Semiconductor plural gate lengths
Gate structures with different gate lengths and methods of manufacture are disclosed. The method includes forming a first gate structure with a first critical dimension, using a pattern of a mask. The method further includes forming a second gate structure with a second critical dimension, different than the first critical dimension of the first gate structure, using the pattern of the mask.
1. A method, comprising:
forming a first gate structure with a first critical dimension, using a pattern of a mask; and
forming a second gate structure with a second critical dimension, different than the first critical dimension of the first gate structure, using the pattern of the mask.
2. The method of claim 1 , wherein the first gate structure comprises a first material and the second gate structure comprises a second material.
3. The method of claim 2 , wherein the first material is amorphous silicon and the second material is polysilicon, which have different etch rates.
4. The method of claim 3 , wherein the first critical dimension is smaller than the second critical dimension due to different etch rates of the first material and the second material.
5. The method of claim 4 , wherein the first critical dimension and the second critical dimension are gate lengths.
6. The method of claim 1 , wherein the forming of the first gate structure and the second gate structure comprise:
forming a first material on a substrate;
blocking a first section of the first material on the substrate with a blocking material;
subjecting an unmasked portion of the first material of a second section to a fabrication process to convert the first material to a second material, which has a different etch rate than the first material;
forming a hardmask over the first material and the second material; and
patterning the hardmask and underlying first material and second material, by subjecting the hardmask, the first material and the second material to a same etching process.
7. The method of claim 6 , wherein the first material forms an undercut or lateral erosion under the patterned hardmask, wherein the undercut has the first critical dimension smaller than the second critical dimension.
8. The method of claim 7 , further comprising replacing the first gate structure and the second gate structure with metal gate material, such that the metal gate material forms a first metal gate with the first critical dimension and a second metal gate with the second critical dimension.
9. The method of claim 7 , wherein the pattern of the hardmask is a same over the first material and the second material.
10. The method of claim 9 , wherein the first material is amorphous silicon and the second material is polysilicon.
11. A method, comprising:
forming amorphous silicon on a substrate;
converting an unmasked portion of the amorphous silicon in a first section to polysilicon; and
patterning the amorphous silicon of a second section and the polysilicon of the first section using a same mask size and pattern, wherein the patterning results in a first critical dimension of the amorphous silicon and a second critical dimension of the polysilicon, wherein the patterning comprises:
forming a hardmask over the amorphous silicon and the polysilicon;
forming a resist pattern on the hardmask to form a uniform pattern; and
etching the hardmask, the amorphous silicon and the polysilicon using a same etchant and same pattern of a mask to form a first gate structure with the first critical dimension and a second gate structure with the second critical dimension.
12. The method of claim 11 , wherein the first critical dimension is smaller than the second critical dimension.
13. The method of claim 11 , wherein the patterning forms a first gate structure comprising the amorphous silicon and a second gate structure comprising the polysilicon.
14. The method of claim 13 , wherein the amorphous silicon and the polyilicon have different etch rates.
15. The method of claim 14 , wherein:
the first critical dimension is smaller than the second critical dimension due to different etch rates of the amorphous silicon and the polysilicon; and
the first critical dimension and the second critical dimension are gate lengths.
16. A method, comprising:
forming amorphous silicon on a substrate;
converting an unmasked portion of the amorphous silicon in a first section to polysilicon; and
patterning the amorphous silicon of a second section and the polysilicon of the first section using a same mask size and pattern, wherein the patterning results in a first critical dimension of the amorphous silicon and a second critical dimension of the polysilicon,
wherein the first critical dimension includes an undercut or lateral erosion under an overlying hardmask that was patterned with the amorphous silicon of the second section.
17. The method of claim 11 , wherein the first gate structure comprises the hardmask and the amorphous silicon with an undercut or lateral erosion and the second gate structure comprises the hardmask and the polysilicon, which is devoid of the undercut or lateral erosion.
18. The method of claim 17 , further comprising replacing the first gate structure and the second gate structure with metal gate material, such that the metal gate material forms a first metal gate with the first critical dimension and a second metal gate with the second critical dimension.