LED package and method of the same
A method of LED package includes: forming a P-type through-hole and a N-type through-hole through a substrate; forming a conductive material on the sidewall of said P-type through-hole and N-type through-hole; forming a reflective layer on an upper surface of said substrate; aligning a P-type pad and a N-type pad with said P-type through-hole and said N-type through-hole, respectively, said P-type pad and N-type pad being formed on a first surface of a LED die, wherein said LED die is formed on said upper surface of said substrate; forming electrical connection from said P-type pad and said N-type pad by a copper refilling material within said P-type through-hole and said N-type through-hole; and a P-type terminal pad which positioned under said substrate electrically coupled to said P-type pad via said copper refilling material within said P-type through-hole, and a N-type terminal pad which positioned under said substrate electrically coupled to said N-type pad via said copper refilling material within said N-type through-hole.
1. A method of LED package comprising:
forming a P-type through-hole and a N-type through-hole through a substrate;
forming a conductive material on the sidewall of said P-type through-hole and N-type through-hole;
forming a reflective layer on an upper surface of said substrate;
aligning a P-type pad and a N-type pad with said P-type through-hole and said N-type through-hole, respectively, said P-type pad and N-type pad being formed on a first surface of a LED die with respectively different pre-determined heights, wherein said LED die is formed on said upper surface of said substrate;
forming electrical connections from said P-type pad and said N-type pad by a copper refilling material within said P-type through-hole and said N-type through-hole; and
a P-type terminal pad which is positioned under said substrate electrically coupled to said P-type pad via said copper refilling material within said P-type through-hole, and a N-type terminal pad which is positioned under said substrate electrically coupled to said N-type pad via said copper refilling material within said N-type through-hole.
2. The method of LED package of claim 1 , further comprising a lens formed over said upper surface of said substrate.
3. The method of LED package of claim 1 , said conductive material comprises silver, gold or aluminum.
4. The method of LED package of claim 1 , further comprising an active area terminal pad under said substrate and coupled to an active area of said LED device.
5. The method of LED structure of claim 1 , further comprising a transparent adhesive layer formed on said reflective layer.
6. The method of LED package of claim 5 , wherein said reflective layer is formed by sputtering, or Electro-plating Ag, Al or Au.
7. The method of LED package of claim 1 , wherein said LED die includes sapphire substrate without reflection layer inside said LED die.
8. The method of LED package of claim 7 , wherein a phosphor material is formed on a second surface of said LED die including the sidewall of said LED die, wherein said first surface is different from said second surface.
9. The method of LED package of claim 1 , wherein a finish material on said surface of said terminal pad is formed by Ni/Au.