Semiconductor device and method of providing z-interconnect conductive pillars with inner polymer core
A semiconductor device is made by providing a sacrificial substrate and depositing an adhesive layer over the sacrificial substrate. A first conductive layer is formed over the adhesive layer. A polymer pillar is formed over the first conductive layer. A second conductive layer is formed over the polymer pillar to create a conductive pillar with inner polymer core. A semiconductor die or component is mounted over the substrate. An encapsulant is deposited over the semiconductor die or component and around the conductive pillar. A first interconnect structure is formed over a first side of the encapsulant. The first interconnect structure is electrically connected to the conductive pillar. The sacrificial substrate and adhesive layers are removed. A second interconnect structure is formed over a second side of the encapsulant opposite the first interconnect structure. The second interconnect structure is electrically connected to the conductive pillar.
1. A method of making a semiconductor device, comprising:
providing a first conductive layer;
forming a plurality of polymer pillars over the first conductive layer;
forming a second conductive layer over the polymer pillars to form a plurality of conductive z-interconnect structures; and
disposing a semiconductor die between the conductive z-interconnect structures and contacting the first conductive layer.
2. The method of claim 1 , further including forming a first interconnect structure over the conductive z-interconnect structures.
3. The method of claim 2 , further including forming a second interconnect structure over the conductive z-interconnect structures opposite the first interconnect structure.
4. The method of claim 1 , further including:
depositing an encapsulant around the conductive z-interconnect structures; and
forming a build-up interconnect layer over a surface of the encapsulant and electrically connected to the conductive z-interconnect structures.
5. The method of claim 4 , further including forming an integrated passive device in the build-up interconnect layer.
6. The method of claim 5 , further including configuring the integrated passive device to operate as a capacitor, resistor, or inductor.
7. A method of making a semiconductor device, comprising:
providing a conductive layer;
forming a first conductive z-interconnect structure and second conductive z-interconnect structure each in contact with the conductive layer and including an inner polymer core within the first conductive z-interconnect structure and second conductive z-interconnect structure; and
disposing a semiconductor die between the first conductive z-interconnect structure and second conductive z-interconnect structure and contacting the conductive layer.
8. The method of claim 7 , further including forming the inner polymer core in a prolate spheroid shape.
9. The method of claim 7 , further including:
depositing an encapsulant around the first conductive z-interconnect structure and second conductive z-interconnect structure; and
forming a build-up interconnect layer over a surface of the encapsulant and electrically connected to the first conductive z-interconnect structure and second conductive z-interconnect structure.
10. The method of claim 9 , further including forming an integrated passive device in the build-up interconnect layer.
11. The method of claim 10 , further including configuring the integrated passive device to operate as a capacitor, resistor, or inductor.
12. A semiconductor device, comprising:
a conductive layer;
a plurality of conductive z-interconnect structures including an inner polymer core formed over the conductive layer; and
a semiconductor die disposed between the conductive z-interconnect structures and contacting the conductive layer.
13. The semiconductor device of claim 12 , wherein the inner polymer core includes a prolate spheroid shape.
14. The semiconductor device of claim 12 , further including:
an encapsulant deposited around the conductive z-interconnect structures; and
a build-up interconnect layer formed over a surface of the encapsulant and electrically connected to the conductive z-interconnect structures.
15. The semiconductor device of claim 14 , further including an integrated passive device formed in the build-up interconnect layer.
16. The semiconductor device of claim 15 , wherein the integrated passive device is configured to operate as a capacitor, resistor or inductor.
17. A semiconductor device, comprising:
a conductive layer;
a first conductive z-interconnect structure including a first inner polymer core formed in contact with the conductive layer;
a second conductive z-interconnect structure including a second inner polymer core formed in contact with the conductive layer; and
a semiconductor die disposed between the first conductive z-interconnect structure and second conductive z-interconnect structure and contacting the conductive layer.
18. The semiconductor device of claim 17 , wherein the first inner polymer core includes a prolate spheroid shape.
19. The semiconductor device of claim 17 , further including:
an encapsulant deposited around the first conductive z-interconnect structure and second conductive z-interconnect structure; and
a build-up interconnect layer formed over a surface of the encapsulant and electrically connected to the first conductive z-interconnect structure and second conductive z-interconnect structure.
20. The semiconductor device of claim 19 , further including an integrated passive device formed in the build-up interconnect layer.