity.
17. The method of claim 14 , further comprising:
forming a contact-level dielectric layer over said third conductive layer, wherein said at least one first-type via cavity and said at least one second-type via cavity are formed through said contact-level dielectric layer;
depositing a conductive fill material in said at least one first-type via cavity and said at least one second-type via cavity; and
removing said conductive fill material from above a top surface of said contact-level dielectric layer.
18. The method of claim 1 , further comprising patterning said third conductive layer after said patterning of said stack, wherein a remaining portion of said third conductive layer includes sidewalls that are laterally offset from said sidewalls of said first conductive layer, said first node dielectric layer, said second conductive layer, and said second node dielectric layer.
19. The method of claim 1 , further comprising:
forming a contact-level dielectric layer over said patterned stack of said first conductive layer, said first node dielectric layer, said second conductive layer, said second node dielectric layer, and said third conductive layer;
forming via cavities having different depths through said contact-level dielectric layer, wherein a top surface of said first conductive layer is physically exposed at a bottom of a first-type via cavity, a top surface of said second conductive layer is physically exposed at a bottom surface of a second-type via cavity, and a top surface of said third conductive layer is physically exposed at a bottom surface of a third-type via cavity;
forming a dielectric spacer in each of said first-type via cavity, said second-type via cavity, and said third-type via cavity; and
forming a contact via structure in each of said first-type via cavity, said second-type via cavity, and said third-type contact via cavity.
20. The method of claim 3 , wherein sidewalls of said first conductive layer, said first node dielectric layer, said second conductive layer, said second node dielectric layer, and said third conductive layer are vertically coincident with one another after said patterning of said stack.