Sidewall image transfer with a spin-on hardmask
Semiconductor devices and sidewall image transfer methods with a spin on hardmask. Methods for forming fins include forming a trench through a stack of layers that includes a top and bottom insulator layer, and a layer to be patterned on a substrate; isotropically etching the top and bottom insulator layers; forming a hardmask material in the trench to the level of the bottom insulator layer; isotropically etching the top insulator layer; and etching the bottom insulator layer and the layer to be patterned down to the substrate to form fins from the layer to be patterned.
1. A method for forming fins, comprising:
forming a trench through a stack of layers that includes a top and bottom insulator layer, and a layer to be patterned on a substrate;
isotropically etching the top and bottom insulator layers;
forming a hardmask material in the trench to the level of the bottom insulator layer;
isotropically etching the top insulator layer;
etching the bottom insulator layer and the layer to be patterned down to the substrate to form fins from the layer to be patterned;
forming a hardmask material in the trench to the level of the layer to be patterned; and
repeating both of said steps of forming hardmask material in the trench and both of said steps of isotropically etching until a predetermined number of fins have been formed.
2. The method of claim 1 , wherein etching the bottom insulator layer and the layer to be patterned comprises anisotropically etching said layers in regions defined by the hardmask material and the top insulator layer.
3. The method of claim 1 , further comprising forming a hardmask material in the trench to the level of the layer to be patterned.
4. The method of claim 3 , further comprising repeating said steps of forming hardmask material and isotropically etching until a predetermined number of fins have been formed.
5. The method of claim 1 , wherein the top insulator layer is formed with a thickness greater than twice an isotropic etch depth for each set of fins to be produced.
6. The method of claim 1 , wherein forming the trench comprises lithographically forming a trench in a lithographic mask layer on the top insulator layer.
7. The method of claim 1 , wherein isotropically etching an insulator layer in both of said isotropic etching steps comprises performing a chemical oxide removal that removes an equal amount of insulator material from every exposed surface of the insulator layer.
8. The method of claim 1 , wherein forming the hardmask material comprises spinning the hardmask material on and etching until the hardmask material reaches a specific level.
9. The method of claim 8 , wherein the hardmask material comprises hafnium oxide and etching the hardmask material uses a SiF6/02 plasma.
10. A method for forming fins, comprising:
forming a trench through a stack of layers that includes a top and bottom insulator layer, and a layer to be patterned on a substrate;
forming a hardmask material in the trench to the level of the layer to be patterned;
isotropically etching the top and bottom insulator layers;
forming a hardmask material in the trench to the level of the bottom insulator layer;
isotropically etching the top insulator layer;
etching the bottom insulator layer and the layer to be patterned down to the substrate to form fins from the layer to be patterned; and
repeating both of said steps of forming hardmask material and both of said steps of isotropically etching until a predetermined number of fins have been formed.
11. The method of claim 10 , wherein etching the bottom insulator layer and the layer to be patterned comprises anisotropically etching said layers in regions defined by the hardmask material and the top insulator layer.
12. The method of claim 10 , wherein the top insulator layer is formed with a thickness greater than twice an isotropic etch depth for each set of fins to be produced.
13. The method of claim 10 , wherein forming the trench comprises lithographically forming a trench in a lithographic mask layer on the top insulator layer.
14. The method of claim 10 , wherein isotropically etching an insulator layer in both of said isotropic etching steps comprises performing a chemical oxide removal that removes an equal amount of insulator material from every exposed surface of the insulator layer.
15. The method of claim 10 , wherein each step of forming the hardmask material comprises spinning the hardmask material on and etching until the hardmask material reaches a specific level.
16. The method of claim 15 , wherein the hardmask material comprises hafnium oxide and etching the hardmask material uses a SiF6/02 plasma.