IP Library Granted Patent US 9,147,439
Granted Patent B2
US 9,147,439 · App. 13/840,759 · Granted Sep 29, 2015

Non-volatile memory having 3D array architecture with staircase word lines and vertical bit lines and methods thereof

Inventors: Raul Adrian Cernea (Santa Clara, CA); George Samachisa (San Jose, CA)
Assignee: SANDISK 3D LLC
G11C5/025G06F12/0238G11C5/06G11C7/18G11C13/0002G11C13/0007G11C13/0023H01L21/76877H01L27/1052H01L27/249H01L27/2454G11C2213/71H01L45/08H01L45/146H01L45/16
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Quick Facts
Patent No.
US 9,147,439
App. No.
13/840,759
Granted
Sep 29, 2015
Kind
B2
Abstract

In a 3D nonvolatile memory with memory elements arranged in a three-dimensional pattern defined by rectangular coordinates having x, y and z-directions and with a plurality of parallel planes from a bottom plane to a top plane stacked in the z-direction over a semiconductor substrate; a plurality of local bit lines elongated in the z-direction through the plurality of layers and arranged in a two-dimensional rectangular array of bit line pillars having rows in the x-direction and columns in the y-direction; the 3D nonvolatile memory further having a plurality of staircase word lines spaced apart in the y-direction and between and separated from the plurality of bit line pillars at a plurality of crossings, individual staircase word lines each having a series of alternating steps and risers elongated respectively in the x-direction and z-direction traversing across the plurality of planes in the z-direction with a segment in each plane.

Claims (56)

1. A non-volatile memory, comprising:

memory elements arranged in a three-dimensional pattern defined by rectangular coordinates having x, y and z-directions and with a plurality of parallel planes from a bottom plane to a top plane stacked in the z-direction over a semiconductor substrate;

a plurality of local bit lines elongated in the z-direction through the plurality of parallel planes and arranged in a two-dimensional rectangular array of bit line pillars having rows in the x-direction and columns in the y-direction;

a plurality of staircase word lines spaced apart in the y-direction and between and separated from the plurality of bit line pillars at a plurality of crossings, each individual staircase word lines of the said plurality of staircase word lines having a series of alternating steps and risers elongated respectively in the x-direction and z-direction traversing across the plurality of planes in the z-direction with a segment in each plane; and

a plurality of non-volatile re-programmable memory elements individually connected through circuits between the bit line pillars and the staircase word lines adjacent the crossings thereof.

2. The non-volatile memory as in claim 1 , wherein:

adjacent staircase word lines of said plurality of staircase word lines are staggered and spaced apart in the x-direction by a predetermined offset.

3. The non-volatile memory as in claim 2 , wherein:

said predetermined offset is a spacing between two bit line pillars of the row of bit line pillars.

4. The non-volatile memory as in claim 2 , wherein:

said predetermined offset is half of a spacing between two bit line pillars of the row of bit line pillars.

5. The non-volatile memory as in claim 1 , wherein:

each segment of the staircase word line crosses a segment of bit line pillars; and

the segment of staircase word line has at least one riser raising the segment prior to crossing a last one of the bit line pillars in the segment.

6. The non-volatile memory as in claim 1 , wherein:

each segment of the staircase word line crosses a segment of bit line pillars; and

the segment of staircase word line has a riser after crossing each of the bit line pillars in the segment.

7. The non-volatile memory as in claim 1 , further comprising

an associated word line driver above the top plane connected to each staircase word line.

8. The non-volatile memory as in claim 7 , wherein:

the associated word line driver has a size along the x-direction fitting within a segment.

9. The non-volatile memory as in claim 1 , further comprising

an associated word line driver below the bottom plane connected to each staircase word line.

10. The non-volatile memory as in claim 9 , wherein:

the associated word line driver has a size along the x-direction fitting within a segment.

11. The non-volatile memory as in claim 1 , further comprising

a plurality of global conductive lines in the y-direction; and

a row of pillar select devices in the x-direction below a selected row of bit line pillar in the x-direction arranged to switch the selected row of bit line pillars to corresponding global conductive lines in the y-direction.

12. The non-volatile memory as in claim 1 , wherein:

said plurality of non-volatile re-programmable memory elements each has a resistance that reversibly shift in value in response to a voltage applied to or current passed through each memory element.

13. A method of operating a non-volatile memory, comprising:

providing memory elements arranged in a three-dimensional pattern defined by rectangular coordinates having x, y and z-directions and with a plurality of parallel planes stacked in the z-direction over a semiconductor substrate;

providing a plurality of local bit lines elongated in the z-direction through the plurality of parallel planes and arranged in a two-dimensional rectangular array of bit line pillars having rows in the x-direction and columns in the y-direction;

providing a plurality of staircase word lines spaced apart in the y-direction and between and separated from the plurality of bit line pillars at a plurality of crossings, each individual staircase word lines of the said plurality of staircase word lines having a series of alternating steps and risers elongated respectively in the x-direction and z-direction traversing across the plurality of planes in the z-direction with a segment in each plane;

providing a plurality of non-volatile re-programmable memory elements individually connected through circuits between the bit line pillars and the staircase word lines adjacent the crossings thereof; and

wherein voltages are applied through the plurality of local bit lines and the plurality of staircase word lines to effect memory operations on a selected group of non-volatile re-programmable memory elements.

14. The method as in claim 13 , wherein:

adjacent staircase word lines of said plurality of staircase word lines are staggered and spaced apart in the x-direction by a predetermined offset.

15. The method as in claim 14 , wherein:

said predetermined offset is a spacing between two bit line pillars of the row of bit line pillars.

16. The method as in claim 14 , wherein:

said predetermined offset is half of a spacing between two bit line pillars of the row of bit line pillars.

17. The method as in claim 13 , wherein:

each segment of the staircase word line crosses a segment of bit line pillars; and

the segment of staircase word line has at least one riser raising the segment prior to crossing a last one of the bit line pillars in the segment.

18. The method as in claim 13 , wherein:

each segment of the staircase word line crosses a segment of bit line pillars; and

the segment of staircase word line has a riser after crossing each of the bit line pillars in the segment.

19. The method as in claim 13 , further comprising

an associated word line driver above the top plane connected to each staircase word line.

20. The method as in claim 19 , wherein:

the associated word line driver has a size along the x-direction fitting within a segment.

21. The method as in claim 13 , further comprising

an associated word line driver below the bottom plane connected to each staircase word line.

22. The method as in claim 21 , wherein:

the associated word line driver has a size along the x-direction fitting within a segment.

Assignments (7)
PARTIAL RELEASE OF SECURITY INTERESTS Recorded Apr 25, 2025
From: JPMORGAN CHASE BANK, N.A., AS AGENT
To: SANDISK TECHNOLOGIES, INC.
Reel/Frame 071382/0001 →
SECURITY AGREEMENT Recorded Apr 25, 2025
From: SANDISK TECHNOLOGIES, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 071050/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 31, 2024
From: SANDISK TECHNOLOGIES LLC
To: SANDISK TECHNOLOGIES, INC.
Reel/Frame 069796/0423 →
CHANGE OF NAME Recorded May 25, 2016
From: SANDISK TECHNOLOGIES INC
To: SANDISK TECHNOLOGIES LLC
Reel/Frame 038807/0898 →
CORRECTIVE ASSIGNMENT TO CORRECT THE INCORRECT LISTED PATENT NUMBER 8853569 TO THE CORRECT PATENT NUMBER 8883569 PREVIOUSLY RECORDED ON REEL 038300 FRAME 0665. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT. Recorded Apr 25, 2016
From: SANDISK 3D LLC
To: SANDISK TECHNOLOGIES INC.
Reel/Frame 038520/0552 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 30, 2016
From: SANDISK 3D LLC.
To: SANDISK TECHNOLOGIES INC.
Reel/Frame 038300/0665 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 12, 2013
From: CERNEA, RAUL ADRIAN; SAMACHISA, GEORGE
To: SANDISK 3D LLC
Reel/Frame 030598/0023 →
Continuity (4)
Provisional Application 61660490 · Jun 15, 2012
Provisional Application 61705766 · Sep 26, 2012
Provisional Application 61747837 · Dec 31, 2012
Related Publication 20130336038A1 · Dec 19, 2013