Stacked integrated circuit package system

1. A method or manufacturing a stacked integrated circuit package system comprising:

forming a lead and a die paddle from a lead frame;

forming a first integrated circuit die having an interconnect provided thereon;

placing a second integrated circuit die over the first integrated circuit die and the die paddle;

connecting the second integrated circuit die and the lead; and

molding an encapsulation on the first integrated circuit die and the second integrated circuit die with a portion of the lead and the interconnect exposed from a bottom of the encapsulation for further connection.

2. The method as claimed in claim 1 further comprising mounting the first integrated circuit die on a paddle bottom of the die paddle.

3. The method as claimed in claim 1 wherein forming the lead and the die paddle includes forming a center cavity in the die paddle.

4. The method as claimed in claim 1 further comprising:

attaching a heat slug on a non-active side of the second integrated circuit die; and

encapsulating the heat slug with a slug top surface of the heat slug exposed.

5. The method as claimed in claim 1 wherein:

forming the lead and the die paddle comprises:

forming a center cavity in the die paddle; and further comprising:

attaching a heat slug on a non-active side of the second integrated circuit die, and

encapsulating the heat slug with a slug top surface of the heat slug exposed.

6. A method of manufacturing a stacked integrated circuit package system comprising:

forming a lead and a die paddle from a lead frame;

forming a first integrated circuit die having a first interconnect provided on an active side;

placing a second integrated circuit die over the first integrated circuit die having the active side down and the die paddle;

connecting a second interconnect between the second integrated circuit die and the lead; and

molding an encansulation on the first integrated circuit die and the second integrated circuit die with a portion of the lead and the first interconnect exposed from a bottom of the encapsulation for further connection.

7. The method as claimed in claim 6 wherein connecting the second interconnect between the second integrated circuit die and the lead includes connecting a bond wire between the second integrated circuit die and the lead.

8. The method as claimed in claim 6 wherein:

forming the lead and the die paddle comprises:

forming a center cavity in the die paddle; and

connecting the second interconnect between the second integrated circuit die and the lead comprises:

connecting a bond wire between the second integrated circuit die and the lead.

9. The method as claimed in claim 6 wherein:

connecting the second interconnect between the second integrated circuit die and the lead comprises:

connecting a bond wire between the second integrated circuit die and the lead;

and further comprising:

attaching a heat slug on a non-active side of the second integrated circuit die, and

encapsulating the heat slug with a slug top surface of the heat slug exposed.

10. The method as claimed in claim 6 wherein:

forming the lead and the die paddle comprises:

forming a center cavity in the die paddle;

connecting the second interconnect between the second integrated circuit die and the lead comprises:

connecting a bond wire between the second integrated circuit die and the lead;

and further comprising:

attaching a heat slug on the second integrated circuit die, and

encapsulating the heat slug with a slug top surface of the heat slug exposed.

11. A stacked integrated circuit package system comprising:

a lead;

a die paddle adjacent to the lead;

a first integrated circuit die having an interconnect provided thereon;

a second integrated circuit die over the first integrated circuit die and the die paddle;

the second integrated circuit die connected to the lead; and

an encapsulation to cover the first integrated circuit die and the second integrated circuit die with a portion of the lead and the interconnect exposed from a bottom of the encapsulation.

12. The system as claimed in claim 11 further comprising the first integrated circuit die on a paddle bottom of the die paddle.

13. The system as claimed in claim 11 wherein the die paddle adjacent to the lead includes a center cavity in the die paddle.

14. The system as claimed in claim 11 further comprising:

a heat slug on a non-active side of the second integrated circuit die; and

the encapsulation to cover the heat slug with a slug top surface of the heat slug exposed.

15. The system as claimed in claim 11 wherein:

the die paddle adjacent to the lead comprises:

forming a center cavity in the die paddle; and further comprising:

a heat slug on a non-active side of the second integrated circuit die, and

the encapsulation to cover the heat slug with a slug top surface of the heat slug exposed.

16. The system as claimed in claim 11 wherein:

the lead has an inner lead;

the die paddle adjacent to the lead has an adhesive thereon;

the first integrated circuit die having the first interconnect provided on an active side has a solder interconnect;

the second integrated circuit die over the first integrated circuit die with the active side down and the die paddle has a second interconnect;

the second integrated circuit die connected to the lead with the second interconnect; and

the encapsulation is a cover of the first integrated circuit die and the second integrated circuit die with the portion of the lead and the first interconnect exposed from the bottom of the encapsulation includes the encapsulation covers the second interconnect.

17. The system as claimed in claim 16 wherein the second interconnect is a bond wire between the second integrated circuit die and the lead.

18. The system as claimed in claim 16 wherein:

the die paddle adjacent to the lead comprises:

a center cavity in the die paddle; and

the second interconnect further comprises:

a bond wire between the second integrated circuit die and the lead.

19. The system as claimed in claim 16 wherein:

the second interconnect comprises:

a bond wire between the second integrated circuit die and the lead; and further comprising:

a heat slug on a non-active side of the second integrated circuit die, and

the encapsulation to cover the heat slug with a slug top surface of the heat slug exposed.

20. The system as claimed in claim 16 wherein:

the die paddle adjacent to the lead comprises:

a center cavity in the die paddle;

the second interconnect comprises:

a bond wire between the second integrated circuit die and the lead; and further comprising:

a heat slug on the second integrated circuit die, and

the encapsulation to cover the heat slug with a slug top surface of the heat slug exposed.