Double sidewall image transfer process
Methodology enabling a generation of fins having a variable fin pitch less than 40 nm, and the resulting device are disclosed. Embodiments include: forming a hardmask on a substrate; providing first and second mandrels on the hardmask; providing a first spacer on each side of each of the first and second mandrels; removing the first and second mandrels; providing, after removal of the first and second mandrels, a second spacer on each side of each of the first spacers; and removing the first spacers.
1. A device comprising:
a substrate;
a first fin in the substrate;
a second fin in the substrate being separated from the first fin by a first distance;
a third fin in the substrate being separated from the second fin by a second distance, and being separated from the first fin by the second fin, wherein the first and second distances are different; and
a fourth fin in the substrate separated from the third fin by the first distance, the fourth fin being separated from the second fin by the third fin,
wherein the fins have a variable fin pitch less than 40 nm.
2. The device according to claim 1 , wherein the first distance is less than the second distance.
3. The device according to claim 1 , comprising:
a fifth fin in the substrate separated from the fourth fin by a third distance, the fifth fin being separated from the third fin by the fourth fin;
a sixth fin in the substrate separated from the fifth fin by the first distance, the sixth fin being separated from the fourth fin by the fifth fin;
a seventh fin in the substrate separated from the sixth fin by the second distance, the seventh fin being separated from the fifth fin by the sixth fin; and
an eighth fin in the substrate separated from the seventh fin by the first distance, the eighth fin being separated from the sixth fin by the seventh fin.
4. The device according to claim 3 , wherein the first, second, and third distances are different.
5. The device according to claim 3 , comprising:
a first pull-down (PD) transistor, in the substrate, wherein the first fin is formed on the first PD transistor;
a first pass-gate (PG) transistor, in the substrate, wherein the first fin is formed on the first PG transistor;
a first pull-up (PU) transistor, in the substrate, wherein the second fin is formed on the first PU transistor;
a second PU transistor, in the substrate, wherein the third fin is formed on the second PU transistor;
a second PG transistor, in the substrate, wherein the fourth fin is formed on the second PG transistor; and
a second PD transistor, in the substrate, wherein the fourth fin is formed on the second PD transistor.
6. The device according to claim 3 , comprising:
a first PD transistor, in the substrate, wherein the first, second, and third fins are formed on the first PD transistor;
a first PG transistor, in the substrate, wherein the first and second fins are formed on the first PG transistor;
a first PU transistor, in the substrate, wherein the fourth fin is formed on the first PU transistor;
a second PU transistor, in the substrate, wherein the fifth fin is formed on the second PU transistor;
a second PG transistor, in the substrate, wherein the seventh and eighth fins are formed on the second PG transistor; and
a second PD transistor, in the substrate, wherein the sixth, seventh, and eighth fins are formed on the second PD transistor.
7. The device according to claim 3 , comprising:
a first PD transistor, in the substrate, wherein the first and second fins are formed on the first PD transistor;
a first PG transistor, in the substrate, wherein the first and second fins are formed on the first PG transistor;
a first PU transistor, in the substrate, wherein the third fin is formed on the first PU transistor;
a second PU transistor, in the substrate, wherein the sixth fin is formed on the second PU transistor;
a second PG transistor, in the substrate, wherein the seventh and eighth fins are formed on the second PG transistor; and
a second PD transistor, in the substrate, wherein the seventh and eighth fins are formed on the second PD transistor.
8. The device according to claim 7 , wherein the fourth fin is formed on the first PU transistor and the fifth fin is formed on the second PU transistor.
9. A device comprising:
a substrate;
a first fin in the substrate;
a second fin in the substrate being separated from the first fin by a first distance;
a third fin in the substrate being separated from the second fin by a second distance, and being separated from the first fin by the second fin, wherein the first and second distances are different, and the first distance is less than the second distance; and
a fourth fin in the substrate separated from the third fin by the first distance, the fourth fin being separated from the second fin by the third fin,
wherein the fins have a variable fin pitch less than 40 nm.
10. The device according to claim 9 , comprising:
a fifth fin in the substrate separated from the fourth fin by a third distance, the fifth fin being separated from the third fin by the fourth fin;
a sixth fin in the substrate separated from the fifth fin by the first distance, the sixth fin being separated from the fourth fin by the fifth fin;
a seventh fin in the substrate separated from the sixth fin by the second distance, the seventh fin being separated from the fifth fin by the sixth fin; and
an eighth fin in the substrate separated from the seventh fin by the first distance, the eighth fin being separated from the sixth fin by the seventh fin.
11. The device according to claim 10 , wherein the first, second, and third distances are different.
12. The device according to claim 10 , comprising:
a first pull-down (PD) transistor, in the substrate, wherein the first fin is formed on the first PD transistor;
a first pass-gate (PG) transistor, in the substrate, wherein the first fin is formed on the first PG transistor;
a first pull-up (PU) transistor, in the substrate, wherein the second fin is formed on the first PU transistor;
a second PU transistor, in the substrate, wherein the third fin is formed on the second PU transistor;
a second PG transistor, in the substrate, wherein the fourth fin is formed on the second PG transistor; and
a second PD transistor, in the substrate, wherein the fourth fin is formed on the second PD transistor.
13. The device according to claim 10 , comprising:
a first PD transistor, in the substrate, wherein the first, second, and third fins are formed on the first PD transistor;
a first PG transistor, in the substrate, wherein the first and second fins are formed on the first PG transistor;
a first PU transistor, in the substrate, wherein the fourth fin is formed on the first PU transistor;
a second PU transistor, in the substrate, wherein the fifth fin is formed on the second PU transistor;
a second PG transistor, in the substrate, wherein the seventh and eighth fins are formed on the second PG transistor; and
a second PD transistor, in the substrate, wherein the sixth, seventh, and eighth fins are formed on the second PD transistor.
14. The device according to claim 10 , comprising:
a first PD transistor, in the substrate, wherein the first and second fins are formed on the first PD transistor;
a first PG transistor, in the substrate, wherein the first and second fins are formed on the first PG transistor;
a first PU transistor, in the substrate, wherein the third fin is formed on the first PU transistor;
a second PU transistor, in the substrate, wherein the sixth fin is formed on the second PU transistor;
a second PG transistor, in the substrate, wherein the seventh and eighth fins are formed on the second PG transistor; and
a second PD transistor, in the substrate, wherein the seventh and eighth fins are formed on the second PD transistor.
15. The device according to claim 14 , wherein the fourth fin is formed on the first PU transistor and the fifth fin is formed on the second PU transistor.
16. A device comprising:
a substrate;
a first fin in the substrate;
a second fin in the substrate being separated from the first fin by a first distance;
a third fin in the substrate being separated from the second fin by a second distance, and being separated from the first fin by the second fin, wherein the first and second distances are different;
a fourth fin in the substrate separated from the third fin by the first distance, the fourth fin being separated from the second fin by the third fin;
a fifth fin in the substrate separated from the fourth fin by a third distance, the fifth fin being separated from the third fin by the fourth fin;
a sixth fin in the substrate separated from the fifth fin by the first distance, the sixth fin being separated from the fourth fin by the fifth fin;
a seventh fin in the substrate separated from the sixth fin by the second distance, the seventh fin being separated from the fifth fin by the sixth fin; and
an eighth fin in the substrate separated from the seventh fin by the first distance, the eighth fin being separated from the sixth fin by the seventh fin,
wherein the fins have a variable fin pitch less than 40 nm.
17. The device according to claim 16 , comprising:
a first pull-down (PD) transistor, in the substrate, wherein the first fin is formed on the first PD transistor;
a first pass-gate (PG) transistor, in the substrate, wherein the first fin is formed on the first PG transistor;
a first pull-up (PU) transistor, in the substrate, wherein the second fin is formed on the first PU transistor;
a second PU transistor, in the substrate, wherein the third fin is formed on the second PU transistor;
a second PG transistor, in the substrate, wherein the fourth fin is formed on the second PG transistor; and
a second PD transistor, in the substrate, wherein the fourth fin is formed on the second PD transistor.